NASA NTRS · 20060035827
CSP/BGA Board level Reliability
Abstract
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
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Ghaffarian, R.. 1998-03-01. CSP/BGA Board level Reliability. https://ntrs.nasa.gov/citations/20060035827
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