NASA NTRS · 20210001173
Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications
Abstract
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Explore related subjects
Keep this discovery
Explore connections, maps & timelines
Ghaffarian, R.. 1998-03-21. Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications. https://ntrs.nasa.gov/citations/20210001173
Cite the original work for its findings. Save a collection to share your selection of sources.