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DOE OSTI · 1068843

Maintainable substrate carrier for electroplating

Chen, Chen-An·Abas, Emmanuel Chua·Divino, Edmundo Anida·Ermita, Jake Randal G·Capulong, Jose Francisco S·Castillo, Arnold Villamor·Ma·Xiaobing, Diana
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Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

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Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma, Xiaobing, Diana. 2012-07-17. Maintainable substrate carrier for electroplating. https://www.osti.gov/biblio/1068843

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