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DOE OSTI · 1444072

Flexible packaging for microelectronic devices

Anderson, Benjamin John·Nielson, Gregory N.·Cruz-Campa, Jose Luis·Okandan, Murat·Lentine, Anthony L.·Resnick, Paul J.
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Abstract

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

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Anderson, Benjamin John, Nielson, Gregory N., Cruz-Campa, Jose Luis, Okandan, Murat, Lentine, Anthony L., Resnick, Paul J.. 2018-05-22. Flexible packaging for microelectronic devices. https://www.osti.gov/biblio/1444072

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