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DOE OSTI · 1495213

Vertically integrated optoelectronics package for MEMS devices

Homeijer, Brian D.·Eichenfield, Matt
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Abstract

The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.

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BibTeXRIS

Homeijer, Brian D., Eichenfield, Matt. 2018-11-27. Vertically integrated optoelectronics package for MEMS devices. https://www.osti.gov/biblio/1495213

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