DOE OSTI · 1663319
Copper Conductivity Model Validation Method Using Flyer Plate Experiments and Simulations.
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Riford, Lauren Stephanie, Lemke, Raymond W, Cochrane, Kyle Robert. 2013-08-01. Copper Conductivity Model Validation Method Using Flyer Plate Experiments and Simulations.. https://www.osti.gov/biblio/1663319
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