DOE OSTI · 1665797
Guest Editorial: Special Issue on InterPACK 2019 - Part 1
Abstract
This is a collection of papers drawn from the 2019 ASME InterPACK Conference. The content spans the areas of heterogeneous integration, servers, flexible and wearable electronics, photonics, power electronics, energy storage, and autonomous and electric vehicles.
Explore related subjects
Keep this discovery
Explore connections, maps & timelines
Narumanchi, Sreekant (ORCID:0000000153376069), Choi, Sukwon, Karajgikar, Saket, Sun, Haiding, Zhang, Guangsheng. 2020-08-14. Guest Editorial: Special Issue on InterPACK 2019 - Part 1. https://doi.org/10.1115/1.4048039
Cite the original work for its findings. Save a collection to share your selection of sources.