Acoustic Wafer Defect Detection System

Abstract

Researchers at Los Alamos have developed the Acoustic Wafer Defect Detection System, a technology that enables rapid diagnosis of critical defects during wafer production. This technology is capable of both efficient and accurate detection of defects in wafers, including defects that are undetectable through current optical techniques. The system identifies the wafer defects by exciting resonant vibrations in the wafers and by exciting “crack breathing” modes. These vibrations cause the crack to periodically open and close. Specific resonance characteristics, combined with acoustic signatures resulting from crack breathing, result in a technique that is highly sensitive to cracked wafers. There are minimal custom parts used to build the system, and it can be easily implemented in nearly any wafer production plant with minimal modifications. We are seeking a commercialization partner to license the technology or partner through a Cooperative Research and Development Agreement (CRADA) to develop into a usable product for commercial purposes.