Ultrasound preliminary cyber-physical evaluation

Abstract

In this assessment, we focused on identifying unwanted RF emissions from the subject devices. This consisted of two major approaches: 1) Monitor for emitted RF during operation and ensure it is within expected bounds. 2) Inspect circuit board construction for any geometry or design patterns that could lead to RF emissions, whether intentional or unintentional. These patterns include: a) Single-ended PCB traces that could operate as an antenna. b) Insufficient shielding around typically “noisy” components such as switching power supplies. c) Free-hanging high-speed signal wires with no shielding that could emit RF. Suspicious components and design patterns were given a plausible reason to be included in the design. Any suspicious components or patterns warranted reason for deeper investigation. After more in-depth analysis no components were found to be intentionally malicious or had unexpected functionality.