DOE OSTI · 2496293
Final Technical Report: High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Rapid Prototyping with Embedded Printed Components
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Zinn, Alfred. 2026-12-15. Final Technical Report: High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Rapid Prototyping with Embedded Printed Components. https://www.osti.gov/biblio/2496293
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