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DOE OSTI · 2569385

Device- and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report)

Joshi, Yogendra [Georgia Institute of Technology, Atlanta, GA (United States)]·Graham, Samuel [Univ. of Maryland, College Park, MD (United States)]·Kumar, Satish [Georgia Institute of Technology, Atlanta, GA (United States)]
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Abstract

Final Technical ReportThis project aimed to research, develop, and test electric traction drive system technology for use in vehicle applications that are capable of meeting the targets set by the Department of Energy Vehicle Technologies Office. The project is categorized into three major thrusts: Bonding interfaces for packaging, thermal management of electric vehicle (EV) power inverters, and electric motor thermal management. Device- and System-Level Thermal Packaging for Electric-Drive Technologies project aimed to develop, analyze, and validate transformative approaches in thermal management and packaging for power electronics and electric motor systems, with the ultimate goal of enhancing power density, efficiency, and reliability in electrified transportation platforms.

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Joshi, Yogendra [Georgia Institute of Technology, Atlanta, GA (United States)], Graham, Samuel [Univ. of Maryland, College Park, MD (United States)], Kumar, Satish [Georgia Institute of Technology, Atlanta, GA (United States)]. 2025-06-14. Device- and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report). https://doi.org/10.2172/2569385

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