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DOE OSTI · 3625658

Design of a Cryogenic Assembly for Comparing Qubit Infrared Packaging Inefficiencies

Mailliard, Robert J. [Fermilab] (ORCID:0009000027704129)·Temples, Dylan J. [Fermilab]
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Abstract

It is well known that everything emits infrared (IR) light in the form of thermal radiation. IR radiation on superconducting qubits carries enough energy to cause decoherence and so-called “quasiparticle poisoning.” Therefore, proper IR shielding is needed to keep the qubit in a high coherence state. However, trying to extract IR-specific information from a qubit is difficult, so a microwave kinetic inductance detector (MKID) can be used instead. We show that the IR shielding inefficiencies of MKID packages can only be compared with other packaging inefficiencies. We create a cryogenic assembly CAD design, consisting of magnetic shield cans, a copper mounting plate and mounts, and an MKID enclosure, which thermalizes the assembly to dilution refrigerator temperatures. Phase 1 of this design involves using a narrowband IR laser source to test the IR shielding of packaging at the laser’s wavelength. When the best IR shielding packaging is determined, the superconducting qubit can replace the MKID, allowing the qubit to avoid decoherence due to IR radiation and boost its performance and coherence lifetime.

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Mailliard, Robert J. [Fermilab] (ORCID:0009000027704129), Temples, Dylan J. [Fermilab]. 2026-08-31. Design of a Cryogenic Assembly for Comparing Qubit Infrared Packaging Inefficiencies. https://doi.org/10.2172/3625658

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