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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Survey of electronics capability for SP-100 space reactor power system applications

Because of reports indicating improvements in the radiation tolerance of some electronic parts, a survey was recently performed by SP-100 project personnel to determine the advisability of revising SP-100 SRPS (space reactor power systems) allowable neutron and gamma dose rates in order to reduce the size and mass of the radiation shield and thereby achieve system mass reductions. The survey results indicate that recent developments to increase the radiation tolerance of a limited set of electronics parts do not justify increasing the allowable SP-100 dose rates for electronic components. Specifically, the recent improvements on a limited set of parts do not justify increasing the current SP-100 allowable specifications of 5 x 10 exp 5 rads gamma dose and 1 x 10 exp 13 neutrons/sq cm fluence. However, if the improvements of 108 rads for gammas and 10 exp 15 neutrons/sq cm can be extended to a wide range of parts, significant mass savings would result.

Manvi, Ram↗
NASA NTRS1999

Integrated Advanced Microwave Sounding Unit-A (AMSU-A). As-Designed Parts List: Electrical, Electronic and Electromechanical (EEE) As-Designed Parts List

This report comprises the Electrical, Electronic, and Electromechanical (EEE) As Designed Parts List to be used in the Integrated Advanced Microwave Sounding Unit-A (AMSU-A) instrument. The purpose of the EEE As-Designed Parts List is to provide a listing of EEE parts identified for use on the Integrated AMSU-A. All EEE parts used on the AMSU-A must meet the parts control requirements as defined in the Parts Control Plan (POP). All part applications are reviewed by the Parts Control Board (PCB) and granted approval if POP requirements are met. The "As Designed Parts Lists" indicates PCB approval status, and thus also serves as the Program Approved Parts List.

Lorenz, E.↗
NASA NTRS1994

Experiment K-7-18: Effects of Spaceflight in the Muscle Adductor Longus of Rats Flown in the Soviet Biosatellite Cosmos 2044: A Study Employing Neural Cell Adhesion Molecules (N-CAM) Immunocytochemistry and Conventional Morphological Techniques (Light and Electron Microscopy) - Part 1

The effects of spaceflight upon the 'slow' muscle adductor longus was examined in rats flown in the Soviet Biosatellite COSMOS 2044. Three groups - synchronous, vivarium and basal served as controls. The techniques employed included standard methods for light microscopy, N-CAM immunocytochemistry and electron microscopy. Light microscopic observations revealed myofiber atrophy, contraction bands and segmental necrosis accompanied by cellular infiltrates composed of macrophages, leucocytes and mononuclear cells. N-CAM immunoreactivity was seen (N-CAM-IR) on the myofiber surface, satellite cells and in regenerating myofibers reminiscent of myotubes. Ultrastructural alterations included Z band streaming, disorganization of myofibrillar architecture, sarcoplasmic degradation, extensive segmental necrosis with preservation of the basement membrane, degenerative phenomena of the capillary endothelium and cellular invasion of necrotic areas. Regenerating myofibers were identified by the presence of increased amounts of ribosomal aggregates and chains of polyribosomes associated with myofilaments that displayed varied distributive patterns. The principal electron microscopic changes of the neuromuscular junctions consisted of a decrease or absence of synaptic vesicles, degeneration of axon terminals, increased number of microtubules, vacant axonal spaces and axonal sprouting. The present observations indicate that major alterations such as myofibrillar disruption and necrosis, muscle regeneration and denervation and synaptic remodeling at the level of the neuromuscular junction may take place during spaceflight.

Daunton, N. G.↗
NASA NTRS2017

Evaluation of Fast Switching Diode 1N4448 Over a Wide Temperature Range

Electronic parts used in the design of power systems geared for space applications are often exposed to extreme temperatures and thermal cycling. Limited data exist on the performance and reliability of commercial-off-the-shelf (COTS) electronic parts at temperatures beyond the manufacturers specified operating temperature range. This report summarizes preliminary results obtained on the evaluation of automotive-grade, fast switching diodes over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these diodes and to determine suitability for use outside their recommended temperature limits.

Thermal Cycling↗
NASA NTRS2019

Standardizing Microprocessor and GPU Radiation Test Approaches

Microprocessor, Graphics Processing Units (GPUs) and DDRx memory devices have emerged as promising next-generation technologies that enables both high performance processing and acceleration of complex algorithms for the latest challenges in human spaceflight, autonomous vehicles and artificial intelligence (AI). The feature sets of these devices offer exponential increases to throughput, calculation capability and system autonomy when compared to legacy flight systems. NASA's Electronic Part and Packaging (NEPP) Program has conducted an investigation into the radiation susceptibility of leading edge devices and process technologies by establishing standardized test approaches. Unlike most discrete devices, these require state of the art test systems to induce specific hardware activity similar to application software, thus allowing the characterization of failure modes within the system. To best characterize the tested part, NEPP eliminates variables that may impact device performance under radiation. Simplification of remaining system-level variables leads to an improved understanding of complex computational devices and their intended applications. The failure modes and error signatures that are recorded during testing are used to determine radiation sensitivity of the semiconductor process and the microcode architecture of the design. This presentation will discuss the test methodology that NASA Electronic Parts and Packaging (NEPP) is working to establish for its microprocessor, GPU and DDRx memory test programs to provide guidance on these devices and their underlying technology, in regards to their potential usage in future space flight systems.

GPU↗
NASA NTRS2009

Operation of SOI P-Channel Field Effect Transistors, CHT-PMOS30, under Extreme Temperatures

Electronic systems are required to operate under extreme temperatures in NASA planetary exploration and deep space missions. Electronics on-board spacecraft must also tolerate thermal cycling between extreme temperatures. Thermal management means are usually included in today s spacecraft systems to provide adequate temperature for proper operation of the electronics. These measures, which may include heating elements, heat pipes, radiators, etc., however add to the complexity in the design of the system, increases its cost and weight, and affects its performance and reliability. Electronic parts and circuits capable of withstanding and operating under extreme temperatures would reflect in improvement in system s efficiency, reducing cost, and improving overall reliability. Semiconductor chips based on silicon-on-insulator (SOI) technology are designed mainly for high temperature applications and find extensive use in terrestrial well-logging fields. Their inherent design offers advantages over silicon devices in terms of reduced leakage currents, less power consumption, faster switching speeds, and good radiation tolerance. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. Experimental investigation on the operation of SOI, N-channel field effect transistors under wide temperature range was reported earlier [1]. This work examines the performance of P-channel devices of these SOI transistors. The electronic part investigated in this work comprised of a Cissoid s CHT-PMOS30, high temperature P-channel MOSFET (metal-oxide semiconductor field-effect transistor) device [2]. This high voltage, medium-power transistor is designed for geothermal well logging applications, aerospace and avionics, and automotive industry, and is specified for operation in the temperature range of -55 C to +225 C. Table I shows some specifications of this transistor [2]. The CHT-PMOS30 device was characterized at various temperatures over the range of -190 C to +225 C in terms of its voltage/current characteristic curves. The test temperatures included +22, -50, -100, -150, -175, -190, +50, +100, +150, +175, +200, and +225 C. Limited thermal cycling testing was also performed on the device. These tests consisted of subjecting the transistor to a total of twelve thermal cycles between -190 C and +225 C. A temperature rate of change of 10 C/min and a soak time at the test temperature of 10 minutes were used throughout this work. Post-cycling measurements were also performed at selected temperatures. In addition, re-start capability at extreme temperatures, i.e. power switched on while the device was soaking for a period of 20 minutes at the test temperatures of -190 C and +225 C, was investigated.

Patterson, Richard↗
NASA NTRS2019

Overview of Developments in Voluntary Consensus Standards for Counterfeit Parts Avoidance

The presentation provides an introduction to the electronic parts supply chain and various standards used for preventing counterfeit parts. The presentation provides detailed instruction on various non-destructive techniques, destructive and analytical steps for inspecting suspect counterfeit parts. The techniques are based on the AS6171 Aerospace Standard which standardizes the test and inspection procedures, workmanship criteria, and minimum training and certification requirements to detect counterfeit electrical, electronic, and electromechanical parts. Also included are discussions of other inspection, sampling and distribution standards.

Sood, Bhanu↗
NASA NTRS1982

Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part E: Electronics module data

Tests to verify the as-designed performance of all circuits within the thematic mapper electronics module unit are described. Specifically, the tests involved the evaluation of the scan line corrector driver, shutter drivers function, cal lamp controller function, post amplifier function, command decoder verification unit, and the temperature and actuator controllers function.

Source record↗
NASA NTRS2002

Radiation Hardness Assurance for Space Systems

The space radiation environment can lead to extremely harsh operating conditions for on-board electronic box and systems. The characteristics of the radiation environment are highly dependent on the type of mission (date, duration and orbit). Radiation accelerates the aging of the electronic parts and material and can lead to a degradation of electrical performance; it can also create transient phenomena on parts. Such damage at the part level can induce damage or functional failure at electronic box, subsystem, and system levels. A rigorous methodology is needed to ensure that the radiation environment does not compromise the functionality and performance of the electronics during the system life. This methodology is called hardness assurance. It consists of those activities undertaken to ensure that the electronic piece parts placed in the space system perform to their design specifications after exposure to the space environment. It deals with system requirements, environmental definitions, part selection, part testing, shielding and radiation tolerant design. All these elements should play together in order to produce a system tolerant to.the radiation environment. An overview of the different steps of a space system hardness assurance program is given in section 2. In order to define the mission radiation specifications and compare these requirements to radiation test data, a detailed knowledge of the space environment and the corresponding electronic device failure mechanisms is required. The presentation by J. Mazur deals with the Earth space radiation environment as well as the internal environment of a spacecraft. The presentation by J. Schwank deals with ionization effects, and the presentation by T. Weatherford deals with Single particle Event Phenomena (SEP) in semiconductor devices and microcircuits. These three presentations provide more detailed background to complement the sections 3 and 4. Part selection and categorization are discussed in section 5. Section 6 presents the organization of the hardness assurance within a project. Section 7 discusses emerging radiation hardness assurance issues.

Poivey, Christian↗
NASA NTRS2020

Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions

The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.

Commercial-Off-The-Shelf↗
NASA NTRS2014

Advanced CMOS Radiation Effects Testing and Analysis

Presentation at the annual NASA Electronic Parts and Packaging (NEPP) Program Electronic Technology Workshop (ETW). The material includes an update of progress in this NEPP task area over the past year, which includes testing, evaluation, and analysis of radiation effects data on the IBM 32 nm silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) process. The testing was conducted using test vehicles supplied by directly by IBM.

cmos↗
NASA NTRS2015

Complex Parts, Complex Data: Why You Need to Understand What Radiation Single Event Testing Data Does and Doesn't Show and the Implications Thereof

Electronic parts (integrated circuits) have grown in complexity such that determining all failure modes and risks from single particle event testing is impossible. In this presentation, the authors will present why this is so and provide some realism on what this means. Its all about understanding actual risks and not making assumptions.

NASA Electronic Parts and Packaging (NEPP) Program↗
NASA NTRS2005

Experiences issues with plastic parts at cold temperatures

Missions to MARS/planets/asteroids require electronic parts to operate and survive at extreme cold conditions. At extreme cold temperatures many types of cold related failures can occur. Office 514 is currently evaluating plastic parts under various cold temperature conditions and applications. Evaluations, screens, and qualifications are conducted on flight parts.

cold temperatures↗
NASA NTRS1983

An analysis of the asymmetric part of electron-electron Boltzmann integral

A numerical analysis of the asymmetric part of electon-electron collision integral is presented. The results are given in the form of graphs for two commonly considered plasma situations: the collision-dominated case (symmetric part of electron disribution is Maxwellian) and the field-dominated case (symmetric part of electron distribution is Druyvesteynian). The importance of the asymmetric part of e-e collision integral in the Boltzmann equation is also discussed.

Kunc, J. A.↗
NASA NTRS2016

Challenges with Electrical, Electronics, and Electromechanical Parts for James Webb Space Telescope

James Webb Space Telescope (JWST) is the space-based observatory that will extend the knowledge gained by the Hubble Space Telescope (HST). Hubble focuses on optical and ultraviolet wavelengths while JWST focuses on the infrared portion of the electromagnetic spectrum, to see the earliest stars and galaxies that formed in the Universe and to look deep into nearby dust clouds to study the formation of stars and planets. JWST, which commenced creation in 1996, is scheduled to launch in 2018. It includes a suite of four instruments, the spacecraft bus, optical telescope element, Integrated Science Instrument Module (ISIM, the platform to hold the instruments), and a sunshield. The mass of JWST is approximately 6200 kg, including observatory, on-orbit consumables and launch vehicle adaptor. Many challenges were overcome while providing the electrical and electronic components for the Goddard Space Flight Center hardware builds. Other difficulties encountered included developing components to work at cryogenic temperatures, failures of electronic components during development and flight builds, Integration and Test electronic parts problems, and managing technical issues with international partners. This paper will present the context of JWST from a EEE (electrical, electronic, and electromechanical) perspective with examples of challenges and lessons learned throughout the design, development, and fabrication of JWST in cooperation with our associated partners including the Canadian Space Agency (CSA), the European Space Agency (ESA), Lockheed Martin and their respective associated partners. Technical challenges and lessons learned will be discussed.

EEE Parts↗
NASA NTRS2017

Update on NASA Microelectronics Activities

Mission Statement: The NASA Electronic Parts and Packaging (NEPP) Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test. and usage of EEE parts by NASA as well as in collaboration with other government Agencies and industry. NASA Space Technology Mission Directorate (STMD) "STMD rapidly develops, demonstrates, and infuses revolutionary, high-payoff technologies through transparent, collaborative partnerships, expanding the boundaries of the aerospace enterprise." Mission Statement: The Space Environments Testing Management Office (SETMO) will identify, prioritize, and manage a select suite of Agency key capabilities/assets that are deemed to be essential to the future needs of NASA or the nation, including some capabilities that lack an adequate business base over the budget horizon. NESC mission is to perform value-added independent testing, analysis, and assessments of NASA's high-risk projects to ensure safety and mission success. NASA Space Environments and Avionics Fellows as well as Radiation and EEE Parts Community of Practice (CoP) leads.

NASA Electronic Parts and Packaging (NEPP)↗