Method of evaluating moisture barrier properties of encapsulating materials Patent
Method of evaluating moisture barrier properties of materials used in electronics encapsulation
Ellern, W. B.↗
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Space radiation environmental effects on reactively encapsulated zinc orthotitanates and their paints
Space radiation environmental effects on reactively encapsulated zinc orthotitanates and paints
Ashford, N. A.↗
Protective encapsulation of implantable biotelemetry units
Development of materials for encapsulating electronic devices used in biotelemetry is discussed. Chemical resistance of materials to effects of animal fluids is described. Silicone rubber is recommended as basic material with polymers applied to outer surface for protective coating.
Tombs, N. C.↗
FEP encapsulated N/P silicon solar cells after simulated micrometeoroid exposure.
The effects of simulated micrometeoroid exposure on the performance of N/P silicon solar cells encapsulated for their protection in fluorinated ethylene propylene were determined in a shock tube. It was found that the short-circuit current decreased after exposure to the simulated micrometeoroid particles. The shape of the curve remained the same and was simply translated downward with a concomitant drop in open-circuit voltage.
Mirtich, M. J.↗
Production development of organic nonflammable spacecraft potting, encapsulating and conformal coating compounds. Volume 4: Executive summary
The necessity of having nonflammable versions of potting and encapsulating compounds and conformal coatings for space vehicles is discussed. The formulation, EPOCAST 87517 A/B, was found to have the best balance of thermal, electrical, mechanical, physical, and chemical properties of those evaluated. The requirements which this formulation did not meet are listed, and other formulations which were evaluated are summarized. Recommendations for improving EPOCAST 87517 A/B are included.
Lieberman, S. L.↗
Terrestrial applications of FEP-encapsulated solar cell modules
The NASA-Lewis Research Center program of transferring the FEP-encapsulated solar cell technology developed for the space program to terrestrial applications is presented. The electrical power system design and the array mechanical design are described, and power systems being tested are discussed. The latter are located at NOAA-RAMOS weather stations at Sterling, Va., and Mammoth Mountain, Calif.; on the roof of the Lewis Research Center; on a NOAA-Coast Guard buoy in the Gulf of Mexico; in a U.S. Forest Service mountaintop voice repeater station in the Inyo National Forest, Calif., and in a backpack charger for portable transmitter/receivers being used in the same place. Preliminary results of testing are still incomplete, but show that rime ice can cause cracks in modular cells without damaging the FEP though, which keeps the grid lines intact, and that electrically active elements of the module must be completely sealed from salt water to prevent FEP delamination.
Forestieri, A. F.↗
Integral glass encapsulation for solar arrays
Electrostatic bonding has been used to join silicon solar cells to borosilicate glass without the aid of any organic binders or adhesives. The results of this investigation have been to demonstrate, without question, the feasibility of this process as an encapsulation technique. The potential of ESB for terrestrial solar arrays was clearly shown. The process is fast, reproducible, and produces a permanent bond between glass and silicon that is stronger than the silicon itself. Since this process is a glass sealing technique requiring no organics it makes moisture tight sealing of solar cells possible.
Young, P. R.↗
Feasibility Study of Solar Dome Encapsulation of Photovoltaic Arrays
The technical and economic advantages of using air-supported plastic enclosures to protect flat plate photovoltaic arrays are described. Conceptual designs for a fixed, latitude-tilt array and a fully tracking array were defined. Detailed wind loads and strength analyses were performed for the fixed array. Detailed thermal and power output analyses provided array performance for typical seasonal and extreme temperature conditions. Costs of each design as used in a 200 MWe central power station were defined from manufacturing and material cost estimates. The capital cost and cost of energy for the enclosed fixed-tilt array were lower than for the enclosed tracking array. The enclosed fixed-tilt array capital investment was 38% less, and the levelized bus bar energy cost was 26% less than costs for a conventional, glass-encapsulated array design. The predicted energy cost for the enclosed fixed array was 79 mills/kW-h for direct current delivered to the power conditioning units.
Source record↗
Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays
The results of a study for Task 3 of the Low Cost Solar Array Project, directed toward the development of a cost effective encapsulation system for photovoltaic modules using silicon based materials, are reported. Results of the following are discussed: (1) weather-ometer stressing vs. weathering history of silicon and silicon modified materials; (2) humidity/temperature cycling exposure; (3) exposure at high humidity/high temperature; (4) outdoor exposure stress; (5) thermal cycling stress; and (6) UV screening agents. The plans for the next quarter are outlined.
Source record↗
Feasibility study of silicon nitride protection of plastic encapsulated semiconductors
The application of low temperature silicon nitride protective layers on wire bonded integrated circuits mounted on lead frame assemblies is reported. An evaluation of the mechanical and electrical compatibility of both plasma nitride and photochemical silicon nitride (photonitride) passivations (parallel evaluations) of integrated circuits which were then encapsulated in plastic is described. Photonitride passivation is compatible with all wire bonded lead frame assemblies, with or without initial chip passivation. Plasma nitride passivation of lead frame assemblies is possible only if the chip is passivated before lead frame assembly. The survival rate after the environmental test sequence of devices with a coating of plasma nitride on the chip and a coating of either plasma nitride or photonitride over the assembled device is significantly greater than that of devices assembled with no nitride protective coating over either chip or lead frame.
Peters, J. W.↗
Integral Glass Encapsulation for Solar Arrays
Progress in the development of permanent, integral glass encapsulation of terrestrial solar photovoltaic arrays by electrostatic bonding is reported. Two basic types of electrostatically bonded modules were demonstrated and their reliability proven in accelerated environmental testing. Economic analyses indicate that electrostatic bonding can be a cost effective, practical, and automatable process for large-scale production of arrays with lifetimes of more than 20 years.
Source record↗
Low-cost encapsulation materials for terrestrial solar cell modules
The paper presents the findings of material surveys intended to identify low cost materials which could be functional as encapsulants (by 1986) for terrestrial solar cell modules. Economic analyses have indicated that in order to meet the low cost goal of $2.70 per sq m, some or all of the following material technologies must be developed or advanced: (1) UV screening outer covers; (2) elastomeric acrylics; (3) weatherproofing and waterproofing of structural wood and paper products; (4) transparent UV stabilizers for the UV-sensitive transparent pottants; and (5) cost-effective utilization of silicone and fluorocarbon materials.
Cuddihy, E. F.↗
Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays
A cost effective encapsulant system was identified and a silicone acrylic cover material containing a durable ultraviolet screening agent was prepared. The effectiveness of the cover material in protecting photo-oxidatively sensitive polymers was demonstrated.
Source record↗
Study program for encapsulation materials interface for low cost silicon solar array
An atmospheric corrosion model was developed and verified by five months of corrosion rate and climatology data acquired at the Mead, Nebraska LSA test site. Atmospheric corrosion rate monitors (ACM) show that moisture condensation probability and ionic conduction at the corroding surface or interface are controlling factors in corrosion rate. Protection of the corroding surface by encapsulant was shown by the ACM recordings to be maintained, independent of climatology, over the five months outdoor exposure period. The macroscopic corrosion processes which occur at Mead are shown to be reproduced in the climatology simulator. Controlled experiments with identical moisture and temperature aging cycles show that UV radiation causes corrosion while UV shielding inhibits LSA corrosion.
Kaelble, D. H.↗
Integral glass encapsulation for solar arrays
Electrostatic bonding technology, an encapsulation technique for terrestrial solar array was developed. The process produces full integral, hermetic bonds with no adhesives or pottants. Panels of six solar cells on a simple glass superstrate were produced. Electrostatic bonding for making the cell front contact was also developed. A metal mesh is trapped into contact with the cell front during the bonding process. Six cell panels using the bonded mesh as the only cell front contact were produced. The possibility of using lower cost glass, with a higher thermal expansion mismatch to silicon, by making lower temperature bonds is developed. However, this requires a planar surface cell.
Landis, G. A.↗
Prepolymer Syrup for Encapsulating Solar Cells
Clear polymer syrup, made by disolving n-butyl acrylate prepolymer in monomer, used to encapsulate solar cells by any of three standard processes (dipping, multiple coating, or automated machine coating). Use of cyclohexane instead of methanol/water solvent during initial polymerization stage maintains high molecular weight and raises yield of linear polymer to essentially 100 percent.
Gupta, A.↗
Solar-Cell Encapsulation by One-Step Lamination
Simple method of potting solar cells reduces encapsulating to one-step lamination process. Simplified process saves time and expense. Potting material is added to two inside faces of solar-cell assembly before they are sandwiched and cured.
Sarbolouki, M. N.↗
Investigation of Test Methods, Material Properties, and Processes for Solar Cell Encapsulants
Encapsulant materials and processes for the production of cost effective, long life solar cell modules are identified, and evaluated. Ethylene vinyl acetate lamination pottant studies are conducted with respect to the time/temperature cure requirements for successful use of this compound. The time needed to produce successful gel contents are redetermined at a variety of temperatures and are related to the peroxide half life temperature curve. Formulation of the butyl acrylate syrup casting pottant is complete. The formulation contains an ultraviolet stabilizer system and is cured with an initiator that presents no shipping or handling hazards. The catalyzed syrup is stable at room temperature and has a pot life of at least an eight hour period of time. The syrup cures to a transparent rubber in 18 minutes at a temperature of 60 C.
Willis, P. B.↗