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This document is the final report of the MAUDEE (Mars Upper Atmosphere Dynamics, Energetics, and Evolution) consortium. It describes a low cost Discovery mission to investigate the upper atmosphere of Mars and to understand the manner in which Mars has evolved over geologic time. In keeping with the innovative philosophy permeating the Discovery Program and in order to minimize the burden of reading an extensive prose exposition, a new presentation format has been adopted. The format involves a series of view graphs with facing text. The view graphs form the basis of a complete oral presentation of the MAUDEE mission and the facing text provides more detailed, but still brief, explanatory descriptions. Readers can scan the view graphs and/or read the facing text at their discretion. The oral presentation of this study was given to code SL personnel at NASA Headquarters on February 23, 1994. MAUDEE is an essential component of the Mars Exploration Program. It provides the information required to understand the evolution of the planet via the escape of volatiles. It provides the key measurements needed to understand the upper atmosphere of the last of the three terrestrial planets to be so studied. It connects and supplements investigations based on other Mars missions: Mars Surveyor, Planet-B and Mars-96. The MAUDEE mission plan involves a combination of remote and in-situ sensors, housed in three instrument packages. The sensors make measurements of the atmospheric regions between 60-200 km. These instruments are based on extensive heritage from Earth explorers and Pioneer Venus. The mission scenario has several phases and employs aerobraking maneuvers to lower initial apoapsis, thereby reducing fuel requirements. The spacecraft has body-mounted solar cells, enabling deep diving into the Martian atmosphere. The orbital inclination allows for pole-to-pole latitudinal sweeps in an initial elliptical phase, followed by a circular phase affording detailed diurnal measurements. The nominal mission duration at Mars is one Mars year.
Methods of bulk manufacturing high temperature sensor subassembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub-assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attaching wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.
The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were installed in water-cooled jackets, as shown. This was a severe test because the pressure-sensing chips were exposed to the hot combustion gases. Prior to the installation of the SiC pressure sensors, two high-temperature silicon sensors, installed in the same locations, did not survive a single engine run. The durability of the leadless SiC pressure sensor was demonstrated when both SiC sensors operated properly throughout the two runs that were conducted.
This report describes models of building faults created for OpenStudio to support the ongoing development of fault detection and diagnostic (FDD) algorithms at the National Renewable Energy Laboratory. Building faults are operating abnormalities that degrade building performance, such as using more energy than normal operation, failing to maintain building temperatures according to the thermostat set points, etc. Models of building faults in OpenStudio can be used to estimate fault impacts on building performance and to develop and evaluate FDD algorithms. The aim of the project is to develop fault models of typical heating, ventilating and air conditioning (HVAC) equipment in the United States, and the fault models in this report are grouped as control faults, sensor faults, packaged and split air conditioner faults, water-cooled chiller faults, and other uncategorized faults. The control fault models simulate impacts of inappropriate thermostat control schemes such as an incorrect thermostat set point in unoccupied hours and manual changes of thermostat set point due to extreme outside temperature. Sensor fault models focus on the modeling of sensor biases including economizer relative humidity sensor bias, supply air temperature sensor bias, and water circuit temperature sensor bias. Packaged and split air conditioner fault models simulate refrigerant undercharging, condenser fouling, condenser fan motor efficiency degradation, non-condensable entrainment in refrigerant, and liquid line restriction. Other fault models that are uncategorized include duct fouling, excessive infiltration into the building, and blower and pump motor degradation.
Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.
The moons electrostatic environment requires careful consideration in the development of future lunar landers. Electrostatically charged dust was well documented during the Apollo missions to cause thermal control, mechanical, and visibility issues. The fine dust particles that make up the surface are electrostatically charged as a result of numerous charging mechanisms. The relatively dry conditions on the moon creates a prime tribocharging environment during surface operations. The photoelectric effect is dominant for lunar day static charging, while plasma electrons are the main contributor for lunar night electrostatic effects. Electrostatic charging is also dependent on solar intensity, Earth-moon relative positions, and cosmic ray flux. This leads to a very complex and dynamic electrostatic environment that must be studied for the success of long term lunar missions.In order to better understand the electrostatic environment of planetary bodies, Kennedy Space Center, in previous collaboration with the Jet Propulsion Laboratory, has developed an electrostatic sensor suite. One of the instruments included in this package is the triboelectric sensor array. It is comprised of strategically selected materials that span the triboelectric series and that also have previous spaceflight history. In this presentation, we discuss detailed testing with the triboelectric sensor array performed at Kennedy Space Center. We will discuss potential benefits and use cases of this low mass, low cost sensor package, both for science and for mission success.
University of Pittsburgh’s Transducer lab has teamed with the U.S. Department of Energy’s National Energy Technology Laboratory (DOE NETL) to conduct a comprehensive study to develop/evaluate low-cost, efficient CO 2 measuring technologies for geological sequestration sites leakage monitoring. A passive wireless CO 2 sensing system based on surface acoustic wave technology and carbon nanotube nanocomposite was developed. Surface acoustic wave device was studied to determine the optimum parameters. Delay line structure was adopted as basic sensor structure. CNT polymer nanocomposite was fabricated and tested under different temperature and strain condition for natural environment impact evaluation. Nanocomposite resistance increased for 5 times under pure strain, while the temperature dependence of resistance for CNT solely was -1375ppm/°C. The overall effect of temperature on nanocomposite resistance was -1000ppm/°C. The gas response of the nanocomposite was about 10% resistance increase under pure CO 2 . The sensor frequency change was around 300ppm for pure CO 2 . With paralyne packaging, the sensor frequency change from relative humidity of 0% to 100% at room temperature decreased from over 1000ppm to less than 100ppm. The lowest detection limit of the sensor is 1% gas concentration, with 36ppm frequency change. Wireless module was tested and showed over one foot transmission distance at preferred parallel orientation.
As a result of the Phase I study, we have demonstrated that a mission to a smallbody (asteroid, comet) whose objective is to conduct a seismic experiment to understandthe interior structure, can be accomplished with small (<200 kg) spacecraft launched on asmall launch vehicle (Athena IIc).We modeled the seismic response of a small body and calculated that the energynecessary to propagate through the body and be detected by a seismometer. Thesecalculations provide guidance as to the type of energy source that is required. A simpleenergy source similar to a NASA standard initiator (NSI) can be used, although a singleNSI is insufficient. An NSI is an explosive pyrotechnic that is used to sever connectionson spacecraft. Use of such an energy source has illustrated two additional areas of study -anchoring of the source and sensor to the surface and understanding the efficiency ofenergy propagation from the source into the surface.The spacecraft has the ability to carry and deploy a series of source/sensors toconduct the experiment by placing them on the surface. We identified a suite of candidatenear-Earth asteroids as targets and used one 1991VG as the target to calculate the missiontrajectory and ∆V requirements. Spacecraft and launch vehicle performance are launchthat any of the candidates could be reached with appropriate mass and launch margins.Sources and sensors are deployed from arm attached to the spacecraft. Thespacecraft maneuvers next to the target body and presses the sensor against the surfaceand releases it. After emplacing all of the surface packages, the sensors are monitored fora period of time to measure the seismic noise. Finally, the active seismic experiment isconducted.The work conducted during Phase I demonstrates that a small mission can be designed to conduct an active seismic experiment on a small near-Earth body. Whileother targets may require more performance, the basic architecture is viable for anytarget.We have identified a number of specific technical areas that require more detailed study. Those areas are largely focused on the detailed analysis and design of the source mechanism and anchoring it to the surface. Such topics will be part of a Phase IIproposal.
A review is presented of two-low cost attitude sensors developed with existing technology, but with emphasis directed to reducing the unit costs without compromising reliability or quality. The solar aspect sensor was developed to determine the angle of the sun with respect to the optical axis of the Shuttle Solar Backscatter Ultraviolet (SSBUV) Experiment Package. Using sensor readings updated every five milliseconds, signal processing electronics determine the location of the center of the sun's image on the array. An earth horizon sensor was developed to measure the nadir angle with respect to the optical axis of the SSBUV Experiment Package to an accuracy of + or - 0.5 deg. Operation of each of the sensors is described along with flight results obtained when flown onboard Atlantis as part of the SSBUV Experiment Package.
This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.
The goal of this research program was to develop a high sensitivity, fiber optic, interferometric, three-axis magnetometer for interplanetary spacecraft applications. Dynamics Technology, Inc. (DTI) has successfully integrated a low noise, high bandwidth interferometer with high sensitivity metallic glass transducers. Also, DTI has developed sophisticated signal processing electronics and complete data acquisition, filtering, and display software. The sensor was packaged in a compact, low power and weight unit which facilitates deployment. The magnetic field sensor had subgamma sensitivity and a dynamic range of 10(exp 5) gamma in a 10 Hz bandwidth. Furthermore, the vector instrument exhibited the lowest noise level when only one axis was in operation. A system noise level of 1 gamma rms was observed in a 1 Hz bandwidth. However, with the other two channels operating, the noise level increased by about one order of magnitude. Higher system noise was attributed to cross-channel interference among the dither fields.
NNSA has a need to measure the contact stress over long-term durations with minimal impact on the element of interest. The sensor and package should have a small footprint, thin, flexible, modular, and preferably commercially available. There exists an opportunity to leverage expertise within LLNL in sensor development to provide a minimally invasive contact stress sensing solution for NNSA and potentially external customers.
Readily available temperature sensing in boilers is necessary to improve efficiencies, minimize downtime, and reduce toxic emissions for a power plant. The current techniques are typically deployed as a single-point measurement and are primarily used for detection and prevention of catastrophic events due to the harsh environment. In this work, a multi-point temperature sensor based on wavelength-multiplexed sapphire fiber Bragg gratings (SFBGs) were fabricated via the point-by-point method with a femtosecond laser. The sensor was packaged and calibrated in the lab, including thermally equilibrating at 1200 °C, followed by a 110-h, 1000 °C stability test. After laboratory testing, the sensor system was deployed in both a commercial coal-fired and a gas-fired boiler for 42 days and 48 days, respectively. The performance of the sensor was consistent during the entire test duration, over the course of which it measured temperatures up to 950 °C (with some excursions over 1000 °C), showing the survivability of the sensor in a field environment. The sensor has a demonstrated measurement range from room temperature to 1200 °C, but the maximum temperature limit is expected to be up to 1900 °C, based on previous work with other sapphire based temperature sensors.
The overall objective of the proposed Phase I program was to design, construct and demonstrate a fiber optic sensing system capable of providing temperature and magnetic field measurements with an enhanced spatial resolution that can be implemented over a large surface area (cryomodules) to survey superconducting radio frequency cavities and magnets. A magnetic field sensor capable of detecting fluxes on the order of 1 μT is required to detect the distribution of trapped flux on the cavity surface. A unique distributed magnetic field sensor was successfully designed and constructed to demonstrate the detection of magnetic fluxes less than 500 nT. The sensor leveraged the ultra-high sensitivity of Sentek’s picoDAS to measure the magnetostriction induced vibrations in a commercially available Metglas 2605 SC ribbon that was in physical contact with sensing fiber. Static magnetic fields were detected by applying an alternating current a copper wire proximate to the Metglas 2605SC ribbon to create an AC bias magnetic field. In an alternative approach, an AC bias magnetic field was applied to a special magnetic field sensing fiber with Metglas 2605SC cladding successfully detect a magnetic field flux of a 3 μT. Exhaustive testing was performed to characterize the dependency of sensor response on the direction of the applied magnetic field. Although the special sensing fiber based magnetic field sensor did not exhibit an observable dependence on the direction of the magnetic field, the Metglas 2605SC ribbon sensor exhibited a clear directional dependence. A wide variety of polymer materials were evaluated to enhance the temperature response of an FBG based sensor at cryogenic temperatures. The processing and performance challenges provided the motivation to develop a new simple cryogenic temperature sensor that uses a commercially available fiber optic splice protector. The EVA hot melt tube that becomes adhered to the optical fiber and the polyolefin outer tube that shrinks upon heating in the fusion splicer heater provide the high thermal expansion coefficient necessary to impart a significant strain on the FBG when exposed to cryogenic temperatures. The temperature sensitivity (Δ𝜆𝐵𝑟𝑎𝑔𝑔~ 62 𝑝𝑝𝑚/℃) of the FBG-based sensor was on par with the best reported to date. The simple design, use of readily available cost-effective materials, and well-established processing techniques lends this approach to the creation of hundreds to thousands of temperature sensors on one single optical fiber length. The inherently small form factor also allows for co-location with the distributed magnetic field sensor. In preparation for field testing of the prototype sensing system at the Jefferson Labs in potential Phase II program, several different cable designs were evaluated to package the sensors. The preliminary successful demonstration of fully functional sensing cables provides the foundation for subsequent development efforts to advance the Technology Readiness Level of the technology. The technical feasibility of the proposed approach was successfully demonstrated in this Phase I effort.
Improved in-situ meteorological measurements are needed for monitoring the weather and climate of the terrestrial and Martian atmospheres. We have initiated a program to assess the feasibility and utility of micro-sensors for precise in-situ meteorological measurements in these environments. Sensors are being developed for measuring pressure, temperature, wind velocity, humidity, and aerosol amounts. Silicon micro-machining and large scale integration technologies are being used to make sensors that are small, rugged, lightweight, and require very little power. Our long-term goal is to develop very accurate miniaturized sensors that can be incorporated into complete instrument packages or 'micro weather stations,' and deployed on a variety of platforms. If conventional commercially available silicon production techniques can be used to fabricate these sensor packages, it will eventually be possible to mass-produce them at low cost. For studies of the Earth's troposphere and stratosphere, they could be deployed on aircraft, dropsondes, radiosondes, or autonomous surface stations at remote sites. Improved sensor accuracy and reduced sensor cost are the primary challenges for these applications. For studies of the Martian atmosphere, these sensor packages could be incorporated into the small entry probes and surface landers that are being planned for the Mars Environmental SURvey (MESUR) Mission. That decade-long program will deploy a global network of small stations on the Martian surface for monitoring meteorological and geological processes. Low mass, low power, durability, large dynamic range and calibration stability are the principal challenges for this application. Our progress on each of these sensor types is presented.
In the nuclear industry, many vital components, such as spent fuel storage canisters and nuclear reactor pressure vessels (RPV), are entirely enclosed by metal and surrounded by thick concrete walls that manage the potentially harmful radiation and prevent release to the environment. Due to the casks’ long storage, monitoring temperature, pressure, radiation, humidity, structural health, etc., within these enclosed vessels is crucial to ensure the fuel containment safety and security. In this paper, a self-powered wireless through-wall data communication system for nuclear environments was designed. The whole package includes: a radiation energy harvester with power management; ultrasound wireless communication using high-temperature piezoelectric transducers; electronics modules for harvesting, sensing, and data transmission; and radiation shielding for electronics and sensors. The package is able to harvest tens to hundreds of mW power from a nuclear canister environment directly and provides a path forward for continuous monitoring of the dry cask for 50 years.
The problem of translating the time of occurrence of received Loran-C pulses into a time, referenced to a particular period of occurrence is addressed and applied to the design of a digital word generator for a Loran-C sensor processor package. The digital information from this word generator is processed in a KIM-1 microprocessor system which is based on the MOS 6502 CPU. This final system will consist of a complete time difference sensor processor for determining position information using Loran-C charts. The system consists of the KIM-1 microprocessor module, a 4K RAM memory board, a user interface, and the Loran-C word generator.