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At least 181 records · Page 10

Making Rectangular Apertures In Silicon

Conventional silicon micromachining techniques produce micrometer-sized rectangular apertures. Used to define source and detector openings for measurements of images and scattered light in visible, ultraviolet, and soft x-ray wavelength regions, and as general-purpose optical slits or slit arrays. Rectangular microscopic apertures replace circular pinholes made by puncturing foils with needles or by drilling foils with intense, highly-focused laser beams. Precise photolithography yields apertures of superior geometry.

Leviton, Douglas B.↗

Dual-Element Tunneling Accelerometer

Improved micromachined tunneling accelerometer contains two deflecting transducer elements: One an elastically supported proof mass having relatively low resonant frequency; other cantilever tunneling transducer that tracks displacement of proof mass and has relatively high resonant frequency ({sup a} 10 kHz). Deflection voltage generated by circuit like described in "Wideband Feedback Circuit for Tunneling Sensor" (NPO-18866). Accelerometers of this type suited for underwater acoustic measurements, detecting vibrations associated with malfunctions in vehicles, detecting seismic signals, monitoring and controlling vibrations in structures, and other applications.

Kaiser, William J.↗

Microactuator production via high aspect ratio, high edge acuity metal fabrication technology

LIGA is a procession sequence which uses x-ray lithography on photoresist layers of several hundred micrometers to produce very high edge acuity photopolymer molds. These plastic molds can be converted to metal molds via electroplating of many different metals and alloys. The end results are high edge acuity metal parts with large structural heights. The LIGA process as originally described by W. Ehrfeld can be extended by adding a surface micromachining phase to produce precision metal parts which can be assembled to form three-dimensional micromechanisms. This process, SLIGA, has been used to fabricate a dynamometer on a chip. The instrument has been fully implemented and will be applied to tribology issues, speed-torque characterization of planar magnetic micromotors and a new family of sensors.

Guckel, H.↗

Imaging spectrometry of the Earth and other solar system bodies

Imaging spectrometry is a relatively new tool for remote sensing of the Earth and other bodies of the solar system. The technique dates back to the late 1970's and early 1980's. It is a natural extension of the earlier multi-spectral imagers developed for remote sensing that acquire images in a few, usually broad spectral bands. Imaging spectrometers combine aspects of classical spectrometers and imaging systems, making it possible to acquire literally hundreds of images of an object, each image in a separate, narrow spectral band. It is thus possible to perform spectroscopy on a pixel-by-pixel basis with the data acquired with an imaging spectrometer. Two imaging spectrometers have flown in space and several others are planned for future Earth and planetary missions. The French-built Phobos Infrared Spectrometer (ISM) was part of the payload of the Soviet Mars mission in 1988, and the JPL-built Near Infrared Mapping Spectrometer (NIMS) is currently en route to Jupiter aboard the Galileo spacecraft. Several airborne imaging spectrometers have been built in the past decade including the JPL-built Airborne Visible/Infrared Imaging Spectrometer (AVIRIS) which is the only such sensor that covers the full solar reflected portion of the spectrum in narrow, contiguous spectral bands. NASA plans two imaging spectrometers for its Earth Observing System, the Moderate and the High Resolution Imaging Spectrometers (MODIS and HIRIS). A brief overview of the applications of imaging spectrometry to Earth science will be presented to illustrate the value of the tool to remote sensing and indicate the types of measurements that are required. The system design for AVIRS and a planetary imaging spectrometer will be presented to illustrate the engineering considerations and challenges that must be met in building such instruments. Several key sensor technology areas will be discussed in which miniaturization and/or enhanced performance through micromachining and nanofabrication may allow smaller, more robust, and more capable imaging spectrometers to be built in the future.

Vane, Gregg↗

Macro, mini, micro and nano (M(sup 3)N) technologies for the future

Microelectromechanical systems (MEMS), micro systems technologies (MST), and micromanufacturing are relatively recent phrases or acronyms that have become synonymous with the design, development, and manufacture of 'micro' devices and systems. Micromanufacturing encompasses MEMS or MST and, in addition, includes all of the processes involved in the production of micro things. Integration of mechanical and electrical components, including built-in computers, can be formed into systems which must be connected to the macroworld. Macro, mini, micro, and nano technologies are all a part of MEMS or micromanufacturing. At this point in the development of the technology, it is becoming apparent that mini systems, with micro components, could very well be the economic drivers of the technology for the foreseeable future. Initial research in the fabrication of microdevices using IC processing technology took place over thirty years ago. Anisotropic etching of silicon was used to produce piezoresistive diaphragms. Since the early 60's, there has been gradual progress in MEMS until the early 1980's when worldwide interest in the technology really started to develop. During this time high aspect ratio micromachining using x rays was started in Germany. In 1987 the concept of a 'silicon micromechanics foundry' was proposed. Since then the interest in the U.S., Germany, and Japan has increased to the point where hundreds of millions of dollars of research monies are being funneled into the technology (at least in Germany and Japan) and the technology has been classified as critical or as a technology or national importance by the U.S. government.

Friedrich, Craig R.↗

Micro guidance and control synthesis: New components, architectures, and capabilities

New GN&C (guidance, navigation and control) system capabilities are shown to arise from component innovations that involve the synergistic use of microminiature sensors and actuators, microelectronics, and fiber optics. Micro-GN&C system and component concepts are defined that include micro-actuated adaptive optics, micromachined inertial sensors, fiber-optic data nets and light-power transmission, and VLSI microcomputers. The thesis is advanced that these micro-miniaturization products are capable of having a revolutionary impact on space missions and systems, and that GN&C is the pathfinder micro-technology application that can bring that about.

Mettler, Edward↗

Second International Symposium on Magnetic Suspension Technology, part 1

In order to examine the state of technology of all areas of magnetic suspension and to review related recent developments in sensors and controls approaches, superconducting magnet technology, and design/implementation practices, the Second International Symposium on Magnetic Suspension Technology was held. The symposium included 18 technical sessions in which 44 papers were presented. The technical sessions covered the areas of bearings, bearing modeling, controls, vibration isolation, micromachines, superconductivity, wind tunnel magnetic suspension systems, magnetically levitated trains (MAGLEV), rotating machinery and energy storage, and applications. A list of attendees appears at the end of the document.

Groom, Nelson J.↗

Second International Symposium on Magnetic Suspension Technology, part 2

In order to examine the state of technology of all areas of magnetic suspension and to review related recent developments in sensors and controls approaches, superconducting magnet technology, and design/implementation practices, the 2nd International Symposium on Magnetic Suspension Technology was held at the Westin Hotel in Seattle, WA, on 11-13 Aug. 1993. The symposium included 18 technical sessions in which 44 papers were presented. The technical sessions covered the areas of bearings, bearing modelling, controls, vibration isolation, micromachines, superconductivity, wind tunnel magnetic suspension systems, magnetically levitated trains (MAGLEV), rotating machinery and energy storage, and applications. A list of attendees appears at the end of the document.

Groom, Nelson J.↗

Planar rotational magnetic micromotors with integrated shaft encoder and magnetic rotor levitation

Deep x-ray lithography and electroplating may be combined to form a fabrication tool for micromechanical devices with large structural heights, to 500 micron, and extreme edge acuities, less than 0.1 micron-run-out per 100 micron of height. This process concept which originated in Germany as LIGA may be further extended by adding surface micromachining. This extension permits the fabrication of precision metal and plastic parts which may be assembled into three-dimensional micromechanical components and systems. The processing tool may be used to fabricate devices from ferromagnetic material such as nickel and nickel-iron alloys. These materials when properly heat treated exhibit acceptable magnetic behavior for current to flux conversion and marginal behavior for permanent magnet applications. The tool and materials have been tested via planar, magnetic, rotational micromotor fabrication. Three phase reluctance machines of the 6:4 configuration with 280 micron diameter rotors have been tested and analyzed. Stable rotational speeds to 34,000 rpm with output torques above 10 x 10(exp -9) N-m have been obtained. The behavior is monitored with integrated shaft encoders which are photodiodes which measure the rotor response. Magnetic levitation of the rotor via reluctance forces has been achieved and has reduced frictional torque losses to less than 1 percent of the available torque. The results indicate that high speed limits of these actuators are related to torque ripple. Hysteresis motors with magnetic bearings are under consideration and will produce high speed rotational machines with excellent sensor application potential.

Guckel, Henry↗

Development of microchannel plate x-ray optics

The goal of this research program was to develop a novel technique for focusing x-rays based on the optical system of a lobster's eye. A lobster eye employs many closely packed reflecting surfaces arranged within a spherical or cylindrical shell. These optics have two unique properties: they have unlimited fields of view and can be manufactured via replication of identical structures. Because the angular resolution is given by the ratio of the size of the individual optical elements to the focal length, optical elements with sizes on the order of one hundred microns are required to achieve good angular resolution with a compact telescope. We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron-scale optical elements. This technique, commonly referred to as silicon micromachining, is based on silicon fabrication techniques developed by the microelectronics industry. An anisotropic etchant is a chemical which etches certain silicon crystal planes much more rapidly than others. Using wafers in which the slowly etched crystal planes are aligned perpendicularly to the wafer surface, it is possible to etch a pattern completely through a wafer with very little distortion. Our optics consist of rectangular pores etched completely through group of zone axes (110) oriented silicon wafers. The larger surfaces of the pores (the mirror elements) were aligned with the group of zone axes (111) planes of the crystal perpendicular to the wafer surface. We have succeeded in producing silicon lenses with a geometry suitable for 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x-ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. A significant progress was made in obtaining good optical surface quality. The RMS roughness was decreased from 110 A for our initial lenses to 30 A in the final lenses. A further factor of three improvement in surface quality is required for the production of efficient x-ray optics. In addition to the silicon fabrication, an x-ray beam line was constructed at Columbia for testing the optics.

Kaaret, Philip↗

The development of a solid-state hydrogen sensor for rocket engine leakage detection

Hydrogen propellant leakage poses significant operational problems in the rocket propulsion industry as well as for space exploratory applications. Vigorous efforts have been devoted to minimizing hydrogen leakage in assembly, test, and launch operations related to hydrogen propellant. The objective has been to reduce the operational cost of assembling and maintaining hydrogen delivery systems. Specifically, efforts have been made to develop a hydrogen leak detection system for point-contact measurement. Under the auspices of Lewis Research Center, the Electronics Design Center at Case Western Reserve University, Cleveland, Ohio, has undertaken the development of a point-contact hydrogen gas sensor with potential applications to the hydrogen propellant industry. We envision a sensor array consisting of numbers of discrete hydrogen sensors that can be located in potential leak sites. Silicon-based microfabrication and micromachining techniques are used in the fabrication of these sensor prototypes. Evaluations of the sensor are carried out in-house at Case Western Reserve University as well as at Lewis Research Center and GenCorp Aerojet, Sacramento, California. The hydrogen gas sensor is not only applicable in a hydrogen propulsion system, but also usable in many other civilian and industrial settings. This includes vehicles or facility use, or in the production of hydrogen gas. Dual space and commercial uses of these point-contacted hydrogen sensors are feasible and will directly meet the needs and objectives of NASA as well as various industrial segments.

Liu, Chung-Chiun↗

Development of microchannel plate x-ray optics

The goal of this research program was to develop a novel technique for focusing x-rays based on the optical system of a lobster's eye. A lobster eye employs many closely packed reflecting surfaces arranged within a spherical or cylindrical shell. These optics have two unique properties: they have unlimited fields of view and can be manufactured via replication of identical structures. Because the angular resolution is given by the ratio of the size of the individual optical elements to the focal length, optical elements with size on the order of one hundred microns are required to achieve good angular resolution with a compact telescope. We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron-scale optical elements. This technique, commonly referred to as silicon micromachining, is based on silicon fabrication techniques developed by the microelectronics industry. We have succeeded in producing silicon lenses with a geometry suitable for a 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x-ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. In addition to the silicon fabrication, an x-ray beam line was constructed at Columbia for testing the optics. Most recently, we have done several experiments to find the fundamental limits that the anisotropic etch process placed on the etched surface roughness.

Kaaret, Philip↗

High energy collimating fine grids

The objective of this project was to demonstrate the fabrication of extremely tight tolerance collimating grids using a high-Z material, specifically tungsten. The approach taken was to fabricate grids by a replication method involving the coating of a silicon grid substrate with tungsten by chemical vapor deposition (CVD). A negative of the desired grid structure was fabricated in silicon using highly wafering techniques developed for the semiconductor industry and capable of producing the required tolerances. Using diamond wafering blades, a network of accurately spaced slots was machined into a single-crystal silicon surface. These slots were then filled with tungsten by CVD, via the hydrogen reduction of tungsten hexafluoride. Following tungsten deposition, the silicon negative was etched away to leave the tungsten collimating grid structure. The project was divided into five tasks: (1) identify materials of construction for the replica and final collimating grid structures; (2) identify and implement a micromachining technique for manufacturing the negative collimator replicas (performed by NASA/JPL); (3) develop a CVD technique and processing parameters suitable for the complete tungsten densification of the collimator replicas; (4) develop a chemical etching technique for the removal of the collimator replicas after the tungsten deposition process; and (5) fabricate and deliver tungsten collimating grid specimens.

Arrieta, Victor M.↗

JTEC Panel report on microelectromechanical systems in Japan

This report summarizes recent activities in the development of microelectromechanical systems (MEMS) in Japan. For the purposes of this study, 'MEMS' means batch-fabricated miniature devices that convert physical parameters to or from electrical signals and that depend on mechanical structures or parameters in important ways for their operation. The report covers advanced materials and process technology; sensors and sensing microstructures; microactuators and actuation mechanisms; sensor-circuit integration and system partitioning; advanced packaging, microassembly, and testing technologies; and MEMS design techniques, applications, and infrastructure. The panel found that Japanese industry is emphasizing approaches to MEMS that are similar to those taken by U.S. industry (i.e., approaches based on silicon integrated-circuit technology); these efforts are comparable in their level of development to those in the United States. However, the ten-year, $250 million, MITI-sponsored program in micromachines emphasizes the miniaturization of more traditional (nonlithographic) machining processes, an area in which there is no comparable U.S. effort. Packaging technology and applications for batch-fabricated MEMS devices is considered a major challenge in both countries. The panel concluded that these and other issues will require global leadership and international cooperation to realize the benefits of MEMS in a timely way.

Wise, Kensall D.↗

A hybrid electronically scanned pressure module for cryogenic environments

Pressure is one of the most important parameters measured when testing models in wind tunnels. For models tested in the cryogenic environment of the National Transonic Facility at NASA Langley Research Center, the technique of utilizing commercially available multichannel pressure modules inside the models is difficult due to the small internal volume of the models and the requirement of keeping the pressure transducer modules within an acceptable temperature range well above the -173 degrees C tunnel temperature. A prototype multichannel pressure transducer module has been designed and fabricated with stable, repeatable sensors and materials optimized for reliable performance in the cryogenic environment. The module has 16 single crystal silicon piezoresistive pressure sensors electrostatically bonded to a metalized Pyrex substrate for sensing the wind tunnel model pressures. An integral temperature sensor mounted on each silicon micromachined pressure sensor senses real-time temperature fluctuations to within 0.1 degrees C to correct for thermally induced non-random sensor drift. The data presented here are from a prototype sensor module tested in the 0.3 M cryogenic tunnel and thermal equilibrium conditions in an environmental chamber which approximates the thermal environment (-173 degrees C to +60 degrees C) of the National Transonic Facility.

Chapman, J. J.↗

Improved, Easier-To-Use Tunneling Infrared Sensors

Designs of electron-tunneling infrared sensors and micromachining processes used to fabricate them modified to increase sensitivity and to simplify operation, adjustment, and associated circuitry. Corrugations, pinholes, and standard packaging incorporated into design. Deflection voltages reduced, and thermal drifts eliminated. Performances exceed those of other commercially available, uncooled infrared sensors. Operation of sensors simplified to such extent, now feasible to ship them to nonexpert users for routine testing and evaluation in their laboratories.

Muller, Richard E.↗

Miniature X-Ray Tubes

Miniature x-ray tubes proposed for use in portable instruments used to analyze minerals. Electrons from field emitter (instead of thermionic emitter) accelerated to target to generate x-rays. Fabricated from silicon wafers, micromachined field emitters (MFEs) not subject to breakage or restrictions on lifetimes, and tolerate vacuums that filaments cannot. Miniature x-ray tubes very robust, immune to shock and vibration, and permanently sealed with getter for continued pumping. Combined with solid-state x-ray detectors for analysis of x-ray fluorescence.

Bearman, Gregory H.↗

Liquid metal micro heat pipes for space radiator applications

Micromachining is a chemical means of etching three-dimensional structures, typically in single-crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (micro electro mechanical systems), where in addition to the ordinary two dimensional (planar) microelectronics, it is possible to build three-dimensional micromotors, electrically-actuated microvalves, hydraulic systems, and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor microfabrication. The University of Cincinnati group in collaboration with NASA Lewis formed micro heat pipes in silicon by the above techniques. Work is ongoing at a modest level, but several essential bonding and packaging techniques have been recently developed. Currently, we have constructed and filled water/silicon micro heat pipes. Preliminary thermal tests of arrays of 125 micro heat pipes etched in a 1 inch x 1 inch x 250 micron silicon wafer have been completed. These pipes are instrumented with extremely small P-N junctions to measure their effective conductivity and their maximum operating power. A relatively simple one-dimensional model has been developed in order to predict micro heat pipes' operating characteristics. This information can be used to optimize micro heat pipe design with respect to length, hydraulic diameter, and number of pipes. Work is progressing on the fabrication of liquid-metal micro heat pipes. In order to be compatible with liquid metal (sodium or potassium), the inside of the micro heat pipes will be coated with a refractory metal (such as tungsten, molybdenum, or titanium).

Gerner, F. M.↗