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At least 181 records · Page 10

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NASA NTRS1985

Fire-resistant phosphorus containing polyimides and copolyimides

Phosphorus-containing polyimides and copolyimides are synthesized in a two-step polycondensation reaction from 1- (diorganooxyphosphonl)methly 2,4- and 2,6-diaminobenzenes and tetracarboxylic anhydride. The diorgano position of the diorganooxyphosphonyl group includes alkyl, such as ethyl, substituted alkyl, such as 2-chloroethyl, and aryl such as phenyl. The tetracarboxylic anhydries include compounds such as pyrometallitic dianhydride and benzophenone tetracarboxylic dianhydride. The glass transition temperature (Tg) of the polyimides is reduced by incorporation of the (dialkoxyphosphonyl)methyl groups. The phosphorus-containing copolyimides show a considerably higher degree of fire-resistance as compared to that of the corresponding common polyimides.

Mikroyannidis, J. A.↗

NASA NTRS1984

Rheological characterization of addition polyimide matrix resins and prepregs

Although graphite-reinforced polyimide matrix composites offer outstanding specific strength and stiffness, together with high thermal oxidative stability, processing problems connected with their rheological behavior remain to be addressed. The present rheological studies on neat polyimide resin systems encountered outgassing during cure. A staging technique has been developed which can successfully handle polyimide samples, and novel methods were applied to generate rheological curves for graphite-reinforced prepregs. The commercial graphite/polyimide systems studied were PRM 15, LARC 160, and V378A.

Maximovich, M. G.↗

NASA NTRS1984

The development of aerospace polyimide adhesives

Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.

St. Clair, A. K.↗

NASA NTRS1984

Polyimides - Tribological properties and their use as lubricants

Friction, wear, and wear mechanisms of several different polyimide films, solid bodies, composites, and bonded solid lubricant films are compared and discussed. In addition, the effect of such parameters as temperatures, type of atmosphere, contact stress, and specimen configuration are investigated. A friction and wear transition occurs in some polyimides at elevated temperatures and this transition is related to molecular relaxations that occur in polyimides. Friction and wear data from an accelerated test (pin-on-disk) are compared to similar data from an end use test device (plain spherical bearing), and to other polymers investigated in a similar geometry.

Fusaro, R. L.↗

NASA NTRS1985

PMR polyimides from solutions containing mixed endcaps

Previous studies have shown that partial substitution of p-aminostyrene (PAS) for the monomethylester of endo-5-norbornene-2, 3-dicarboxylic acid (NE) lowered the cure temperature of PMR polyimides from 316 to 260 C, but the modified PMR polyimides required higher compression-molding pressures than state-of-the-art PMR-15. In this study PMR polyimides are prepared employing three encaps: NE, PAS, and endo-N-phenyl-5-norbornene-2,3-dicarboximide (PN). The effect of PN addition on the processing characteristics and glass transition temperatures of graphite fiber-reinforced PMR composites is studied. The room temperature and short-time 316 C mechanical properties of the composites are determined. The weight loss and mechanical property retention characteristics of the composites after exposure in air at 316 C are also determined.

Delvigs, P.↗

NASA NTRS1985

Recent developments in polyimide and bismaleimide adhesives

Research on high temperature resin systems has intensified. In the Aerospace Industry, the motivation for this increased activity has been to replace heat resistant alloys of aluminum, stainless steel and titanium by lighter weight glass and carbon fiber reinforced composites. Applications for these structures include: (1) engine nacelles involving long time exposure (thousands of hours) to temperatures in the 150 to 300 C range, (2) supersonic military aircraft involving moderately long exposure (hundreds of hours) to temperatures of 150 to 200 C, and (3) missile applications involving only brief exposure (seconds or minutes) to temperatures up to 500 C and above. Because of fatigue considerations, whenever possible, it is preferable to bond rather than mechanically fasten composite structures. For this reason, the increased usage of high temperature resin matrix systems for composites has necessitated the devlopment of compatible and equally heat stable adhesive systems. The performance of high temperature epoxy, epoxy phenolic and condensation polyimide adhesives is reviewed. This is followed by a discussion of three recently developed types of adhesives: (1) condensation reaction polyimides having improved processing characteristics; (2) addition reaction polyimides; and (3) bismaleimides.

Politi, R. E.↗

NASA NTRS1985

Transfer molding of PMR-15 polyimide resin

Transfer molding is an economically viable method of producing small shapes of PMR-15 polyimide. It is shown that with regard to flexural, compressive, and tribological properties transfer-molded PMR-15 polyimide is essentially equivalent to PMR-15 polyimide produced by the more common method of compression molding. Minor variations in anisotropy are predictable effects of molding design and secondary finishing operations.

Reardon, J. P.↗

NASA NTRS1985

High temperature resistant polyimide from tetra ester, diamine, diester and N-arylnadimide

The invention described relates to improved polyimide resins which are noted for their high thermal and oxidative stability, high strength at elevated temperatures and which exhibit many other outstanding physical and chemical properties, especially useful in high temperature applications. The polyimides are prepared by the reaction, with application of heat of a mixture of monomers comprising: (1) a dialkyl or tetraalkyl ester of an aromatic tetracarboxylic acid, (2) and aromatic diamine, (3) a monoalkyl or dialky ester of a dicarboxylic acid, and (4) a N-arylnadimide such as N-phenylnadimide. Polyimides of monomers (1), (2) and (3) are known.

Pater, R. H.↗

NASA NTRS1985

Polyimide analysis using diffuse reflectance-FTIR

The thermal imidization of a number of polyimide precursors in the form of powders, films, and prepregs was examined by an in situ diffuse reflectance-FTIR technique where infrared spectra were determined while the material was being heated. An analysis of these spectra revealed that, with the exception of one water soluble adhesive, each precursor developed an anhydride band around 1850 cm/cu during imidization. This band diminished in intensity during final stages of cure. Efforts were made to quantify the amount of anhydride in several samples. Evidence obtained could be interpreted to mean that poly(amic acid) resins undergo an initial reduction in molecular weight during imidization before recombining to achieve their ultimate molecular weights as polyimides. Several reports in the literature are cited to support this interpretation. This report serves both to document anhydride formation during imidization and to increase our fundamental understanding of how polyimides cure.

Young, P. R.↗

NASA NTRS1985

Aerospace applications of PMR polyimide composites

The current status of the novel class of processable, addition-type polyimides known as PMR (for in situ polymerization of monomer reactants) polyimides, developed by NASA at the Lewis Research Center, is reviewed. Highlights of PMR technology studies conducted at NASA Lewis are presented. Several examples of industrial applications of PMR-15 polyimide composites to aerospace structural components are examined.

Serafini, T. T.↗

NASA NTRS1987

Acetylene-Terminated Polyimide Siloxanes

Siloxane-containing addition polyimides yield toughened high-temperature adhesives and matrix resins. Addition polyimide made by reaction of aromatic tetracarboxylic acid dianhydride with aromatic diamine in presence of ethynyl-substituted aromatic monoamine. Acetylene-terminated siloxane imide cured by heating to yield acetylene-terminated polyimide siloxane.

St. Clair, Terry L.↗

NASA NTRS1986

A new readily processable polyimide

As part of an effort to develop tough solvent resistance thermoplastics for potential use as structural resins on aerospace vehicles, a new processable polyimide was evaluated. The synthesis involved the reaction of a new diamine, 1,3-bis 2-(3-aminophenoxy)ethyl ether, with 3,3',4,4'-benzophenonetetracarboxylic dianhydride to form the polyamic acid and subsequent conversion of it to the polyimide. Various physical properties such as thermal stability, solvent resistance, glass transition temperature, crystalline melt temperature, melt viscosity and mechanical properties such as fracture toughness, adhesive, film and composite properties are reported. Of particular interest is the extremely high titanium to titanium tensile shear strength obtained for this polyimide.

Harris, F. W.↗

NASA NTRS1987

A new readily processable polyimide

Harris, F. W.↗

NASA NTRS1987

DC electrical, thermal, and spectroscopic properties of various condensation polyimides containing surface cobalt oxide

Doping polyimides with cobalt ion causes the room temperature direct current electrical resistivity to decrease relative to the polymer alone, the reduction being most pronounced for the air-side of the cobalt modified polyimides. At a constant electrical field, resistivity for the volume, air-side and glass-side modes decreases yet further with an increase in temperature as expected for semiconductors and insulators. X-ray photoelectron spectroscopy indicates the air-side of the cobalt modified polyimides is predominantly Co3O4. The bulk resistivity of the air-side and activation energy of conduction for this surface are comparable to high purity sintered Co3O4. Charging characteristics at room temperature indicate a substantial polymer matrix contribution to both the glass-side and volume mode measurements but a negligible contribution to the air-side electrical properties. Volume electrical resistivity for similar additive levels is reduced by increasing the molecular flexibility of the host polymer.

Rancourt, J. D.↗

NASA NTRS1988

Developing Crystallinity In Linear Aromatic Polyimides

New technique improves melt flow of polyimide. Uses chemical imidization or cyclodehydration techniques that do not cause significant decrease in molecular weight. Process involves dissolution of polyamide acid in amide solvent or mixture of ether and amide solvent at low percentage of solids followed by treatment of this solution with aprotic organic base, such as triethylamine or pyridine, for period of time prior to treatment with organic dehydrating agent. Latter treatments facilitates formation of polyimide. Useful for production of polyimide molding materials. Expected to have widespread application in preparation of easily processed adhesives, molding powders, and matrix resins.

St. Clair, Terry L.↗

NASA NTRS1988

Adhesive properties of LARC-CPI, a new semi-crystalline polyimide

As part of an effort on high temperature structural resins for aerospace applications, a new family of polyimides containing carbon and ether connecting groups between aromatic rings were prepared. Several of these polyimides were semicrystalline. One polyimide, designated LARC-CPI, with a glass transition temperature of 222 C and a crystalline melt temperature of 350 C, was evaluated in the form of an adhesive, film, and molding. Unoriented films exhibited excellent resistance to solvents and strong bases and high tensile properties. Compact tension specimens gave very high fracture toughness values. Titanium tensile shear specimens provided exceptional strength under a variety of test conditions. The chemistry and the physical and mechanical properties of LARC-CPI are discussed.

Hergenrother, P. M.↗

NASA NTRS1989

Low-Dielectric Polyimides

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

St. Clair, Anne K.↗

NASA NTRS1989

Soluble Aromatic Polyimides For Film Coating

Because of toughness, flexibility, and remarkable thermal stability, linear all-aromatic polyimides excellent candidate film and coating materials for advanced electronic circuitry and wires. Study determined effects on solubility of changing isomeric points of attachment of phenoxy units in diamine portions of several all-aromatic polyimides. Tough, flexible, transparent films produced by thermally converting polyamic acids to polyimides at 300 degree C in air. Potential for electronic applications excellent.

St. Clair, Anne K.↗