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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1983

Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers

Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

Anthony, Thomas R.↗
NASA NTRS1998

Compound semi-conductors and controlled doping thereof

A method of controlling the amount of impurity incorporation in a crystal grown by a chemical vapor deposition process. Conducted in a growth chamber, the method includes the controlling of the concentration of the crystal growing components in the growth chamber to affect the demand of particular growth sites within the growing crystal thereby controlling impurity incorporation into the growth sites.

Larkin, David J.↗
NASA NTRS1985

Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire

Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process of this invention involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

Anthony, Thomas R.↗
NASA NTRS2007

Electrophoretic Deposition on Porous Non-Conductors

A method of electrophoretic deposition (EPD) on substrates that are porous and electrically non-conductive has been invented. Heretofore, in order to perform an EPD, it has been necessary to either (1) use a substrate material that is inherently electrically conductive or (2) subject a non-conductive substrate to a thermal and/or chemical treatment to render it conductive. In the present method, instead of relying on the electrical conductivity of the substrate, one ensures that the substrate is porous enough that when it is immersed in an EPD bath, the solvent penetrates throughout the thickness, thereby forming quasi-conductive paths through the substrate. By making it unnecessary to use a conductive substrate, this method simplifies the overall EPD process and makes new applications possible. The method is expected to be especially beneficial in enabling deposition of layers of ceramic and/or metal for chemical and electrochemical devices, notably including solid oxide fuel cells.

Compson, Charles↗
NASA NTRS1994

Steering capaciflector sensor

A capacitive type proximity sensor having substantial range and sensitivity between a machine and an intruding object in the immediate vicinity of the machine and having a steerable sensing field has an outer electrical conductor on the machine forming one electrode of a sensor capacitor, the other electrode is the object. The outer conductor is a thin sheet of conductive material with a pair (or more) of intermediate electrical conductors located between the outer conductor and the machine. The pair of intermediate electrical conductors are in close proximity to each other and together form a surface having a size substantially larger than the outer conductor to act as a shield for reducing the parasitic capacitance between the outer conductor and the machine and to steer the sensor field. The pair of intermediate conductors are thin sheets of conductive material substantially wider than the first conductor. The outer and pair of intermediate conductors are attached to a surface on the machine in electrical isolation and with no gaps between the conductors and no gap between the surface and the pair of intermediate conductors. The outer and pair of intermediate conductors are also in conformance with each other and the surface of the machine, and the surface of the machine acts as a ground plane. Variable gain voltage follower circuits are used for coupling, in phase, the instantaneous voltage at the outer electrical conductor to the pair of intermediate electrical conductors and a signal generator is coupled to the outer conductor and is responsive to the capacitance of the sensor capacitor for generating a control signal to the machine.

Jenstrom, Del T.↗
NASA NTRS1993

Capaciflector camera

A capacitive type proximity sensor having improved range and sensitivity between a surface and an intruding object in the vicinity of the surface having a voltage source, a number of outer electrical conductors on the surface with each forming one electrode of a number of sensor capacitors, the other electrode for each sensor capacitor being the object is described. The outer conductors are made from thin sheets of conductive material covered with insulation. An intermediate electrical conductor is located between the outer conductors and the surface and is of a size larger than the outer conductors to act as a shield for reducing the parasitic capacitance between the outer conductors and the surface. The intermediate conductor is also made from a thin sheet of conductive material covered with insulation. The outer conductors and the intermediate conductor are attached to the surface with no gap between the insulation on the conductors and no gap between the surface and the insulation on intermediate conductor, the outer conductors and the intermediate conductor conjoining with each other and with the surface, with the surface acting as a ground plane. A current-measuring voltage follower circuit is connected to the voltage source for coupling in phase and amplitude the instantaneous voltage at the voltage source to the outer electrical conductors and the intermediate electrical conductor. This circuit is responsive to the change in capacitance of the sensor capacitors and generates a number of output signals.

Vranish, John M.↗
NASA NTRS1994

Capaciflector camera

A capacitive type proximity sensor having improved range and sensitivity between a surface and an intruding object in the vicinity of the surface having a voltage source, a number of outer electrical conductors on the surface with each forming one electrode of a number of sensor capacitors, the other electrode for each sensor capacitor being the object. The outer conductors are made from thin sheets of conductive material covered with insulation. An intermediate electrical conductor is located between the outer conductors and the surface and is of a size larger than the outer conductors to act as a shield for reducing the parasitic capacitance between the outer conductors and the surface. The intermediate conductor is also made from a thin sheet of conductive material covered with insulation. The outer conductors and the intermediate conductor are attached to the surface with no gap between the insulation on the conductors and no gap between the surface and the insulation on intermediate conductor, the outer conductors and the intermediate conductor conjoining with each other and with the surface, with the surface acting as a ground plane. A current-measuring voltage follower circuit is connected to the voltage source for coupling in phase and amplitude the instantaneous voltage at the voltage source to the outer electrical conductors and the intermediate electrical conductor. This circuit is responsive to the change in capacitance of the sensor capacitors and generates a number of output signals.

Vranish, John M.↗
NASA NTRS2005

Feed Structure For Antennas

A novel feed structure, for an antenna having a resonant electric field structure, comprising a patch element, an integrated circuit attached to the patch element, at least one inner conductor electrically connected to and terminating at the integrated circuit on a first end of the at least one inner conductor, wherein the at least one inner conductor extends through and is not electrically connected to the patch element, and wherein the at least one inner conductor is available for electrical connectivity on a second end of the at least one inner conductor, and an outer conductor electrically connected to and terminating at the patch element on a first end of the outer conductor, wherein the outer conductor is available for electrical connectivity on a second end of the outer conductor, and wherein the outer conductor concentrically surrounds the at least one inner conductor from the second end of the at least one inner conductor available for electrical connectivity to the first end of the outer conductor terminating at the patch element.

Patrick W Fink↗
NASA NTRS1988

Integrated circuit reliability testing

A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

Buehler, Martin G.↗
NASA NTRS2006

System providing limit switch function with simultaneous absolute position output

A limit and position sensing system includes a sensor assembly and an emitter. The sensor assembly includes first and second electrical conductors arranged in opposing parallel planes. The first electrical conductor is coiled outwardly from either end thereof in a clockwise fashion to form a first coil region and a second coil region. The second electrical conductor forms a single coil with portions of the single coil's rings lying between the first end and second end of the first electrical conductor being parallel to an axis of the first electrical conductor's plane. Ferromagnetic material is aligned with the first and second electrical conductors and spans beyond (a) the first and second ends of the first electrical conductor, and (b) the portions of the rings of the second electrical conductor's single coil that lie between the first end and second end of the first electrical conductor. The emitter is spaced apart from the sensor assembly and transmits a periodic electromagnetic wave towards the sensor assembly.

Alhorn, Dean C.↗
NASA NTRS1990

Integrated circuit reliability testing

A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

Buehler, Martin G.↗
NASA NTRS1983

Method of making and structure for monolithic optical circuits

A method for making monolithic optical circuits, with related optical devices as required or desired, on a supporting surface (10) consists of coating the supporting surface with reflecting metal or cladding resin, spreading a layer of liquid radiation senstivie plastic (12) on the surface, exposing the liquid plastic with a mask (14) to cure it in a desired pattern of light conductors (16, 18, 20), washing away the unexposed liquid plastic, and coating the conductors thus formed with reflective metal or cladding resin. The index of refraction for the cladding (22) is selected to be lower than for the conductors so that light in the conductors will be reflected by the interface with the cladding. For multiple level conductors, as where one conductor must cross over another, the process may be repeated to fabricate a bridge with columns (24, 26) of conductors to the next level, and conductor (28) between the columns. For more efficient transfer of energy over the bridge, faces at 45.degree. may be formed to reflect light up and across the bridge.

Evanchuk, Vincent L.↗
NASA NTRS1984

Structure for monolithic optical circuits

A method for making monolithic optical circuits, with related optical devices as required or desired, on a supporting surface (10) consists of coating the supporting surface with reflecting metal or cladding resin, spreading a layer of liquid radiation sensitive plastic (12) on the surface, exposing the liquid plastic with a mask (14) to cure it in a desired pattern of light conductors (16, 18, 20), washing away the unexposed liquid plastic, and coating the conductors thus formed with reflective metal or cladding resin. The index of refraction for the cladding (22) is selected to be lower than for the conductors so that light in the conductors will be reflected by the interface with the cladding. For multiple level conductors, as where one conductor must cross over another, the process may be repeated to fabricate a bridge with columns (24, 26) of conductors to the next level, and conductor (28) between the columns. For more efficient transfer of energy over the bridge, faces at 45.degree. may be formed to reflect light up and across the bridge.

Evanchuk, Vincent L.↗
NASA NTRS1987

Electro-expulsive separation system

An electro-expulsive system has one or more overlapped conductors, each comprising a flexible ribbon conductor, which is folded back on itself. The conductors are embedded in an elastomeric material. Large current pulses are fed to the conductors from power storage units. As a result of the antiparallel currents, the opposed segments of a conductor are forcefully separated and the elastomeric material is distended. Voids in the elastomer aid the separation of the conductor segments. The distention is almost instantaneous when a current pulse reaches the conductor and the distention tends to remove any solid body on the surface of the elastomeric material.

Haslim, Leonard A.↗
NASA NTRS1991

SEPAC data analysis in support of the environmental interaction program

Data analyses of the Space Experiments with Particle Accelerators (SEPAC) data and computer modeling were conducted to investigate spacecraft environmental effects associated with injection of electron beams, plasma clouds, and neutral gas clouds from the Shuttle orbiter. The data analysis indicates that Extremely Low Frequency oscillations from 150 to 200 Hz were seen in the Langmuir probe current when the beam was fired in a continuous mode. The strongest oscillations occurred when the ambient pressure was augmented by neutral gas releases from the SEPAC plasma accelerator magnetoplasma-dynamic (MPD) arcjet. To understand the dependence of spacecraft charging potential on beam density and other plasma parameters, a two-dimensional electrostatic particle code was used to simulate the injection of electron beams from an infinite conductor into a plasma. The simulations show that the conductor charging potential depends critically on the reflection coefficient of the conductor surface, which is defined as the percentage of incident particles reflected by the conductor. The ionization effects on spacecraft charging were examined by including interactions of electrons with neutral gas. The simulations show that the conductor charging potential decreases with increasing neutral background density due to the production of secondary electrons near the conductor surface. The simulations also indicate that the beam radius is generally proportional to the beam electron gyroradius when the conductor is charged to a large potential. It appears that the charge buildup at the beam stagnation point causes the beam radial expansion. A survey of the simulation results suggests that the ratio of the beam radius to the beam electron gyroradius increases with the square root of beam density and decreases inversely with beam injection velocity. These results are useful for explaining the spacecraft charging phenomena observed during SEPAC experiments from Spacelab 1.

Lin, Chin S.↗