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At least 199 records · Page 11

General Services Administration Reclamation Yard (SWMU 010) 2020-2021 Groundwater Monitoring Report

This report presents a summary of the groundwater monitoring activities that occurred from October 2020 through June 2021 at General Services Administration Reclamation Yard, Solid Waste Management Unit 010, located at the John F. Kennedy Space Center (KSC), Florida. For the purposes of this report, two separate plumes, known as the Polychlorinated Biphenyl (PCB)/Volatile Organic Aromatic (VOA) Plume and the Chlorinated Volatile Organic Compound (VOC) Plume were identified for this site. The contaminants of concern (COCs) for the PCB/VOA Plume consists of PCBs, 1,2,4-trichlorobenzene, and breakdown products of 1,2,4-trichlorobenzene. The COCs for the Chlorinated VOC Plume are tetrachloroethene, trichloroethene, cis-1,2-dichloroethene, and vinyl chloride. The activities presented in this report include four field events: (1) October 2020 – Chlorinated VOC Plume groundwater sampling via Direct Push Technology (DPT) – 68 groundwater samples were collected from 14 locations at varying intervals; (2) December 2020 – Site-wide semi-annual water level measurements of 52 monitoring wells and sampling of 39 monitoring wells; (3) May 2021 – Chlorinated VOC Plume monitoring well installation – two monitoring wells were installed and screened from 10 to 20 feet below land surface (bls); and (4) May/June 2021 – Site-wide semi-annual water level measurements of 53 monitoring wells and sampling of 40 monitoring wells. Results showed substantial reduction of both plumes. Conclusions and recommendations are presented.

VOC↗

Boundary Layer Instabilities Over a Cone-Cylinder-Flare Model at Mach 6

Computations are performed to investigate the boundary-layer instabilities over a sharp cone-cylinder-flare model at zero degrees angle of attack. The model geometry and the flow conditions are selected to match the experiments conducted in the Boeing/AFOSR Mach 6 Quiet Tunnel (BAM6QT) at Purdue University. The geometry consists of a nominally sharp 5-degree half-angle cone, followed by a cylindrical segment and then a 10-degree flare. An axisymmetric separation bubble is generated as a result of the laminar shock/boundary-layer interaction in the cylinder-flare region. The comparison of the laminar flow solution and the schlieren images shows a remarkable agreement between the respective locations of both the boundarylayer edge and the reattachment shock. The predicted heat flux distribution is also in agreement with the measured values downstream of the reattachment location. The analysis of convective and global instabilities is performed for flare half angles equal to 8, 10, and 12 degrees and nosetip radii equal to 0.1, 1, and 5 mm. The linear amplification of first and second Mack mode instabilities that begin to amplify in the cone region are computed with a combination of the parabolized stability equations (PSE) and the harmonic linearized Navier-Stokes equations (HLNSE). The predicted frequency spectra of the surface pressure fluctuations associated with both planar and oblique instability waves are compared with the measured spectra at the various locations of the PCB and Kulite sensors. The comparison shows that the computational analysis captures the distinct lobes within the disturbance amplification spectra measured in the experiments, but some differences in amplification characteristics are noted at low frequencies. Overall, the oblique disturbances are found to be more amplified than the planar disturbances. To our knowledge, this represents the first successful comparison between convective instability analysis and measured surface pressure fluctuations for a hypersonic configuration with a separation bubble. Finally, the global instability analysis shows that the laminar flow becomes supercritical for flare half angles larger than 8 degrees. The unstable global mode for the experimental configuration of a 10 degrees flare and a sharp nosetip cone corresponds to a stationary three-dimensional disturbance that is concentrated in the recirculation region and achieves its maximum growth rate for an azimuthal wavenumber of 5.

Hydrodynamic instability↗

A Dual Linear/Circular Polarized Wideband Flat Panel Phased Array Antenna for K/Ka-band 6U CubeSat Communications Applications

Circular polarized (CP) electromagnetic waves are preferred for space-to-space and space-to-ground satellite communications (SATCOM). CubeSats with 6U sizes (1U represents a 10 cm x 10 cm x 10 cm), that will rotate together with the Moon as it orbits Earth require high gain CP antenna systems to maintain reliable communication links. Here, we have designed an 8x8 dual linear and dual circularly polarized phased array antenna (PAA) aperture that offers 22-28 GHz bandwidth, with maximum gain of 23 dBic, and beam scanning capability of ±50o with acceptable axial ratio over all scan angles. A stacked patch topology is selected to achieve wide impedance bandwidth. Each driven patch has two via feed point locations that are connected to grounded coplanar waveguide (CPW) feed structures. By utilizing phase shifters from the Anokiwave RFICs (AWMF-0165) employed for the beamforming network (BFN), we have generated both dual linear polarization and dual circular polarization in each patch. Each driven and parasitic patch is innovatively shaped to achieve excellent isolation between two feed points which, in turn, leads to low cross polarization, high efficiency and good axial ratio over the entire bandwidth. Each chip has eight outputs which feed one 2x2 sub-array consisting of four dual linear or dual circularly polarized driven patches, simultaneously. Each 2x2 sub-array of the 8x8 array are sequentially rotated which improves axial ratio performance when the antenna operates in the dual circularly polarized mode. By utilizing a mirror effect, cross-polarized fields are also improved when operated in a dual linear polarized mode. The 8x8 array aperture is simulated taking into account the effect of the multilayer printed circuit board (PCB) stack-up of the BFN and co-simulated with the power splitter outputs and chip outputs and results are compared with only passive array performance. The performance of the antenna is still excellent when non-ideal chip performances are included in the simulation analysis. The fabricated array will be tested for radiation patterns in the Antenna and Microwave Laboratory (AML) of the San Diego State University and the NASA Glenn Research Center (GRC) spherical near field chambers. The design of the 8x8 antenna array with BFN layout is shown in Fig. 1.

5G↗

Request for Discontinuation of Long-Term Monitoring Orsino Storage Yard Solid Waste Management Unit 004 Kennedy Space Center, Florida

This report presents the site history, groundwater sampling results, and recommendations from the 2021 Industrial Area (IA) LTM activities at ORSY. ORSY has been used as a staging facility for electrical equipment since 1966 (EG&G 1991). Initial investigations conducted between 1986 and 1992 focused on polychlorinated biphenyls (PCBs) in soil. A series of soil excavation interim measures (IMs) were conducted to remove soils containing total PCB concentrations of greater than 25 milligrams per kilogram (mg/kg). A Resource Conservation and Recovery Act (RCRA) Facility Investigation (RFI) was completed in several phases at ORSY from 1998 through 2005, with PCBs in soil and volatile organic compounds (VOCs) in groundwater identified as contaminants of concern.

Jennifer Lynn Joyal↗

Additively Manufactured Ink-based Cell Batteries for Flexible Conformational Applications

With the rise of additively manufactured electronics, the importance of thin, flexible printed batteries has increased for shape-conformal electronics. Traditionally, battery cells such as industry-standard lithium-ion batteries, have been rigid and therefore unable to conform to time-variant surfaces such as smart cards/RFID devices, disposable battery-powered skin patches, foldable electronic devices, and IoT nodes. Aligned with the effort to advance technologies on printed electronics for habitat systems and advanced manufacturing, this proof-of-concept will focus on printing a 50 mAh Zn-Ag battery implementing a DIW Technique. After prototype manufacturing, electrical and environmental testing on the flexible battery cell will be conducted to the evaluate energy and power density over 50 charge cycles under standard atmosphere conditions. The project aims to provide PCB designers, fabricators, and assemblers an integrated battery package to eliminate external batteries, external wiring and connectors, and conformational complexity. Potential end uses of the printed battery process will be within Martian and lunar habitat systems, Gateway, and surface vehicles, or aerial robots where space and geometry is a restriction.

Printed Electronics↗

General Services Administration Reclamation Yard Solid Waste Management Unit 010: 2022 Groundwater Monitoring Report Kennedy Space Center, Florida

This report presents a summary of the groundwater monitoring activities that occurred in September and October 2022 at General Services Administration Reclamation Yard, Solid Waste Management Unit 010, located at the John F. Kennedy Space Center (KSC), Florida. The site is monitored under KSC’s Resource Conservation and Recovery Act Corrective Action Program. This approach also meets the requirements of Chapter 62-780, Florida Administrative Code. For the purposes of this report, two separate plumes, known as the Polychlorinated Biphenyl (PCB)/Volatile Organic Aromatic (VOA) Plume and the Chlorinated Volatile Organic Compound (VOC) Plume, were identified for this site. The contaminants of concern (COCs) for the PCB/VOA Plume consist of PCBs, 1,2,4-trichlorobenzene, and breakdown products of 1,2,4-trichlorobenzene. The COCs for the Chlorinated VOC Plume were tetrachloroethene, trichloroethene, cis-1,2-dichloroethene, and vinyl chloride. Groundwater monitoring for VOCs in the Chlorinated VOC Plume area was discontinued following the December 2021 annual monitoring event. Annual groundwater monitoring for underground injection control (UIC) parameters continues for both the PCB/VOA Plume and the Chlorinated VOC Plume areas. The activities presented in this report include one field event: September and October 2022, which includes sitewide semi-annual water level measurements of 55 monitoring wells, redevelopment of all monitoring wells listed in the sampling plan, and groundwater sampling of 28 monitoring wells. The sampling and analysis demonstrated that the PCB/VOA plume is not expanding and is significantly reduced compared to before a 2018 source removal interim measure. Recommendations are made for the 2023 groundwater monitoring program.

groundwater↗

Laboratory Radar Measurements in Support of the NASA Orbital Debris Program Office’s Size Estimation Model

The NASA Orbital Debris Program Office (ODPO) relies on ground-based radar measurements from both the Haystack Ultrawideband Satellite Imaging Radar (HUSIR) and the Goldstone Solar System Radar (Goldstone) to characterize mm to cm debris population in low Earth orbit (LEO). Radar measurements help characterize the size of orbital debris objects, particularly fragmentation debris. However, debris size is not directly measured by radar but inferred from the measured radar cross section (RCS) which depends on several parameters in addition to physical size including electrical conductivity and polarization. To interpret the observed RCS of orbital debris objects detected by radar measurements as physical sizes, NASA uses an empirical size estimation model (SEM) based on laboratory RCS measurements of breakup fragments generated during hypervelocity impact tests as well as some pieces of non-impact-generated “artificial” debris-like objects expected to be representative of the debris population. Since the development of the ODPO SEM, many new materials have been introduced to spacecraft construction. Consequently, ODPO plans to update the radar SEM based on planned laboratory RCS measurements of debris fragments from DebriSat, a ground-based hypervelocity impact experiment conducted in 2014 that consisted of a high-fidelity spacecraft model characteristic of a modern LEO spacecraft. Prior to measuring DebriSat fragments, a set of calibration targets with well-defined geometries and material compositions were measured at The Ohio State University’s ElectroScience Laboratory (OSU-ESL) compact radar range. These calibration measurements help to validate, and understand any limitations of, laboratory measurements of RCS. Calibration targets include idealizations of typical shape categories seen in DebriSat fragments such as nuggets, flat plates, and cylinders. As with DebriSat, calibration target materials were chosen to represent typical modern-day spacecraft components and include stainless steel, aluminum, printed circuit board (PCB) substrate, and carbon fiber-reinforced polymer (CFRP). These materials also represent a wide range of electrical conductivities, which strongly influences measured RCS and inferred target size. The RCS calibration measurements were collected over a frequency sweep from 2 to 18 GHz and stepping through different azimuth angles from 0 to 360 degrees at an elevation of 0 degrees. A second set of calibration measurements is in work consisting of more complex shapes such as bent rods and plates as well as different mounting options including epoxy and a 3D printed holder. These further measurements along with our initial calibration set will inform selection of representative DebriSat fragments for laboratory RCS measurements that will contribute to the planned update to the ODPO radar SEM. An appropriate subset of both the radar calibration and DebriSat samples will also be measured in the ODPO Optical Measurements Center to cross-calibrate size estimates over these different wavelength regimes.

Radar↗

Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU↗

Modular Coaxial Power Converter for High-Density Integration into Medium-Voltage Cables

This work proposes to combine the functionality benefits of power electronics with the power density benefits of medium-voltage cables to create a streamlined, high-density power electronics solution that seamlessly integrates with medium-voltage cables. Located at the ends of a medium- or high-voltage line, the proposed converter uses a cascade of coaxial power conversion cells to gradually step down the voltage, and excels in high step-down applications. By mimicking the coaxial geometry of medium-voltage cables, the converter preserves the axisymmetric electric field of the cable which, when combined with a solid insulating dielectric, provides a voltage scaling advantage over conventional planar and PCB-based converter solutions. Similar to medium voltage cables, the converter is fully passively cooled. A passive cooling strategy allows for combined installation with existing medium voltage cable systems without the added cost, maintenance needs, infrastructure, and reliability concerns associated with active cooling systems. The scalability of the modular structure in combination with the integration benefits provide a flexible power electronics system that can adapt to the evolving demands of the grid.

coaxial power conversion cells↗

Impact of Synthesis and Aging on Titanium Carbide MXenes for Printed Microsystems

This work investigates the long-term electrical stability of Ti3C2Tx MXene Inks under accelerated aging conditions. Inks were synthesized from commercial MAX-Phase precursors, drop-cast onto custom PCB’s and monitored automated in-situ measurements. Samples aged at 85°C/85% RH, 85°C/0% RH and ambient conditions revealed distinct degradation trends. Wet aged inks showed rapid resistance increased while etched formulations exhibited long term stability. These findings highlight the influence of synthesis stage and environmental exposure on MXene Inks reliability, offering critical insights for printed MEMS and sensor applications. Ongoing measurements extend the aging timeline beyond prior studies, marking the longest evaluation under accelerated aging conditions to date.

Aging↗

Printed Wiring Board Technology Infusion and Supplier Capability Overview

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at QLF 2018 provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

PCB fabrication↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards↗

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry↗

ATLAS-MAP: An Automated Test Station for Gated Electronic Transport Measurements

The diversification of electronic materials in devices provides a strong incentive for methods to rapidly correlate device performance with fabrication decisions. In this work, we present a low-cost automated test station for gated electronic transport measurements of field-effect transistors. Utilizing open-source PyMeasure libraries for transparent instrument control, the “ATLAS-MAP” system serves as a customizable interface between sourcemeters and samples under test and is programmed to conduct transfer curve and van der Pauw methods with static and sweeping gate voltages. Zinc oxide transistors of variable thickness (5, 10, and 20 nm) and channel size (50 μm to 3 mm, of equal length and width) were fabricated to validate the design. Standardization of testing procedures and raw data formatting enabled automated data analysis. A detailed list of parts and code files for the system are provided.

36 MATERIALS SCIENCE↗

Embedded Resistors and Capacitors in Organic and Inorganic Substrates

Embedded resistors and capacitors were purchased from two technology; organic PWB and inorganic low temperature co-fire ceramic (LTCC). Small groups of each substrate were exposed to four environmental tests and several characterization tests to evaluate their performance and reliability. Even though all passive components maintained electrical performance throughout environmental testing, differences between the two technologies were observed. Environmental testing was taken beyond manufacturers' reported testing, but general not taken to failure. When possible, data was quantitatively compared to manufacturer's data.

printed circuit board (PCB)↗