Search NASA⌕ Search

SEARCH · Search NASA

Results for “Packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 199 records · Page 11

Food Packaging Materials

The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

Source record↗

Packaging and Embedded Electronics for the Next Generation

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Sampson, Michael J.↗

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗

Integration of Product, Package, Process, and Environment: A Food System Optimization

The food systems slated for future NASA missions must meet crew nutritional needs, be acceptable for consumption, and use resources efficiently. Although the current food system of prepackaged, moderately stabilized food items works well for International Space Station (ISS) missions, many of the current space menu items do not maintain acceptability and/or nutritive value beyond 2 years. Longer space missions require that the food system can sustain the crew for 3 to 5 years without replenishment. The task "Integration of Product, Package, Process, and Environment: A Food System Optimization" has the objective of optimizing food-product shelf life for the space-food system through product recipe adjustments, new packaging and processing technologies, and modified storage conditions. Two emergent food processing technologies were examined to identify a pathway to stable, wet-pack foods without the detrimental color and texture effects. Both microwave-assisted thermal sterilization (MATS) and pressure-assisted thermal stabilization (PATS) were evaluated against traditional retort processing to determine if lower heat inputs during processing would produce a product with higher micronutrient quality and longer shelf life. While MATS products did have brighter color and better texture initially, the advantages were not sustained. The non-metallized packaging film used in the process likely provided inadequate oxygen barrier. No difference in vitamin stability was evident between MATS and retort processed foods. Similarly, fruit products produced using PATS showed improved color and texture through 3 years of storage compared to retort fruit, but the vitamin stability was not improved. The final processing study involved freeze drying. Five processing factors were tested in factorial design to assess potential impact of each to the quality of freeze-dried food, including the integrity of the microstructure. The initial freezing rate and primary freeze drying temperature and pressure were linked to final product quality in freeze-dried corn, indicating processing modifications that could lead to improved product shelf life. Storage temperatures and packaging systems were also assessed for the impact to food quality. Reduced temperature storage had inconclusive impact to the progression of rancidity in butter cookies. Frozen storage was detrimental to fruit and vegetable textural attributes but refrigerated storage helped to sustain color and organoleptic ratings for plant-based foods. With regard to packaging systems, the metallized film overwrap significantly decreased the progression of the rancidity of butter cookies as compared to the highest barrier non-metallized film. The inclusion of oxygen scavengers resulted in noticeable moisture gains in butter cookies over time, independent of packaging film systems. Neither emergent processing technology nor the freeze dry optimization resulted in compelling quality differences from current space food provisions such that a five-year shelf life is likely with these processing changes alone. Using a combination of refrigeration and PATS processing is expected to result in organoleptically-acceptable fruit quality for most fruits through five years. The vitamin degradation will be aided somewhat by the cold temperatures but, given the labile nature of vitamin C, a more stable fortification method, such as encapsulation, should also be investigated to ensure vitamin delivery throughout the product life. Similarly, significant improvement to the packaging film used in the MATS processing, optimization of formulation for dielectric properties, vitamin fortification, and reduced temperature storage should be investigated as a hurdle approach to reach a five year shelf life in wet-pack entrees and soups. Baked goods and other environmentally-sensitive spaceflight foods will require an almost impenetrable barrier to protect the foods from oxygen and moisture ingress but scavengers and reduced storage temperature did not improve baked good shelf life and are not recommended at this time for these foods.

Cooper, Maya R.↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗

Aging Behavior of the Viton® Fluoroelastomer O-Rings in the 9975 Shipping Package

The 9975 Type B shipping package is used within the DOE complex for shipping special nuclear materials. This package is re-certified annually in accordance with Safety Analysis Report requirements. The package is also used at the Savannah River Site as part of the long-term storage configuration of special nuclear materials. As such, the packages do not undergo annual recertification during storage, with uncertainty as to how long some of the package components will meet their functional requirements in the storage environment. The packages are currently approved for up to 15 years storage, and work continues to provide a technical basis to extend that period. This paper describes efforts by the Savannah River National Laboratory (SRNL) to extend the service life estimate of Viton® GLT and GLT-S fluoroelastomer O-rings used in the 9975 shipping package. O-rings of both compositions are undergoing accelerated aging at elevated temperature, and are periodically tested for compression stress relaxation (CSR) behavior and leak performance. The CSR behavior of O-rings was evaluated at temperatures from 79 °C to 177 °C. These collective data were used to develop predictive models for extrapolation of CSR behavior to relevant service temperatures (< 75 °C). O-rings were also aged in Primary Containment Vessel (PCV) fixtures at temperatures ranging from 79 °C to 232 °C. The fixtures are helium leak tested periodically to determine if they remain leak-tight. The PCV fixture tests demonstrate that the 9975 O-rings will remain leak-tight at temperatures up to 149 °C for 3 years or more, and no leak failures have been observed with up to 8 years aging at 93 °C. Significantly longer periods of leak-tight service are expected at the lower temperatures actually experienced in the storage environment. The predictive model developed from the CSR data conservatively indicates a service life of more than 20 years at the bounding temperature of 75 °C. Although the relationship between CSR behavior and leak-tight performance has not been established for this design, the CSR predictions for this O-ring are conservative relative to leak-tight performance to date.

36 MATERIALS SCIENCE↗

SAFETY ANALYSIS REPORT FOR PACKAGING SHIELDING & NUCLEAR CRITICALITY SAFETY COURSES DEVELOPED AND CONDUCTED BY OAK RIDGE NATIONAL LABORATORY

The US Department of Energy (DOE) Packaging Certification Program, Office of Packaging and Transportation, is offering Safety Analysis Report for Packaging (SARP) Shielding and Nuclear Criticality Safety (NCS) courses for SARP generalists and analysts. The SARP generalist course is designed for project managers, supervisors, NCS/shielding subject matter experts (SME), and SMEs in non-NCS/shielding technical areas (e.g., structural, thermal, package design) who need to improve their understanding of how NCS/shielding analyses fit into the broader spectrum of SARP documentation. The generalist course provides an overview of the regulations and guidelines for the criticality and shielding analyses included in a SARP, and it illustrates how the NCS/shielding chapters integrate with the other parts of the SARP. After course material is presented, students in the generalist course will review an actual SARP document to examine key elements of the shielding and criticality analyses. The analyst course provides detailed instructions on the radioactive material package shielding analyses and NCS evaluation fundamentals needed by analysts/practitioners, including safety analysts and/or technical reviewers, to prepare and/or review technical analyses for SARP documentation. The analyst course also provides an overview of regulations and guidelines, in addition to detailed in-class exercises associated with package shielding and NCS analyses. Analysis teams will be faced with staged SARP examples in which several important decision processes in the generation of a SARP will be demonstrated and discussed. Both courses are offered at Oak Ridge National Laboratory, and for interested students, the analyst course is offered for one hour of graduate credit (course ME-690) from the University of Nevada at Reno. An overview of the course will be provided to ensure that the NCS community is aware of the course and its intent to support the shielding and NCS aspects of packaging and transportation analyses for SARP activities.

Bowen, Douglas G.↗

Terminal Sinking Velocity for Waste Packages Falling in a Deep Borehole - 17063

This evaluation of terminal velocity for a waste package sinking in a deep borehole filled with emplacement fluid was done to support concept development for the Deep Borehole Field Test (DBFT). The DBFT objective is to evaluate the safety and feasibility of the deep borehole disposal (DBD) concept for certain radioactive wastes. The DBD concept calls for emplacing waste packages in the lower 2 km of a borehole drilled into crystalline basement rock to a depth of 5 km. Previous studies identified that accidentally dropping one or more waste packages during emplacement could be an important risk, particularly if a waste package is breached. This study evaluated the range of terminal sinking velocity, which can be used to design waste packages and impact limiters to ensure that breach does not occur. Based on an analytical model of a sinking container, a highly turbulent flow is expected to develop in the emplacement fluid. Turbulence is a complex three-dimensional phenomenon and the applicability of analytical models is limited. To backstop the analytical model and to extend predictions to other package dimensions and fluid properties, numerical simulation was performed using the ANSYS Fluent computational fluid dynamics code. Terminal velocity was calculated for downhole temperatures up to 1200 C, and three emplacement fluids (water, NaCl brine, and NaBr brine). Simulation results confirmed that flow around the sinking container is highly turbulent (Reynolds number 5.6 x 10{sup 4} to 7.3 x 10{sup 5}). Turbulence increases with temperature and decreases with density. Calculated terminal velocity ranges from 1.95 (200 C) to 2.13 m/s (1200 C) in water; 1.61 (200 C) to 1.79 m/s (1200 C) in NaCl; and 1.30 (200 C) to 1.46 m/s (1200 C) in NaBr. Terminal velocity is inversely related to fluid density, and the temperature effect on density appears to have a stronger effect on terminal velocity than the temperature effect on viscosity. The foregoing results are for non-perforated casing, but in practice the casing may be perforated to prepare for cementing, and to allow relief of fluid pressure from thermal expansion after emplacement of heat generating waste, and after final borehole closure. To represent the effect from perforations, the analytical solution was modified to include bypass flow through perforations and in the annulus. A workable perforation scheme is identified, consistent with borehole construction and closure requirements, using 2-cm and 5-cm diameter perforations. This scheme is estimated to limit the terminal velocity to 3 m/s, for reference waste packages falling in water at 400 C. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Aspects of Assessment of Packages with Wood Filled Impact Limiters during Fire Tests - 17191

Packages for the transport of radioactive material are often equipped with impact limiters consisting of wood, encapsulated by steel sheets. These impact limiters shall ensure that the transport casks meet the mechanical and thermal IAEA regulatory test requirements. According to the accident conditions of transport it is mandatory to expose the specimens to a cumulative effect by mechanical and thermal impacts. The mechanical tests consist of a free drop from 9 m onto a flat unyielding target and a 1 m drop onto a puncture bar. After damage caused by mechanical test sequences the package has to withstand a severe fire scenario. Corresponding to the IAEA advisory material it is required that the impact attitudes for the 9 m drop test and for the puncture test have to be such as to produce maximum damage, taking into account the thermal test. Moreover, any damage, which would give rise to increased radiation or loss of containment or affect the confinement system after the thermal test, should be considered. During and following the thermal test, the specimen shall not be artificially cooled and any combustion of materials of the package shall be permitted to proceed naturally. Different works from the French Institute for Radiological Protection and Nuclear Safety (IRSN) and BAM show that additional energy supply from a pre-damaged impact limiter to the cask could occur. This effect should be considered within the safety assessment of the containment. Thermal effects at the closure system of the cask, which might result in an elevated activity release, have to be excluded. BAM conducted small scale tests with wood filled metal buckets showing continuing combustion processes during the cooling down phase. These test results are presented. As not much is known about smouldering processes in wood filled impact limiters, it is highly complex to define pre-damage of impact limiters, which are conservative, regarding the maximum damaging energy flow from the impact limiter to the containment system. More research has to be done to develop models to examine the effects of smouldering impact limiters on the containment of packages for the transport of radioactive material. Aspects of assessment and its difficulties are shown. BAM as a competent authority for the approval of transport casks for radioactive material in Germany operates the test facilities to examine the issue of mechanical damage, combustion and heat transfer for such kind of package systems. For this purpose, the knowledge from real drop tests with casks of a mass partly over 100 tons was transferred to a test application. A thermal test will take place with a wood filled test specimen with a diameter of about 2.3 meters. The aim is to understand the phenomena of smouldering under the consideration of relevant regulatory boundary conditions. The process of smouldering is described with regard to the requirements in the thermal assessment of safety of packages for the transport of radioactive material. Requirements concerning the pre-damage of packages for the maximum damage of impact limiters are discussed. Parameters influencing the smouldering process are identified. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Use of Ductile Iron for Radioactive Waste Packaging and Shielding in the United States - 17278

Ductile Cast Iron (DCI) has been used for packaging radioactive waste in Europe and the United Kingdom for many years. The ductile iron provides many favorable properties when compared with steel and offers many advantages including: - Monolithic structure increasing overall strength; - No welding required; no tempering or maintenance/inspection of the weld area is required; - Fast, serial production of similar containers reducing manufacturing costs; - Lower cost compared to steel or steel/lead composites; - Good corrosion resistance even when uncoated; - Can be coated or plated to provide suitable surface for decontamination; - Flexibility in design due to the manufacturing process permits a variety of shapes and very large size container possibilities; - Hazardous materials not needed or used for shielding. The flexibility in design will help generators find viable and more cost effective packaging options for radioactive waste. The package is conformed to the waste instead of conforming waste to the package. Commercial utilities often replace radioactive components which are too large for conventional packaging and have dose rates too high for flexible wraps while plant schedule and physical configuration won't allow for component segmentation. This is one situation where the use of ductile iron can be used to provide a packaging solution. By assessing the radiological characterization and component size and weight, ductile iron can be cast into certified containers to easily package, ship and dispose of the waste in a cost effective manner. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Development of a Helical Closure for Radioactive Material Shipping Packages

The Savannah River National Laboratory (SRNL) Packaging Technology group proposed a closure design for the outer packaging of a prototype Type B shipping package being developed for the Department of Energy (DOE). The closure design provides an efficient means of securing the containment vessel (CV) within the radioactive material packaging. This design has a simplified operation, requires less components, and less maintenance when compared to current radioactive material package closure methods. This paper will review and discuss the materials, designs, processes, and testing activities that were considered and pursued in the development of the novel closure for the outer packaging of new radioactive material shipping packages.

Housley, William M. [Savannah River National Labor↗

malbacR: A Package for Standardized Implementation of Batch Correction Methods for Omics Data

Mass spectrometry is a powerful tool for identifying and analyzing small molecules, such as metabolites and lipids, in com-plex biological samples. Liquid chromatography and gas chromatography mass spectrometry studies quite commonly in-volve large numbers of samples, which can require significant time for sample preparation and analyses. To accommodate such studies, the samples are commonly split into batches. Inevitably, variations in sample handling, temperature fluctua-tion, imprecise timing, column degradation and other factors result in systematic errors or biases of the measured abundances between the batches. Numerous methods are available via R packages to assist with batch correction for small molecule om-ics data; however, since these methods were developed by different research teams, the algorithms are available in separate R packages, each with different data input and output formats. We introduce the malbacR package which consolidates eleven common batch effect correction methods for small molecule omics data into one place so users can easily implement and compare: pareto scaling, power scaling, range scaling, ComBat, EigenMS, NOMIS, RUV-random, QC-RLSC, WaveI-CA2.0, TIGER, and SERRF. The malbacR package standardizes data input and output formats across these batch correction methods. The package works in conjunction with the pmartR package, allowing users to seamlessly include batch effect cor-rection in a pmartR workflow without needing any additional data manipulation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Destructive Examination of Shipping Package 9975-02019

Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02019 as part of a comprehensive SRS surveillance program for plutonium material stored in the K-Area Complex (KAC). During the field surveillance inspection of this package in KAC, two non-conforming conditions were noted: the axial gap of 1.577 inch exceeded the 1 inch maximum criterion, and two areas of dried glue residue were noted on the upper fiberboard subassembly. This package was subsequently transferred to SRNL for more detailed inspection and destructive examination. In addition to the conditions noted in KAC, the following conditions were noted: - Numerous small spots of corrosion were observed along the bottom edge of the drum. - In addition to the smeared glue residue on the upper fiberboard subassembly, there was also a small dark stain. - Mold was present on the side and bottom of the lower fiberboard subassembly. Dark stains from elevated moisture content were also present in these areas. - A dark spot with possible light corrosion was observed on the primary containment vessel flange, and corresponding rub marks were observed on the secondary containment vessel ID. - The fiberboard thermal conductivity in the radial orientation was above the specified range. When the test was repeated with slightly lower moisture content, the result was acceptable. The moisture content for both tests was within a range typical of other packages in storage. The observed conditions must be fully evaluated by KAC to ensure the safety function of the package is being maintained. Several factors can contribute to the concentration of moisture in the fiberboard, including higher than average initial moisture content, higher internal temperature (due to internal heat load and placement within the array of packages), and the creation of additional moisture as the fiberboard begins to degrade.

42 ENGINEERING↗

Destructive Examination of Shipping Package 9975-02731

Destructive and non-destructive examinations were performed on the components of the package 9975-02731 as part of a comprehensive Savannah River Site surveillance program for plutonium materials stored in the K-Area Complex (KAC). The package stored nuclear materials in KAC for 13.8 years. Inspection of the package during opening in KAC noted one non-conforming condition: a large discolored area on the upper fiberboard subassembly. The package was subsequently transferred to Savannah River National Laboratory for more detailed examination. In addition to the observation noted in KAC, the following conditions were observed: (1) Axial gap of 1.021 inch slightly exceeded the 1 inch maximum criterion, and (2) Lead shield height exceeded drawing tolerance of 24.7 inch by 0.019 inch. Visual examination of the upper fiberboard assembly and analysis of the discolored fiberboard indicate the discoloration was due to wood glue residue. The physical, thermal, and mechanical properties of the fiberboard met the acceptance criteria and/or were within the range of previously tested fiberboard and baseline samples. The visual, microscopic and tensile testing results were consistent with previous O-ring and baseline Viton results. The lead shield surface was covered with corrosion product as observed on other shields but there was no evidence of excessive blistering, flaking, or spalling. Besides minor and expected corrosion, no evidence of a degraded condition was found in this package. Examination of the 9975-02731 corroborates existing evidence that the 9975 package is robust and the components can perform their expected functions.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

Codisposal Waste Package Loading Options for DOE SNF and HLW

The U.S. Department of Energy (DOE) is responsible for managing spent nuclear fuel (SNF) that is currently in, or will in the future come into, its possession. DOE must continue to safely store that SNF, transport it to an interim storage site or a repository, and dispose of it. These fuels come from a wide range of reactor types, such as light- and heavy-water-moderated reactors, graphite-moderated reactors, and breeder reactors, with various cladding materials and enrichments. Many of these reactors, now decommissioned, had unique design features, such as core configuration, fuel element and assembly geometry, moderator and coolant materials, operational characteristics, and neutron spatial and spectral properties resulting in a large diversity of reactor and fuel designs. Because of the wide variety and condition of SNF, a robust canister termed the DOE Standardized SNF Canister was proposed that would confine radionuclides and preclude moderator. The DOE Standard SNF Canister had four variations consisting of a 10- or 15-foot length and an 18- or 24-inch diameter. For ultimate disposal in the Yucca Mountain Repository these canisters were to be grouped with 24-inch diameter HLW canisters in a codisposal waste package. The 18-inch DOE Standardized SNF Canister could be placed in the middle of five HLW canisters. The 24-inch DOE Standardized SNF Canister would take the place of one the five HLW canister on the outer ring in the codisposal waste package. No DOE Standardized SNF Canisters have been loaded, and many fuel types can be loaded in multiple canisters. Depending on the selected diameter of the DOE Standardized SNF Canister for a particular fuel, the number of potential codisposal waste packages could vary. In addition, different types of DOE SNF may be able to be combined in a single canister. This could significantly change the number of DOE SNF canisters that are loaded and result in a decrease of the number of total potential codisposal waste packages. Ultimately, if too many HLW canisters need disposition, then a reduction in the number of DOE Standardized SNF Canisters will change the final total of codisposal waste packages very little. Likewise, if the ratio of DOE Standardized SNF Canisters to HLW canister produced is too high, then DOE Standardized SNF Canisters will not have enough HLW canisters to surround them in the codisposal waste package. This paper examines the results of differing loading strategies for a few DOE SNFs. It also compares the ranges of DOE Standardized SNF Canisters that may be produced to the ranges of HLW canisters that may be produced in order to determine potential scenarios.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗