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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Investigating the Interaction between Persistent Slip Bands and Surface Hard Coatings via Crystal Plasticity Simulations

Fatigue cracks often initiate from the surface extrusion/intrusions formed due to the operation of persistent slip bands (PSBs). Suppression of these surface topographical features by hard surface coatings can significantly extend fatigue lives under lower stress amplitudes (i.e., high cycle fatigue), while cracks initiate early in the coating or in the coating–substrate interface under higher stress amplitudes (i.e., low cycle fatigue), deteriorating the fatigue performance. However, both beneficial and detrimental effects of the coatings appear to be affected by the coating–substrate material combination and coating thickness. A quantitative understanding of the role of these factors in the fatigue performance of materials is still lacking. In this study, crystal plasticity simulations were employed to elucidate the dependence of the coating’s effects on two factors—i.e., the coating thickness and loading amplitudes. The results revealed that the thicker coatings more effectively suppress the operation of the PSBs, but generate higher tensile and shear stresses, normal and parallel to the interfaces, respectively, promoting interfacial delamination. The tensile stresses parallel to the interface within the coating, which favors coating fracture, are not sensitive to the coating thickness.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Thermally induced PtOx interfacial layer enhances stability of Pt/β-Ga2O3 vertical Schottky diodes

This study investigates the long-term stability of Pt/β-Ga2O3 field-plated Schottky barrier diodes at high temperatures, with extended thermal cycling and soaking stress. The device characteristics reveal a strong dependence on operating temperature, leading to an ON/OFF current ratio of ∼10× at ±3 V and 600 °C. Extensive thermal cycling (25 cycles over 100 h) between room temperature and 350 °C shows that leakage currents stabilize after the initial ten cycles. This stabilization is likely due to the formation of a thin PtOx layer at the Pt/β-Ga2O3 interface, as confirmed by high-resolution scanning transmission electron microscopy. Further exposure to a constant 350 °C environment for 10 h reveals a slight increase in the leakage current from 10−7 to 10−6 A at −5 V and degradation of the forward current, due to potential thermodynamic instability of the Ohmic contacts. This study provides insights into the changes in the Pt/β-Ga2O3 diode performance with thermal stress, offering a basis for predicting the device’s operational reliability at high temperatures for sensing and power applications.

08 HYDROGEN↗
DOE OSTI2020

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗
NASA NTRS1974

A method for determining local elastoplastic stress and strain in metallurgically bonded notched laminates subjected to a loading cycle

A semianalytical method was developed for determining elastoplastic cyclic stresses and strains at notch roots in metallurgically bonded metal laminates. The method is based on the Neuber equation, which was used with an effective stress-strain curve for the laminate. It was applied to laminates containing a circular hole which were subjected to one cycle of reversed loading. The laminates consisted of two elasto-perfectly-plastic materials with different yield strengths and with either equal or different Young's moduli. A laminate of high-strength titanium alloy with alternate layers of commercially pure titanium was also analyzed. The accuracy of the method was evaluated by comparing the stresses and strains with those calculated from a finite-element analysis. The results estimated by the simple method based on the Neuber equation agreed closely with the results computed from the more elaborate finite-element analysis.

Sova, J. A.↗
DOE OSTI2020

Low Cost (CAPEX and variable): Tool design for cell and module fabrication with thin, free-standing silicon wafers

This project aimed to develop technologies that can potentially enable free-standing thin (<80 μm) wafer in today’s manufacturing lines with high production yield, and thereby reduce capex barriers of silicon photovoltaics cells and modules. One of the major benefits is that thin wafer dramatically reduces the amount of polysilicon required. As a result, it can lead to reduction in the capital expenditures associated with polysilicon refining and wafer fabrication, which together are more than half of the total capital expenditure to manufacture Si PV module. We focused our efforts on developing the tools needed to enable high yield fabrication of wafer, cell, and module with thin silicon wafers. However, as the wafer thickness reduces, the major challenge is that wafer breakage increases significantly. Three technological areas were explored in this project to improve the production yield of the silicon wafer, namely detection of edge cracks via dark-field near-infrared (NIR) scattering; (2) wafer handling using controlled temperature profiles; (3) manufacturable low-stress cell interconnection for multiwire. First, the formation of wafer cracks in submillimeter length is one of the reasons that causes wafer breakages. Crack detection tools are needed to enable us to locate and track the wafer crack during manufacturing, so that we can improve the process to reduce initialization. The state-of-the-art crack detection technique cannot fulfill the need for measuring submillimeter edge cracks detrimental for thin wafers. The prototype developed in this project demonstrates the scanning of microcracks near wafer edges. With a semi-automatic laboratory setup, the submillimeter cracks were reliably detected near the edges in multi-Si wafers. The smallest detectable crack is 200 µm in length in slow scans; and submillimeter cracks are detected in high-throughput scans at the scan speed of >0.5 m/s, which is compatible with the inline detection of a manufacturing line at least 1 sec/wafer. This detection limit is a significant advancement in comparison to the benchmarked industrial tool. Second, wafer handling with the well-controlled temperature profile was thought to be the solution to reduce crack initiation and propagation during the manufacturing. However, without crack detection being widely adopted in production line, we did not find a strong industrial pull toward this technology. We did an initial literature survey and then diverted our efforts to the other tasks. Third, the innovation on low-stress multi-wire interconnection tackles a fundamental problem in the standard interconnection scheme. The standard over-under “zig-zag” interconnection induces a significant amount of stress into the soldering point on the cell whenever PV module is under stress, e.g., thermal cycling, transportation, and installation. Therefore, the interconnection process was re-designed in this project to allow for significant movement between adjacent solar cells, e.g., due to thermal expansion, without building up stresses on the solar cells or solder joints. The new interconnection method with the cross-connect wire also simplifies the tabbing and stringing process by replacing the standard over-under method with an off-cell interconnect from top to bottom. A manual tabbing and stringing tool for this new process was prototyped in the lab to demonstrate the fabrication of this new interconnection design. During the test with brass sheets as our “testing cells”, it was found that the mechanical cycling test only broke the interconnection after more than 50,000 cycles, which is equivalent to more than 130 years of the day-and-night thermal cycles. Lastly, throughout the project, we continuously analyzed the PV market with techno-economic analysis to identify the opportunity for thin Si adoption. Even though the drastic cost reduction has already happened in the past five years, our analysis results indicated that we can still save quite significantly in both manufacturing cost and factory capex, Particularly, in order to grow the PV manufacturing capacity to multi-terawatt level, reducing the thickness of silicon wafer is one of the most effective ways to quickly reduce factory capex, and sustain the high growth rate. The technologies developed in this project are readily available to provide some assistances in tackling the production yield problem.

14 SOLAR ENERGY↗
NASA NTRS2007

Effects of Stoichiometry on Transformation Temperatures and Actuator-Type Performance of NiTiPd and NiTiPdX High-Temperature Shape Memory Alloys

High-temperature shape memory NiTiPd and NiTiPdX (X=Au, Pt, Hf) alloys were produced with titanium equivalent (Ti+Hf) compositions of 50.5, 50.0, 49.5, and 49.0 at.%. Thermo-mechanical testing in compression was used to evaluate the transformation temperatures, transformation strain, work output, and permanent deformation behavior of each alloy to study the effects of quaternary alloying and stoichiometry on high-temperature shape memory alloy behavior. Microstructural evaluation showed the presence of second phases for all alloy compositions. No load transformation temperatures in the stoichiometric alloys were relatively unchanged by Au and Pt substitutions, while the substitution of Hf for Ti causes a drop in transformation temperatures. The NiTiPd, NiTiPdAu and NiTiPdHf alloys exhibited transformation temperatures that were highest in the Ti-rich compositions, slightly lower at stoichiometry, and significantly reduced when the Ti equivalent composition was less than 50 at.%. For the NiTiPdPt alloy, transformation temperatures were highest for the Ti-rich compositions, lowest at stoichiometry, and slightly higher in the Ni-rich composition. When thermally cycled under constant stresses of up to 300 MPa, all of the alloys had transformation strains, and therefore work outputs, which increased with increasing stress. In each series of alloys, the transformation strain and thus work output was highest for stoichiometric or Ti-rich compositions while permanent strain associated with the constant-load thermal cycling was lowest for alloys with Ni-equivalent-rich compositions. Based on these results, basic rules for optimizing the composition of NiTiPd alloys for actuator performance will be discussed.

Bigelow, Glen S.↗
NASA NTRS1972

Thermal expansion compatibility of ceramic chip capacitors mounted on alumina substrates.

The thermal expansion coefficients of a representative sample of BaTiO3 and TiO2 ceramic chip capacitors and alumina substrates have been examined. These data have revealed large potential mechanical stresses under thermal cycling. A mathematical analysis of a composite model of the capacitor to predict the thermal expansion and modulus of elasticity and an analysis of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. In all cases studied, thermally induced stresses great enough to cause capacitor body rupture or termination failure was predicted.

Allen, R. V.↗
NASA NTRS1974

Sequential cumulative fatigue reliability

A component is assumed to be subjected to a sequence of several groups of sinusoidal stresses. Each group consists of a specific number of cycles having the same maximum alternating stress level and the same mean stress level, the maximum alternating stress level being different from group to group. A method for predicting the reliability of components subjected to such loads is proposed, given their distributional alternating stress versus cycles-to-failure (S-N) diagram. It is called the 'conditional reliability-equivalent life' method. It is applied to four-cases using distributional fatigue data generated in the Reliability Research Laboratory of The University of Arizona, and the predicted reliabilities are compared and discussed.

Kececioglu, D.↗
NASA NTRS2006

Effects of Hydrogen on GRCop-84

This report is a section of the final report on the GRCop-84 task of the Constellation Program and incorporates the results obtained between October 2000 and September 2005 when the program ended. GRCop-84 contains approximately 5.5 wt% Nb. Nb can react with H and embrittle easily. Previous work had indicated the thermodynamic possibility that Cr 2 Nb could react with H and form niobium hydrides in the presence of high pressure H such as seen in the Space Shuttle Main Engine. In this study, samples were charged with H and then tested in both high pressure H and He environments to determine if measurable differences existed which indicate that hydrogen embrittlement occurs in GRCop-84. Tensile, notched tensile, stress rupture and low cycle fatigue properties were surveyed. High pressure H environment stress rupture testing resulted in a lower reduction in area than a high pressure He environment, and the LCF lives at high strain ranges fall below the lower 95 percent confidence interval for the baseline data, but in general no significant differences were noted either between H and He environment tests or between hydrogen charged materials and the baseline, uncharged extruded GRCop-84 data sets. There was also no discernable evidence of the formation of hydrides or changes in fracture morphology indicating hydrogen embrittlement occurred.

Ellis, David L.↗
NASA NTRS2008

Influence of Test Procedures on the Thermomechanical Properties of a 55NiTi Shape Memory Alloy

Over the past few decades, binary NiTi shape memory alloys have received attention due to their unique mechanical characteristics, leading to their potential use in low-temperature, solid-state actuator applications. However, prior to using these materials for such applications, the physical response of these systems to mechanical and thermal stimuli must be thoroughly understood and modeled to aid designers in developing SMA-enabled systems. Even though shape memory alloys have been around for almost five decades, very little effort has been made to standardize testing procedures. Although some standards for measuring the transformation temperatures of SMA s are available, no real standards exist for determining the various mechanical and thermomechanical properties that govern the usefulness of these unique materials. Consequently, this study involved testing a 55NiTi alloy using a variety of different test methodologies. All samples tested were taken from the same heat and batch to remove the influence of sample pedigree on the observed results. When the material was tested under constant-stress, thermal-cycle conditions, variations in the characteristic material responses were observed, depending on test methodology. The transformation strain and irreversible strain were impacted more than the transformation temperatures, which only showed an affect with regard to applied external stress. In some cases, test methodology altered the transformation strain by 0.005-0.01mm/mm, which translates into a difference in work output capability of approximately 2 J/cu cm (290 in!lbf/cu in). These results indicate the need for the development of testing standards so that meaningful data can be generated and successfully incorporated into viable models and hardware. The use of consistent testing procedures is also important when comparing results from one research organization to another. To this end, differences in the observed responses will be presented, contrasted and rationalized, in hopes of eventually developing standardized testing procedures for shape memory alloys.

Padula, Santo A., II↗
NASA NTRS1992

Single-Cycle Versus Multicycle Proof Testing

Report compares single-cycle with multiple-cycle mechanical-stress tests of parts under mechanical stresses. Objective of proof testing: to screen out gross manufacturing or material deficiencies and provide additional assurance of quality. Report concludes that changes in distribution of crack sizes during multicycle proof testing depend on initial distribution, number of cycles, relationship between resistance of material and elastic/plastic fracture-mechanics parameter, relationship between load control and displacement control, and magnitude of applied load or displacement. Whether single-cycle or multicycle testing used depends on shape, material, and technique of fabrication of components tested.

Hudak, S. J., Jr.↗
DOE OSTI2021

Thermal-striping analysis methodology for sodium-cooled reactor design

Computational fluid dynamics simulations have been performed to study the applicability of engineering CFD methods for thermals striping analysis. Thermal striping is the fluctuating temperature profile in a solid caused by fluctuating fluid temperature, and the resulting fluctuating thermal stresses cause high cycle fatigue and eventual material failure. Here this study presents the methodology for thermal striping analysis that including a transient conjugate heat transfer RANS model and benchmark the results against a sodium triple jet experiment. The multiphysics calculations are implemented to analyze the thermal stresses in the solid domain caused by the coupled heat transfer between the fluid and solid domains. Validation data from a liquid sodium triple jet experiment include time-averaged temperature measurements and power spectra of the temperature signal. The numerical results agree well with these experimental measures, demonstrating key features such as the dominant frequency of temperature fluctuations. The applicability of a low-cost wall treatment method is demonstrated, enabling key computational savings. Finally, the performance of two finite element stress analysis software packages is compared, and the validity of the lower-cost method is confirmed. These results demonstrate the applicability of engineering methods for computational thermal striping calculations, enabling thermal striping estimations in large fluid systems such as the core of a Sodium-cooled nuclear reactor.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
NASA NTRS1998

Cyclic Fiber Push-In Test Monitors Evolution of Interfacial Behavior in Ceramic Matrix Composites

SiC fiber-reinforced ceramic matrix composites are being developed for high-temperature advanced jet engine applications. Obtaining a strong, tough composite material depends critically on optimizing the mechanical coupling between the reinforcing fibers and the surrounding matrix material. This has usually been accomplished by applying a thin C or BN coating onto the surface of the reinforcing fibers. The performance of these fiber coatings, however, may degrade under cyclic loading conditions or exposure to different environments. Degradation of the coating-controlled interfacial behavior will strongly affect the useful service lifetime of the composite material. Cyclic fiber push-in testing was applied to monitor the evolution of fiber sliding behavior in both C- and BN-coated small-diameter (15-mm) SiC-fiber-reinforced ceramic matrix composites. The cyclic fiber push-in tests were performed using a desktop fiber push-out apparatus. At the beginning of each test, the fiber to be tested was aligned underneath a 10- mm-diameter diamond punch; then, the applied load was cycled between selected maximum and minimum loads. From the measured response, the fiber sliding distance and frictional sliding stresses were determined for each cycle. Tests were performed in both room air and nitrogen. Cyclic fiber push-in tests of C-coated, SiC-fiber-reinforced SiC showed progressive increases in fiber sliding distances along with decreases in frictional sliding stresses for continued cycling in room air. This rapid degradation in interfacial response was not observed for cycling in nitrogen, indicating that moisture exposure had a large effect in immediately lowering the frictional sliding stresses of C-coated fibers. These results indicate that matrix cracks bridged by C-coated fibers will not be stable, but will rapidly grow in moisture-containing environments. In contrast, cyclic fiber push-in tests of both BN-coated, SiC-fiber-reinforced SiC and BNcoated, SiC-fiber-reinforced barium strontium aluminosilicate showed no significant changes in fiber sliding behavior with continued short-term cycling in either room air or nitrogen. Although the composites with BN-coated fibers showed stable short-term cycling behavior in both environments, long-term (several-week) exposure of debonded fibers to room air resulted in dramatically increased fiber sliding distances and decreased frictional sliding stresses. These results indicate that although matrix cracks bridged by BNcoated fibers will show short-term stability, such cracks will show substantial growth with long-term exposure to moisture-containing environments. Newly formulated BN coatings, with higher moisture resistance, will be tested in the near future.

Eldridge, Jeffrey I.↗
DOE OSTI2021

Mechanical Response of Castlegate Sandstone under Hydrostatic Cyclic Loading

The stress history of rocks in the subsurface affects their mechanical and petrophysical properties. Rocks can often experience repeated cycles of loading and unloading due to fluid pressure fluctuations, which will lead to different mechanical behavior from static conditions. This is of importance for several geophysical and industrial applications, for example, wastewater injection and reservoir storage wells, which generate repeated stress perturbations. Laboratory experiments were conducted with Castlegate sandstone to observe the effects of different cyclic pressure loading conditions on a common reservoir analogue. Each sample was hydrostatically loaded in a triaxial cell to a low effective confining pressure, and either pore pressure or confining pressure was cycled at different rates over the course of a few weeks. Fluid permeability was measured during initial loading and periodically between stress cycles. Samples that undergo cyclic loading experience significantly more inelastic (nonrecoverable) strain compared to samples tested without cyclic hydrostatic loading. Permeability decreases rapidly for all tests during the first few days of testing, but the decrease and variability of permeability after this depend upon the loading conditions of each test. Cycling conditions do affect the mechanical behavior; the elastic moduli decrease with the increasing loading rate and stress cycling. The degree of volumetric strain induced by stress cycles is the major control on permeability change in the sandstones, with less compaction leading to more variation from measurement to measurement. The data indicate that cyclic loading degrades permeability and porosity more than static conditions over a similar period, but the petrophysical properties are dictated more by the hydrostatic loading rate rather than the total length of time stress cycling is imposed.

58 GEOSCIENCES↗
NASA NTRS1985

Closure of fatigue cracks at high strains

Experiments were conducted on smooth specimens to study the closure behavior of short cracks at high cyclic strains under completely reversed cycling. Testing procedures and methodology, and closure measurement techniques, are described in detail. The strain levels chosen for the study cover from predominantly elastic to grossly plastic strains. Crack closure measurements are made at different crack lengths. The study reveals that, at high strains, cracks close only as the lowest stress level in the cycle is approached. The crack opening is observed to occur in the compressive part of the loading cycle. The applied stress needed to open a short crack under high strain is found to be less than for cracks under small scale yielding. For increased plastic deformations, the value of sigma sub op/sigma sub max is observed to decrease and approaches the value of R. Comparison of the experimental results with existing analysis is made and indicates the limitations of the small scale yielding approach where gross plastic deformation behavior occurs.

Iyyer, N. S.↗
NASA NTRS1997

Thermal Fatigue Testing of ZrO2-Y2O3 Thermal Barrier Coating Systems using a High Power CO2 Laser

In the present study, the mechanisms of fatigue crack initiation and propagation, and of coating failure, under thermal loads that simulate diesel engine conditions, are investigated. The surface cracks initiate early and grow continuously under thermal Low Cycle Fatigue (LCF) and High Cycle Fatigue (HCF) stresses. It is found that, in the absence of interfacial oxidation, the failure associated with LCF is closely related to coating sintering and creep at high temperatures. Significant LCF and HCF interactions have been observed in the thermal fatigue tests. The fatigue crack growth rate in the ceramic coating strongly depends on the characteristic HCF cycle number, N*(sub NCF), which is defined as the number of HCF cycles per LCF cycle. The crack growth rate is increased from 0.36 microns/LCF cycle for a pure LCF test to 2.8 microns/LCF cycle for a combined LCF and HCF test at N*(sub NCF) about 20,000. A surface wedging model has been proposed to account for the HCF crack growth in the coating systems. This mechanism predicts that HCF damage effect increases with increasing surface temperature swing, the thermal expansion coefficient and the elastic modulus of the ceramic coating, as well as with the HCF interacting depth. A good agreement has been found between the analysis and experimental evidence.

Zhu, Dongming↗
DOE OSTI2024

Assessment of Accelerated Stress Testing Data for Silicon Photovoltaics Using Tensor Decomposition Methods

The photovoltaic (PV) industry is simultaneously targeting long warranties and new materials/designs for high-energy-yield modules, requiring an advanced methodology to forecast long-term durability of products with un-proven materials combinations. Extended, sequential, and combined stress testing methods are gaining popularity for assessing durability of PV modules/materials beyond the early-stage mortalities. Importantly, multiple degradation mechanisms can proceed simultaneously, and their separate contributions to the overall power loss should ideally be quantified. This work examines the use of data-driven tools towards developing a strategy for faster learning cycles in accelerated stress testing.

accelerated stress testing↗