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At least 199 records · Page 11

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗

Mission Concept for the Single Aperture Far-Infrared (SAFIR) Observatory

We have developed a preliminary but comprehensive mission concept for SAFIR, as a 10 m-class far-infrared and submillimeter observatory that would begin development later in this decade to meet the needs outlined above. Its operating temperature (< or = 4K) and instrument complement would be optimized to reach the natural sky confusion limit in the far-infrared with diffraction-limited performance down to at least the atmospheric cutoff, lambda > or approx. 40 microns. This would provide a point source sensitivity improvement of several orders of magnitude over that of the Spitzer Space Telescope (previously SIRTF) or the Herschel Space Observatory. Additionally, it would have an angular resolution 12 times finer than that of Spitzer and three times finer than Herschel. This sensitivity and angular resolution are necessary to perform imaging and spectroscopic studies of individual galaxies in the early universe. We have considered many aspects of the SAFIR mission, including the telescope technology (optical design, materials, and packaging), detector needs and technologies, cooling method and required technology developments, attitude and pointing, power systems, launch vehicle, and mission operations. The most challenging requirements for this mission are operating temperature and aperture size of the telescope, and the development of detector arrays. SAFIR can take advantage of much of the technology under development for JWST, but with much less stringent requirements on optical accuracy.

Benford, Dominic J.↗

Test program for transmitter experiment package and heat pipe system for the communications technology satellite

The test program is described for the 200 watt transmitter experiment package and the variable conductance heat pipe system which are components of the high-power transponder aboard the Communications Technology Satellite. The program includes qualification tests to demonstrate design adequacy, acceptance tests to expose latent defects in flight hardware, and development tests to integrate the components into the transponder system and to demonstrate compatibility.

Depauw, J. F.↗

BOK-Printed Electronics

The use of printed electronics technologies (PETs), 2D or 3D printing approaches either by conventional electronic fabrication or by rapid graphic printing of organic or nonorganic electronic devices on various small or large rigid or flexible substrates, is projected to grow exponentially in commercial industry. This has provided an opportunity to determine whether or not PETs could be applicable for low volume and high-reliability applications. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps- on this subject-OE-A, ITRS, and iNEMI-each with a different name identification for this emerging technology. This followed by a brief review of the status of the industry on standard development for this technology, including IEEE and IPC specifications. The report concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging. Understanding key technology roadmaps, parameters, and applications is important when judicially selecting and narrowing the follow-up of new and emerging applicable technologies for evaluation, as well as the low risk insertion of organic, large area, and printed electronics.

Ghaffarian, Reza↗

Hybrid propulsion technology program. Volume 1: Conceptional design package

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). As part of the design study critical technology issues were identified and a technology acquisition and demonstration plan was formulated.

Jensen, Gordon E.↗

Japan's technology and manufacturing infrastructure

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Boulton, William R.↗

Selection of human consumables for future space missions

Consumables for human spaceflight include oxygen, water, food and food packaging, personal hygiene items, and clothing. This paper deals with the requirements for food and water, and their impact on waste product generation. Just as urbanization of society has been made possible by improved food processing and packaging, manned spaceflight has benefitted from this technology. The downside of this technology is increased food package waste product. Since consumables make up a major portion of the vehicle onboard stowage and generate most of the waste products, selection of consumables is a very critical process. Food and package waste comprise the majority of the trash generated on the current shuttle orbiter missions. Plans for future missions must include accurate assessment of the waste products to be generated, and the methods for processing and disposing of these wastes.

Food Packaging↗

Drag-Free Performance of the ST7 Disturbance Reduction System Flight Experiment on the LISA Pathfinder

The Space Technology-7 Disturbance Reduction System (DRS) is an experiment package aboard the European Space Agency (ESA) LISA Pathfinder spacecraft. LISA Pathfinder launched from Kourou, French Guiana on December 3, 2015. The DRS is tasked to validate two specific technologies: colloidal micro-Newton thrusters (CMNT) to provide low-noise control capability of the spacecraft, and drag-free controlflight. This validation is performed using highly sensitive drag-free sensors, which are provided by the LISA Technology Package of the European Space Agency. The Disturbance Reduction System is required to maintain the spacecrafts position with respect to a free-floating test mass to better than 10nm/(square root of Hz), along its sensitive axis (axis in optical metrology). It also has a goal of limiting the residual accelerations of any of the two test masses to below 30 x 10(exp -14) (1 + ([f/3 mHz](exp 2))) m/sq s/(square root of Hz), over the frequency range of 1 to 30 mHz.This paper briefly describes the design and the expected on-orbit performance of the control system for the two modes wherein the drag-free performance requirements are verified. The on-orbit performance of these modes are then compared to the requirements, as well as to the expected performance, and discussed.

Attitude Control↗

Drag-Free Performance of the ST7 Disturbance Reduction System Flight Experiment on the LISA Pathfinder

The Space Technology-7 Disturbance Reduction System (DRS) is an experiment package aboard the European Space Agency (ESA) LISA Pathfinder spacecraft. LISA Pathfinder launched from Kourou, French Guiana on December 3, 2015. The DRS is tasked to validate two specific technologies: colloidal micro-Newton thrusters (CMNT) to provide low-noise control capability of the spacecraft, and drag-free control flight. This validation is performed using highly sensitive drag-free sensors, which are provided by the LISA Technology Package of the European Space Agency. The Disturbance Reduction System is required to maintain the spacecrafts position with respect to a free-floating test mass to better than 10nmHz, along its sensitive axis (axis in optical metrology). It also has a goal of limiting the residual accelerations of any of the two test masses to below 30 (1 + [f3 mHz]) fmsHz, over the frequency range of 1 to 30 mHz.This paper briefly describes the design and the expected on-orbit performance of the control system for the two modes wherein the drag-free performance requirements are verified. The on-orbit performance of these modes are then compared to the requirements, as well as to the expected performance, and discussed.

Attitude Control↗

3D Chip Scale Package (CSP)

Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.

Chip Scale Packaging (CSP) 3D CSP Stack TSOP D2CSP↗

Integration of Product, Package, Process, and Environment: A Food System Optimization

The food systems slated for future NASA missions must meet crew nutritional needs, be acceptable for consumption, and use resources efficiently. Although the current food system of prepackaged, moderately stabilized food items works well for International Space Station (ISS) missions, many of the current space menu items do not maintain acceptability and/or nutritive value beyond 2 years. Longer space missions require that the food system can sustain the crew for 3 to 5 years without replenishment. The task "Integration of Product, Package, Process, and Environment: A Food System Optimization" has the objective of optimizing food-product shelf life for the space-food system through product recipe adjustments, new packaging and processing technologies, and modified storage conditions. Two emergent food processing technologies were examined to identify a pathway to stable, wet-pack foods without the detrimental color and texture effects. Both microwave-assisted thermal sterilization (MATS) and pressure-assisted thermal stabilization (PATS) were evaluated against traditional retort processing to determine if lower heat inputs during processing would produce a product with higher micronutrient quality and longer shelf life. While MATS products did have brighter color and better texture initially, the advantages were not sustained. The non-metallized packaging film used in the process likely provided inadequate oxygen barrier. No difference in vitamin stability was evident between MATS and retort processed foods. Similarly, fruit products produced using PATS showed improved color and texture through 3 years of storage compared to retort fruit, but the vitamin stability was not improved. The final processing study involved freeze drying. Five processing factors were tested in factorial design to assess potential impact of each to the quality of freeze-dried food, including the integrity of the microstructure. The initial freezing rate and primary freeze drying temperature and pressure were linked to final product quality in freeze-dried corn, indicating processing modifications that could lead to improved product shelf life. Storage temperatures and packaging systems were also assessed for the impact to food quality. Reduced temperature storage had inconclusive impact to the progression of rancidity in butter cookies. Frozen storage was detrimental to fruit and vegetable textural attributes but refrigerated storage helped to sustain color and organoleptic ratings for plant-based foods. With regard to packaging systems, the metallized film overwrap significantly decreased the progression of the rancidity of butter cookies as compared to the highest barrier non-metallized film. The inclusion of oxygen scavengers resulted in noticeable moisture gains in butter cookies over time, independent of packaging film systems. Neither emergent processing technology nor the freeze dry optimization resulted in compelling quality differences from current space food provisions such that a five-year shelf life is likely with these processing changes alone. Using a combination of refrigeration and PATS processing is expected to result in organoleptically-acceptable fruit quality for most fruits through five years. The vitamin degradation will be aided somewhat by the cold temperatures but, given the labile nature of vitamin C, a more stable fortification method, such as encapsulation, should also be investigated to ensure vitamin delivery throughout the product life. Similarly, significant improvement to the packaging film used in the MATS processing, optimization of formulation for dielectric properties, vitamin fortification, and reduced temperature storage should be investigated as a hurdle approach to reach a five year shelf life in wet-pack entrees and soups. Baked goods and other environmentally-sensitive spaceflight foods will require an almost impenetrable barrier to protect the foods from oxygen and moisture ingress but scavengers and reduced storage temperature did not improve baked good shelf life and are not recommended at this time for these foods.

Cooper, Maya R.↗

Design requirements for SRB production control system. Volume 3: Package evaluation, modification and hardware

The software package evaluation was designed to analyze commercially available, field-proven, production control or manufacturing resource planning management technology and software package. The analysis was conducted by comparing SRB production control software requirements and conceptual system design to software package capabilities. The methodology of evaluation and the findings at each stage of evaluation are described. Topics covered include: vendor listing; request for information (RFI) document; RFI response rate and quality; RFI evaluation process; and capabilities versus requirements.

Source record↗

Microelectronics on ATS

Fabrication, packaging, and testing of microelectronic equipment for Applications Technology Satellite /ATS/ scientific experimental package

ELECTRONIC PACKAGING↗

Technology transfer initiatives

This report summarizes the University of Alabama in Huntsville (UAH) technology transfer activities with the Marshall Space Flight Center (MSFC) for the period of April 1993 through December 1993. Early in 1993, the MSFC/TUO and UAH conceived of the concept of developing stand-alone, integrated data packages on MSFC technology that would serve industrial needs previously determined to be critical. Furthermore, after reviewing over 500 problem statements received by MSFC, it became obvious that many of these requests could be satisfied by a standard type of response. As a result, UAH has developed two critical area response (CAR) packages: CFC (chlorofluorocarbon) replacements and modular manufacturing and simulation. Publicity included news releases, seminars, articles and conference papers. The Huntsville Chamber of Commerce established the Technology Transfer Subcommittee with the charge to identify approaches for the Chamber to assist its members, as well as non-members, access to the technologies at the federal laboratories in North Alabama. The Birmingham Chamber of Commerce has expressed interest in establishing a similar technology transfer program. This report concludes with a section containing a tabulation of the problem statements, including CAR packages, submitted to MSFC from January 1992 through December 1993.

Mccain, Wayne↗

Performance characteristics of the 12 GHz, 200 watt Transmitter Experiment Package for CTS

Measured performance characteristics from ground test of the Transmitter Experiment Package (TEP) for the Communications Technology Satellite are presented. The experiment package consists of a 200 W Output Stage Tube (OST) powered by a Power Processing System (PPS). Descriptions of both the PPS and OST are given. The PPS provides the necessary voltages with a measured dc/dc conversion efficiency of 89 per cent. The OST, a traveling wave tube with multiple collectors, has a saturated rf output power of 224 W and operates at an overall efficiency exceeding 40 per cent over an 85 MHz bandwidth at 12 GHz. OST performance given includes frequency response, saturation characteristics, group delay, AM to PM conversion, intermodulation distortion, and two channel gain suppression. Single and dual channel FM video performance is presented. It was determined that for 12 MHz peak to peak frequency deviation on each channel, dual channel FM television signals can be transmitted through the TEP at 60 W, each channel, with 40 MHz channel spacing (center to center).

Miller, E. F.↗

Fiber optic sensors IV; Proceedings of the Third European Congress on Optics, The Hague, Netherlands, Mar. 13, 14, 1990

Recent advances in fiber-optic sensor (FOS) technology are examined in reviews and reports. Sections are devoted to components for FOSs, special fibers for FOSs, interferometry, FOS applications, and sensing principles and influence. Particular attention is given to solder glass sealing technology for FOS packaging, the design of optical-fiber current sensors, pressure and temperature effects on beat length in highly birefringent optical fibers, a pressure FOS based on vibrating-quartz-crystal technology, remote sensing of flammable gases using a fluoride-fiber evanescent probe, a displacement sensor with electronically scanned white-light interferometer, the use of multimode laser diodes in low-coherence coupled-cavity interferometry, electronic speckle interferometry compensated for environmentally induced phase noise, a dual-resolution noncontact vibration and displacement sensor based on a two-wavelength source, and fiber optics in composite materials.

Kersten, Ralf T.↗