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The NASA requirements for assuring reliable rigid printed wiring board design are prescribed. Basic considerations necessary to assure reliable rigid printed wiring board design are described and incorporated.
In this reliability life cycle evaluation of the SpaceCube 2.0 processor card, a partially populated version of the card is being evaluated to determine its durability with respect to typical GSFC mission loads.
In order to maintain the high standards of the NASA conformal coating and staking program, this publication: prescribes NASA's requirements for assuring reliable conformal coating and staking for printed wiring boards and electronic assemblies; describes and incorporates basic considerations necessary to assure reliable conformal coating and staking; establishes the supplier's responsibility to train and certify personnel; provides for supplier documentation of the fabrication and inspection procedures to be used for NASA work, including supplier innovations and changes in technology; and provides visual workmanship standards to aid those responsible for determining quality conformance to the established requirements.
The High-Luminosity LHC will continue exploring physics beyond the standard model with proton-proton collisions at ten times the luminosity of previous LHC runs. The physics program depends on precise measurements of charged particles near the beams. The CMS experiment will use layers of high-granularity hybrid silicon pixel detectors. Pixelation is achieved by bonding silicon to tiny electrodes, which are directly connected to the specially designed integrated circuit, CROCv2. Pixel detector components are in the pre-production phase, and evaluating prototypes of sensor-chip assemblies from different vendors provides quick feedback and improves reliability during production. This article presents the efforts to test the viability of bare detector assemblies using a manual probe station and electronic charge-injection methods.
Advanced On-board Processor the (AOP) uses large scale integration throughout and is the most advanced space qualified computer of its class in existence today. It was designed to satisfy most spacecraft requirements which are anticipated over the next several years. The AOP design utilizes custom metallized multigate arrays (CMMA) which have been designed specifically for this computer. This approach provides the most efficient use of circuits, reduces volume, weight, assembly costs and provides for a significant increase in reliability by the significant reduction in conventional circuit interconnections. The required 69 CMMA packages are assembled on a single multilayer printed circuit board which together with associated connectors constitutes the complete AOP. This approach also reduces conventional interconnections thus further reducing weight, volume and assembly costs.
An experimental approach is presented for identifying the scaling laws for polymer chains grafted onto gold nanoparticles. Poly(ethylene oxide) of various molecular weights are grafted onto gold nanoparticles via thiol end-functional groups. The polymer-grafted nanoparticles are self-assembled into monolayers from solvents of different quality. Over a significant range of graft densities, nanoparticle monolayers deposited from good (athermal) solvent exhibit particle spacing that scales according to theoretical predictions for chains in dilute solution. This unexpected result for ordered nanoparticle monolayers is discussed in the context of the deposition process. In monolayers deposited from theta solvent, molecular weight scaling of particle spacing breaks down, possibly due to chain length dependence of solvent quality. In poor solvent, the structure of nanoparticle assemblies is not sufficiently ordered to obtain reliable measurements, possibly due to loss of nanoparticle dispersion. This approach opens up the possibility for accurate measurement of the effect of solvent on grafted chain scaling in nanoparticle assemblies.
Adhesives and adhesive joints are widely used in various industrial applications to reduce weight and costs, and to increase reliability. For example, advances in aerospace technology have been made possible, in part, through the use of lightweight materials and weight-saving structural designs. Joints, in particular, have been and continue to be areas in which weight can be trimmed from an airframe through the use of novel attachment techniques. In order to save weight over traditional riveted designs, to avoid the introduction of stress concentrations associated with rivet holes, and to take full advantage of advanced composite materials, engineers and designers have been specifying an ever-increasing number of adhesively bonded joints for use on airframes. Nondestructive characterization for quality control and remaining life prediction has been a key enabling technology for the effective use of adhesive joints. Conventional linear ultrasonic techniques generally can only detect flaws (delamination, cracks, voids, etc) in the joint assembly. However, more important to structural reliability is the bond strength. Although strength, in principle, cannot be measured nondestructively, a slight change in material nonlinearity may indicate the onset of failure. Furthermore, microstructural variations due to aging or under-curing may also cause changes in the third order elastic constants, which are related to the ultrasonic nonlinear parameter of the polymer adhesive. It is therefore reasonable to anticipate a correlation between changes in the ultrasonic nonlinear acoustic parameter and the remaining bond strength. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasonic wave passes through a nonlinear material. It seems that such nonlinearity can be effectively used to characterize bond strength. Several theories have been developed to model this nonlinear effect. Based on a microscopic description of the nonlinear interface binding force, a quantitative method was presented. Recently, a comparison between the experimental and simulated results based on a similar theoretical model was presented. A through-transmission setup for water immersion mode-converted shear waves was used to analyze the ultrasonic nonlinear parameter of an adhesive bond. In addition, ultrasonic guided waves have been used to analyze adhesive or diffusion bonded joints. In this paper, the ultrasonic nonlinear parameter is used to characterize the curing state of a polymer/aluminum adhesive joint. Ultrasonic through-transmission tests were conducted on samples cured under various conditions. The magnitude of the second order harmonic was measured and the corresponding ultrasonic nonlinear parameter was evaluated. A fairly good correlation between the curing condition and the nonlinear parameter is observed. The results show that the nonlinear parameter might be used as a good indicator of the cure state for adhesive joints.
The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.
Estimating the probability of failure for complex real-world systems using high-fidelity computational models is often prohibitively expensive, especially when the probability is small. Exploiting low-fidelity models can make this process more feasible, but merging information from multiple low-fidelity and high-fidelity models poses several challenges. Here, this paper presents a robust multi-fidelity surrogate modeling strategy in which the multi-fidelity surrogate is assembled using an active learning strategy using an on-the-fly model adequacy assessment set within a subset simulation framework for efficient reliability analysis. The multi-fidelity surrogate is assembled by first applying a Gaussian process correction to each low-fidelity model and assigning a model probability based on the model's local predictive accuracy and cost. Three strategies are proposed to fuse these individual surrogates into an overall surrogate model based on model averaging and deterministic/stochastic model selection. The strategies also dictate which model evaluations are necessary. No assumptions are made about the relationships between low-fidelity models, while the high-fidelity model is assumed to be the most accurate and most computationally expensive model. Through two analytical and two numerical case studies, including a case study evaluating the failure probability of Tristructural isotropic-coated (TRISO) nuclear fuels, the algorithm is shown to be highly accurate while drastically reducing the number of high-fidelity model calls (and hence computational cost).
A probabilistic analysis, using the 2-parameter Weibull-Johnson method, was performed on experimental life test data from space shuttle actuator bearings. Experiments were performed on a test rig under simulated conditions to determine the life and failure mechanism of the grease lubricated bearings that support the input shaft of the space shuttle body flap actuators. The failure mechanism was wear that can cause loss of bearing preload. These tests established life and reliability data for both shuttle flight and ground operation. Test data were used to estimate the failure rate and reliability as a function of the number of shuttle missions flown. The Weibull analysis of the test data for a 2-bearing shaft assembly in each body flap actuator established a reliability level of 99.6 percent for a life of 12 missions. A probabilistic system analysis for four shuttles, each of which has four actuators, predicts a single bearing failure in one actuator of one shuttle after 22 missions (a total of 88 missions for a 4-shuttle fleet). This prediction is comparable with actual shuttle flight history in which a single actuator bearing was found to have failed by wear at 20 missions.
Silicon carbide (SiC) power transistors are used in the main traction inverter of electric vehicles (EVs). Tesla began installing SiC power MOSFETs in 2017, and has now produced 4.8 million EVs containing over 169 million SiC power MOSFETs. Looking ahead, the worldwide EV market is projected to exceed 50 million vehicles per year by 2030 (Reuters, Oct. 25, 2022). This will create a demand for over two billion SiC power MOSFETs per year. Our program aims to double the efficiency of today's commercial power MOSFETs. This will cut the number of MOSFETs per EV in half, reducing cost, simplifying assembly, decreasing weight, and increasing vehicle reliability through reduced parts count. Our approach is to apply innovative design and advanced processing to increase the density of current-controlling channels in SiC power MOSFET. We have developed two new MOSFET devices, each of which increases the channel density by a factor of six over today's best commercial MOSFETs. This required implementing new fabrication processes, creating new device designs, and integrating the processing steps and device designs into a manufacturable technology. In this project we have developed two innovative devices: (i) a novel three-dimensional structure, the "tri-gate MOSFET," and (ii) a deeply-scaled, fully self-aligned trench MOSFET, the "IMOSFET". Both products were experimentally demonstrated during this project and meet the program goals of increased efficiency relative to the current state-of-the art commercial products. In the process we have generated significant IP, with two US patents issued and three applications pending. We have also published three journal articles and given reports on this technology at seven international conferences. The success of this program has led to significant follow-on funding from industry. In May 2023 Purdue University signed a five-year R&D contract with GlobalFoundries to transfer our novel technology to commercial production. With headquarters in Malta, NY, Global Foundries is one of the largest pure-play silicon foundries in the world, with annual revenue of $\$$8.1B. Their SiC foundry will be built around the next-generation 200-mm diameter SiC wafers, which will double the number of die per wafer and reduce per-die production cost.
Reliability study of jet pipe, armature assembly, and torque motor for hydraulic servovalve development
Higher order software (HOS) is concerned only with computable functions and relationships. The HOS methodology can be used for the definition of software for multiprogrammed, multiprocessor, or multicomputer systems. A description of HOS methodology is presented, giving attention to questions of formulation, interface correctness, specification language principles, and HOS analyzers. Aspects of system design are considered, and details of software management are discussed. Attention is given to modularity as defined by HOS, frozen module management, the assembly control supervisor, and aspects of reliability and efficiency.
Modular system changes its architecture to maximize either reliability or capacity. Reconfigurable computer is assembled from four kinds of modules: organizer/scheduler, memory, input/output processor, and central processor. Reconfiguration is initiated by a signal from a control panel or by fault interrupt from one of the modules.
The focus of the NASA 'Space Flight Risk Data Collection and Analysis' project was to acquire and evaluate space flight data with the express purpose of establishing a database containing measurements of specific risk assessment - reliability - availability - maintainability - supportability (RRAMS) parameters. The developed comprehensive RRAMS database will support the performance of future NASA and aerospace industry risk and reliability studies. One of the primary goals has been to acquire unprocessed information relating to the reliability and availability of launch vehicles and the subsystems and components thereof from the 45th Space Wing (formerly Eastern Space and Missile Command -ESMC) at Patrick Air Force Base. After evaluating and analyzing this information, it was encoded in terms of parameters pertinent to ascertaining reliability and availability statistics, and then assembled into an appropriate database structure.
A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.
An investigation was conducted to survey anticipated requirements for solid lubricants in lunar and Martian environments, as well as the effects of these environments on lubricants and their performance and durability. The success of habitats and vehicles on the Moon and Mars, and ultimately, of the human exploration of and permanent human presence on the Moon and Mars, are critically dependent on the correct and reliable operation of many moving mechanical assemblies and tribological components. The coefficient of friction and lifetime of any lubricant generally vary with the environment, and lubricants have very different characteristics under different conditions. It is essential, therefore, to select the right lubrication technique and lubricant for each mechanical and tribological application. Several environmental factors are hazardous to performance integrity on the Moon and Mars. Potential threats common to both the Moon and Mars are low ambient temperatures, wide daily temperature swings (thermal cycling), solar flux, cosmic radiation, and large quantities of dust. The surface of Mars has the additional challenges of dust storms, winds, and a carbon dioxide atmosphere. Solid lubricants and coatings are needed for lunar and Martian applications, where liquid lubricants are ineffective and undesirable, and these lubricants must perform well in the extreme environments of the Moon, Mars, and space, as well as on Earth, where they will be assembled and tested. No solid lubricants and coatings and their systems currently exist or have been validated that meet these requirements, so new solid lubricants must be designed and validated for these applications.