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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11

UV-Induced Reaction Pathways in Bromoform Probed with Ultrafast Electron Diffraction

For many chemical reactions, it remains notoriously difficult to predict and experimentally determine the rates and branching ratios between different reaction channels. This is particularly the case for reactions involving short-lived intermediates, whose observation requires ultrafast methods. The UV photochemistry of bromoform (CHBr 3 ) is among the most intensely studied photoreactions. Yet, a detailed understanding of the chemical pathways leading to the production of atomic Br and molecular Br 2 fragments has proven challenging. In particular, the role of isomerization and/or roaming and their competition with direct C–Br bond scission has been a matter of continued debate. Here, in this work, gas-phase ultrafast megaelectronvolt electron diffraction (MeV-UED) is used to directly study structural dynamics in bromoform after single 267 nm photon excitation with femtosecond temporal resolution. The results show unambiguously that isomerization contributes significantly to the early stages of the UV photochemistry of bromoform. In addition to direct C–Br bond breaking within <200 fs, formation of iso-CHBr 3 (Br-CH-Br-Br) is observed on the same time scale and with an isomer lifetime of >1.1 ps. The branching ratio between direct dissociation and isomerization is determined to be 0.4 ± 0.2:0.6 ± 0.2, i.e., approximately 60% of molecules undergo isomerization within the first few hundred femtoseconds after UV excitation. The structure and time of formation of iso-CHBr 3 compare favorably with the results of an ab initio molecular dynamics simulation. The lifetime and interatomic distances of the isomer are consistent with the involvement of a roaming reaction mechanism.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Shape Bonding method

The present invention is directed to a method of bonding at least two surfaces together. The methods step of the present invention include applying a strip of adhesive to a first surface along a predefined outer boundary of a bond area and thereby defining a remaining open area there within. A second surface, or gusset plate, is affixed onto the adhesive before the adhesive cures. The strip of adhesive is allowed to cure and then a second amount of adhesive is applied to cover the remaining open area and substantially fill a void between said first and second surfaces about said bond area. A stencil may be used to precisely apply the strip of adhesive. When the strip cures, it acts as a dam to prevent overflow of the subsequent application of adhesive to undesired areas. The method results in a precise bond area free of undesired shapes and of a preferred profile which eliminate the drawbacks of the prior art bonds.

Pontius, James T.↗

Spatial Mapping of Valence Excited-State Landscapes Using Time-Resolved Shake-Down Spectroscopy

Time-resolved X-ray photoelectron spectroscopy (XPS) is used to track the photodissociation dynamics of 2-iodothiophene following 262 nm excitation. The transient XPS features include both direct ionization of the initially populated excited states and pronounced satellite peaks arising from shake-down processes. While the direct ionization signals exhibit only minimal energy shifts during C−I bond cleavage, the shake-down transitions undergo a substantial, 5 eV, shift over the reaction coordinate. By correlating these shifts with simulated C−I bond lengths, a direct structural mapping is established that reveals the exceptional sensitivity of shake-down channels to molecular geometry. These results demonstrate that shake-down transitions provide a new and powerful probe of ultrafast structural dynamics.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Rapid adhesive bonding concepts

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.

Stein, B. A.↗

Rapid adhesive bonding and field repair of aerospace materials

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

Stein, B. A.↗

RSRM nozzle fixed housing cooldown test

Flight 5 aft segments with nozzles were exposed to -17 F temperatures while awaiting shipment to KSC in February, 1989. No records were found which show that any previous nozzles were exposed to air temperatures as low as those seen by the Flight 5 nozzles. Thermal analysis shows that the temperature of the fixed housing, and forward and aft exit cone components dropped as low as -10 F. Structural analysis of the nozzles at these low temperatures show the forward and aft exit cone adhesive bonds to have a positive margin of safety, based on a 2.0 safety factor. These analyses show the normal and shear stresses in the fixed housing bond as low values. However, the hoop and meridinal stresses were predicted to be in the 4000 psi range; the failure stress allowable of EA913NA adhesive at -7 F. If the bonds did break in directions perpendicular to the surfaces, called bond crazing, no normal bond strength would be lost. Testing was conducted in two phases, showing that no degradation to the adhesive bonds occurred while the Flight 5 nozzles were subjected to subzero temperatures. The results of these tests are documented. Phase 1 testing cooled a full-scale RSRM insulated fixed housing to -13 F, with extensive bondline inspections. Phase 2 testing cooled the witness panel adhesive tensile buttions to -13 F, with failure strengths recorded before, during, and after the cooldown.

Bolieau, D. J.↗

Assessing subtle variations in the actinyl oxo reactivity through characterization of neptunyl complexes. Final Report

Formation of the actinyl cation, [An(V,VI)O 2 ] n+ (n = 1,2), imparts unique chemical properties to the lighter actinide elements (U, Np, and Pu) that has yet to be fully understood. The axial O atoms (oxo) of the [An(VI)O 2 ] 2+ are considered weak Lewis bases that exhibit only meager interact with other metal cations and regarded as poor hydrogen acceptors for nearby water molecules. Oxo atoms of [An(V)O 2 ] + should engage in stronger bonding interactions due to a higher degree of Lewis basicity, but the actual interactions have yet to be fully explored. Intermolecular interactions can impact radionuclide separations, corrosion of spent fuel, and mobility of actinides in environmental systems; there is, therefore, a critical need to understand how the subtle difference in electronic properties of the An(V) and An(VI) metal center influence actinyl chemistry. The objective of this proposal was to determine the chemical components that influence the intermolecular interactions occurring between neptunyl ([Np(V)O 2 ] + and [Np(VI)O 2 ] 2+ ) cations and neighboring species. My overall hypothesis was that the intermolecular attraction that occurs between the neptunyl oxo atoms and neighboring species (H atoms, low-valent cations, actinyl cations) is primarily controlled by the electronic properties of the actinyl cation, but can be further influenced by the electron donating properties of the equatorial ligands. The hypothesis was tested through the following research objectives: (1) Determine the fundamental differences in H-bonding between Np(V)O 2+ and Np(VI)O 2 2+ and neighboring donor molecules; (2) Identify the major differences in bonding between low-valence metal cations and neptunyl oxo groups, and (3) Assess the impact of the equatorial ligand on the formation of cation-cation interactions within molecular species. Major outcomes of the research include: (1) More precisely identifying oxo interactions (actinyl-cation; actinyl-actinyl, actinyl-hydrogen) and the factors that impact the vibrational modes for actinyl cation; (2) Identification of H-bonding modes for the [An(V,VI)O 2 ] n+ (n = 1,2), with direct H-bonding interactions to the oxo group of the Np(V)O 2+ cation more prevalent than in hexavalent species and recognition of the importance of H-bonding networks, that can impart bond asymmetry and activation of vibrational modes with the actinyl moiety; (3) Delineation of the importance of charge density for engaging the cation-oxo interaction for both pentavalent and hexavalent species; (4) Determining the importance of sterics and ligand binding in formation of specific actinyl-actinyl interactions and the resulting vibrational modes associated with this bonding motify and (5) Understanding how the functionalization of the ligand can impact redox stability of neptunyl cations. Deliverables from this work include 11 peer-reviewed manuscripts and 13 (including six by graduate students) oral/poster presentations.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Electronic density of states as the descriptor of elastic bond strength, ductility, and local lattice distortion in BCC refractory alloys

Although electronic density of states (DOS) is fundamental to materials properties, its general relationship to mechanical properties of alloys is not well established. In this paper, using density functional theory (DFT) calculations, we show that the electronic occupancy at the Fermi level, N(E f ), obtained from DOS is a key descriptor of alloy strength and ductility. Our comprehensive analysis of numerous body centered cubic (BCC) refractory high entropy alloys (RHEAs) shows an overwhelming correlation that low N(E f ) indicates strong bonds that have high stiffness resulting in high elastic constants. High bond stiffness indicates presence of covalent nature of bonds that are directional in nature resulting in resistance to deformation leading to high bulk (B) and shear (G) moduli. Consequently, N(E f ) provides a direct correlation to the tendency of alloy ductility evidenced in the Pugh ratio (G/B). As stiffer bonds result in lower local lattice distortion (LLD), N(E f ) are LLD are also found to be corelated which opens up a correlation to solid solution strengthening and yield strength. Thus, this work unveils fundamental correlations between N(E f ) and (1) elastic bond strength, (2) ductility, and (3) LLD. These correlations open opportunities for the design of high strength high ductile RHEAs.

36 MATERIALS SCIENCE↗

Equipment and techniques for rapid bonding of composites

Rapid adhesive bonding concepts have been developed at NASA Langley which employ induction heating of thermoplastic composite matrices directly along the bond line and/or adherends without heating the entire structure, the supports, and the fixtures of the bonding assembly. Short term thermal cycling and water boil exposures have shown encouraging environmental stability for these rapid bonds. These bonding techniques have been extended to continuous seam bonding of metallic and composite panels with promising results for the bonding of both like and unlike adherends; the portability of the apparatus suggests that field repairs of damaged structures are possible.

Buckley, John D.↗

Rapid induction bonding of composites, plastics, and metals

The Toroid Bonding Gun is and induction heating device. It is a self contained, portable, low powered induction welding system developed for bonding or joining plastic, ceramic, or metallic parts. Structures can be bonded in a factory or in a the field. This type of equipment allows for applying heat directly to the bond lines and/or to the adhesives without heating the entire structure, supports, and fixtures of a bonding assembly. The induction heating gun originally developed for use in the fabrication of space Gangs of bonders are now used to rapidly join composite sheet and structural components. Other NASA-developed applications of this bonding technique include the joining of thermoplastic composites, thermosetting composites, metals, and combinations of these materials.

Buckley, John D.↗

Tuning hydrogenation chemistry of Pd-based heterogeneous catalysts by introducing homogeneous-like ligands

Abstract Noble metals have been extensively employed in a variety of hydrotreating catalyst systems for their featured functionality of hydrogen activation but may also bring side reactions such as undesired deep hydrogenation. It is crucial to develop a viable approach to selectively inhibit side reactions while preserving beneficial functionalities. Herein, we present modifying Pd with alkenyl-type ligands that forms homogeneous-like Pd-alkene metallacycle structure on the heterogeneous Pd catalyst to achieve the selective hydrogenolysis and hydrogenation. Particularly, a doped alkenyl-type carbon ligand on Pd-Fe catalyst is demonstrated to donate electrons to Pd, creating an electron-rich environment that elongates the distance and weakens the electronic interaction between Pd and unsaturated C of the reactants/products to control the hydrogenation chemistry. Moreover, high H 2 activation capability is maintained over Pd and the activated H is transferred to Fe to facilitate C-O bond cleavage or directly participate in the reaction on Pd. The modified Pd-Fe catalyst displays comparable C-O bond cleavage rate but much higher selectivity (>90%) than the bare Pd-Fe (<50%) in hydrotreating of diphenyl ether (DPE, modelling the strongest C-O linkage in lignin) and enhanced ethene selectivity (>90%) in acetylene hydrogenation. This work sheds light on the controlled synthesis of selective hydrotreating catalysts via mimicking homogeneous analogues.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Joining Techniques for Novel Metal Polymer Hybrid Heat Exchangers

In the United States, over 50% of the unrecovered energy from industrial processes is in the form of low-grade heat (< 220°C). Materials and maintenance costs of common heat exchangers are typically too high to justify their usage. Polymers, though more affordable, are usually unsuitable for HX applications due to their low thermal conductivity (~0.2 W/mK). Here, we show that metal-polymer hybrids may be attractive from both performance and cost perspectives. The use of polymers further increases the resistance to corrosion by sulfuric and carbonic acids often present in flue gases. An ongoing work explores different configurations of layered polyimide-copper macroscale hybrids for heat exchanger applications using numerical simulations. This paper explores a manufacturing pathway for producing such layered hybrid tubes that involves directly rolling and bonding tapes made of polymer and copper foil into tubes. A critical problem in the fabrication process is the bonding of metal and polymers. We explore approaches involving adhesives (epoxy, acrylic and silicone) for metal/polymer interfaces and direct welding (ultrasonic) for metal/metal interfaces that can be integrated into the manufacturing process. We report characterizations of the thermomechanical properties of these joining processes. This work paves the way for realizing cost-effective manufacturing of heat exchangers for low grade waste heat recovery.

Kuntumalla, Gowtham↗

Direct measurements for the kinetics of C–C bond fission in the high temperature decomposition of isopropanol

The thermal decomposition of isopropanol was studied experimentally and theoretically with a view to isolate and directly measure rate coefficients for the dominant radical channel in this multi-channel process. Two complementary shock tube methods, laser schlieren densitomtery and H-atom atomic resonance absorption spectroscopy, were used to obtain rate coefficents for the C–C bond fission channel. The experimental ranges span temperatures from 1200–2100 K and pressures between 30–690 torr. These are the most direct measurements of this rate coefficent in the fall-off regime of relevance to high-temperature reacting systems. Theoretical studies also performed in this work confirm that the title reaction and a molecular elimination involving dehydration were the sole unimolecular processes at high temperatures. A master equation analysis yielded k ( T, P ) for the C–C fission and these are shown to be in good agreement with the present experimental measurements. Comparisons with prior experimental and theoretical studies in the literature indicate branching ratios as well as absolute k ( T, P ) for C–C bond-fission have been under-predicted for this decomposition reaction. Consequently, results from the present studies place an increased emphasis on radical-driven secondary processes in high-temperature pyrolysis of this simplest secondary alcohol.

Kim, John H. [Univ. of Michigan, Ann Arbor, MI (Un↗

Systems and methods for abrasive oxide removal in additive manufacturing processes

Systems and methods for removing an oxide layer in an additive manufacturing process are provided. A direct write machine may be used to create wire bonds for semiconductors. The direct write machine may deposit a conductive print material between bond pads to create interconnections. The bond pads may comprise aluminum and an aluminum oxide layer on an outer surface. The presence of an aluminum oxide layer may decrease the electrical connection between the wire bond and the aluminum substrate. To remove the aluminum oxide layer, an abrasive tool is provided to ultrasonically abrade the aluminum oxide layer while the conductive print material is being deposited. The conductive print material may include abrasive additives materials to further aid in abrading the aluminum oxide layer.

Young, Barbara D.↗

Curvature-induced hydrophobicity at imogolite–water interfaces

Imogolite, a nanotubular aluminosilicate mineral, is commonly found in volcanic soils, where it exerts a control on carbon dynamics. Synthetic imogolites are used for the removal of contaminants from industrial effluents and are considered for a range of other applications including gas adsorption and functionalised heterogeneous catalysts. In spite of their environmental and industrial relevance, the properties of imogolite–water interfaces remain poorly understood. In this work, an experimental and computational study is presented in which the structure and energetics of water are characterized on the curved external surface of imogolite and the hydrophilicity of this surface is contrasted with that of gibbsite, its planar counterpart. Atomic force spectroscopy experiments show that in spite of their identical surface structure, imogolite has a lower hygroscopicity than gibbsite. Molecular dynamics simulations provide an explanation for this observation: the curvature of imogolite prevents the formation of in-plane H-bonds along the directions of the nanotube circumference, lowering the enthalpy of adsorption of water molecules. The different arrangement of surface H-bonds and the resulting differences in hydration properties also affects the acidity constants of surface hydroxyl groups. This ‘nanotube effect’ may be relevant to other nanotubular systems with high curvatures, potentially impacting their wetting properties, their colloidal stability and their affinity towards hydrophobic organic moieties.

36 MATERIALS SCIENCE↗

Surface Functionalization of Black Phosphorus with Nitrenes: Identification of P=N Bonds by Using Isotopic Labeling

Abstract Surface functionalization of two‐dimensional crystals is a key path to tuning their intrinsic physical and chemical properties. However, synthetic protocols and experimental strategies to directly probe chemical bonding in modified surfaces are scarce. Introduced herein is a mild, surface‐specific protocol for the surface functionalization of few‐layer black phosphorus nanosheets using a family of photolytically generated nitrenes (RN) from the corresponding azides. By embedding spectroscopic tags in the organic backbone, a multitude of characterization techniques are employed to investigate in detail the chemical structure of the modified nanosheets, including vibrational, X‐ray photoelectron, solid state 31 P NMR, and UV‐vis spectroscopy. To directly probe the functional groups introduced on the surface, R fragments were selected such that in conjunction with vibrational spectroscopy, 15 N‐labeling experiments, and DFT methods, diagnostic P=N vibrational modes indicative of iminophosphorane units on the nanosheet surface could be conclusively identified.

Walz Mitra, Kendahl L.↗

Removing Bonded Integrated Circuits From Boards

Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

Rice, John T.↗

Nonenzymatic, template-directed ligation of oligoribonucleotides is highly regioselective for the formation of 3'-5' phosphodiester bonds

We have found that nonenzymatic, template-directed ligation reactions of oligoribonucleotides display high selectivity for the formation of 3'-5' rather than 2'-5' phosphodiester bonds. Formation of the 3'-5'-linked product is favored regardless of the metal ion catalyst or the leaving group, and for several different ligation junction sequences. The degree of selectivity depends on the leaving group: the ratio of 3'-5'- to 2'-5'-linked products was 10-15:1 when the 5'-phosphate was activated as the imidazolide, and 60-80:1 when the 5'-phosphate was activated by the formation of a 5'-triphosphate. Comparison of oligonucleotide ligation reactions with previously characterized single nucleotide primer extension reactions suggests that the strong preference for 3'-5'-linkages in oligonucleotide ligation is primarily due to occurence of ligation within the context of an extended Watston-Crick duplex. The ability of RNA to correctly self-assemble by template-directed ligation is an intrinsic consequence of its chemical structure and need not be imposed by an external catalyst (i.e., an enzyme polymerase); RNA therefore provides a reasonable structural basis for a self-replicating system in a prebiological world.

Non-NASA Center↗