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At least 199 records · Page 11

Advances in LADAR Components and Subsystems at Raytheon

Raytheon is developing NIR sensor chip assemblies (SCAs) for scanning and staring 3D LADAR systems. High sensitivity is obtained by integrating high performance detectors with gain, i.e., APDs with very low noise Readout Integrated Circuits (ROICs). Unique aspects of these designs include: independent acquisition (non-gated) of pulse returns, multiple pulse returns with both time and intensity reported to enable full 3D reconstruction of the image. Recent breakthrough in device design has resulted in HgCdTe APDs operating at 300K with essentially no excess noise to gains in excess of 100, low NEP <1nW and GHz bandwidths and have demonstrated linear mode photon counting. SCAs utilizing these high performance APDs have been integrated and demonstrated excellent spatial and range resolution enabling detailed 3D imagery both at short range and long ranges. In the following we will review progress in real-time 3D LADAR imaging receiver products in three areas: (1) scanning 256 x 4 configuration for the Multi-Mode Sensor Seeker (MMSS) program and (2) staring 256 x 256 configuration for the Autonomous Landing and Hazard Avoidance Technology (ALHAT) lunar landing mission and (3) Photon-Counting SCAs which have demonstrated a dramatic reduction in dark count rate due to improved design, operation and processing.

Jack, Michael↗

Integrated Radial Probe Transition From MMIC to Waveguide

A radial probe transition between a monolithic microwave integrated circuit (MMIC) and a waveguide has been designed for operation at frequency of 340 GHz and to be fabricated as part of a monolithic unit that includes the MMIC. Integrated radial probe transitions like this one are expected to be essential components of future MMIC amplifiers operating at frequencies above 200 GHz. While MMIC amplifiers for this frequency range have not yet been widely used because they have only recently been developed, there are numerous potential applications for them-- especially in scientific instruments, test equipment, radar, and millimeter-wave imaging systems for detecting hidden weapons.

Samoska, Lorene↗

Toroidal-Core Microinductors Biased by Permanent Magnets

The designs of microscopic toroidal-core inductors in integrated circuits of DC-to-DC voltage converters would be modified, according to a proposal, by filling the gaps in the cores with permanent magnets that would apply bias fluxes (see figure). The magnitudes and polarities of the bias fluxes would be tailored to counteract the DC fluxes generated by the DC components of the currents in the inductor windings, such that it would be possible to either reduce the sizes of the cores or increase the AC components of the currents in the cores without incurring adverse effects. Reducing the sizes of the cores could save significant amounts of space on integrated circuits because relative to other integrated-circuit components, microinductors occupy large areas - of the order of a square millimeter each. An important consideration in the design of such an inductor is preventing magnetic saturation of the core at current levels up to the maximum anticipated operating current. The requirement to prevent saturation, as well as other requirements and constraints upon the design of the core are expressed by several equations based on the traditional magnetic-circuit approximation. The equations involve the core and gap dimensions and the magnetic-property parameters of the core and magnet materials. The equations show that, other things remaining equal, as the maximum current is increased, one must increase the size of the core to prevent the flux density from rising to the saturation level. By using a permanent bias flux to oppose the flux generated by the DC component of the current, one would reduce the net DC component of flux in the core, making it possible to reduce the core size needed to prevent the total flux density (sum of DC and AC components) from rising to the saturation level. Alternatively, one could take advantage of the reduction of the net DC component of flux by increasing the allowable AC component of flux and the corresponding AC component of current. In either case, permanent-magnet material and the slant (if any) and thickness of the gap must be chosen according to the equations to obtain the required bias flux. In modifying the design of the inductor, one must ensure that the inductance is not altered. The simplest way to preserve the original value of inductance would be to leave the gap dimensions unchanged and fill the gap with a permanent- magnet material that, fortuitously, would produce just the required bias flux. A more generally applicable alternative would be to partly fill either the original gap or a slightly enlarged gap with a suitable permanent-magnet material (thereby leaving a small residual gap) so that the reluctance of the resulting magnetic circuit would yield the desired inductance.

Lieneweg, Udo↗

A Low-Power Correlator ASIC for Arrays with Many Antennas

We report the design of a new application-specific integrated circuit (ASIC) for use in radio telescope correlators. It supports the construction of correlators for an arbitrarily large number of signals. The ASIC uses an intrinsically low-power architecture along with design techniques and a process that together result in unprecedentedly low power consumption. The design is flexible in that it can support telescopes with almost any number of antennas N. It is intended for use in an "FX" correlator, where a uniform filter bank breaks each signal into separate frequency channels prior to correlation.

radio telescopes↗

Calculating Second-Order Effects in MOSFET's

Collection of mathematical models includes second-order effects in n-channel, enhancement-mode, metal-oxide-semiconductor field-effect transistors (MOSFET's). When dimensions of circuit elements relatively large, effects neglected safely. However, as very-large-scale integration of microelectronic circuits leads to MOSFET's shorter or narrower than 2 micrometer, effects become significant in design and operation. Such computer programs as widely-used "Simulation Program With Integrated Circuit Emphasis, Version 2" (SPICE 2) include many of these effects. In second-order models of n-channel, enhancement-mode MOSFET, first-order gate-depletion region diminished by triangular-cross-section deletions on end and augmented by circular-wedge-cross-section bulges on sides.

Benumof, Reuben↗

Summary of process research analysis efforts

A summary of solar-cell process research analysis efforts was presented. Process design and cell design are interactive efforts where technology from integrated circuit processes and other processes are blended. The primary factors that control cell efficiency are: (1) the bulk parameters of the available sheet material, (2) the retention and enhancement of these bulk parameters, and (3) the cell design and the cost to produce versus the finished cells performance. The process sequences need to be tailored to be compatible with the sheet form, the cell shape form, and the processing equipment. New process options that require further evaluation and utilization are lasers, robotics, thermal pulse techniques, and new materials. There are numerous process control techniques that can be adapted and used that will improve product uniformity and reduced costs. Two factors that can lead to longer life modules are the use of solar cell diffusion barriers and improved encapsulation.

Burger, D. R.↗

Piggy-back mounting would increase microcircuit packaging density

Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.

Gaudiano, S.↗

Multijunction high voltage concentrator solar cells

The standard integrated circuit technology has been developed to design and fabricate new innovative planar multi-junction solar cell chips for concentrated sunlight applications. This 1 cm x 1 cm cell consisted of several voltage generating regions called unit cells which were internally connected in series within a single chip resulting in high open circuit voltages. Typical open-circuit voltages of 3.6 V and short-circuit currents of 90 ma were obtained at 80 AM1 suns. A dramatic increase in both short circuit current and open circuit voltage with increased light levels was observed.

Valco, G. J.↗

Ulysses: A functional description and simulation software system

Current design tools for digital circuits and systems are not well-integrated among the behavioral, gate, and transistor levels of design. Ulysses is a prototype software system that consists of a description language, a description compiler, and a simulator that make no distinction among these levels. The language is uniform over the entire range of logical descriptions, the description is hierarchical with no fundamental restrictions on depth or mixing of levels, and the simulator is fully integrated with the description. The structure of the language, compiler, and simulator are described in terms of their relationships to the abstractions of physical systems that are made in order to create logical descriptions and models of behavior.

Griswold, T. W.↗

NASA Langley and AF RADC high-speed fiber optic transceiver program

NASA-Langley and the USAF Rome Air Development Center have been pursuing the development of military- and space-qualified fiber optic transceivers for a variety of ground-based, space-based, and general avionic applications. An initial development pursued a design called the multipurpose fiber optic transceiver (MFOX) and provided a family of fiber optic transceivers which operated up to 1 Gb/s. Currently, a second generation of high-speed fiber optic transceivers (HSFOX) is being developed. This design will utilize an all-integrated-circuits approach in order to develop a lighter-weight, smaller-size, and more efficient transceiver. The high-speed fiber optic transceiver will be military-and-space-operating in the 0.05-5 Gb/s data rate range. The initial results of tests, performance, and availability of commercial high-speed all-integrated-circuit chipsets for fiber-optic transceivers are discussed, as well as the performance of transceivers fabricated from these chipsets.

Hendricks, Herbert D.↗

Active CPW-fed slot antennas for power combining applications

We have combined integrated circuit antenna technology with microwave oscillator design to build an active slot-oscillator. The design is planar, does not require via holes and is compatible with monolithic transistor technology. The CPW-fed antenna impedance is calculated using a full-wave analysis technique. Slot-oscillators were built at 7, 13, and 22 GHz, and the predicted oscillation frequencies agree well with experiments. The design is easily scaled to millimeter-wave frequencies and can be extended to power combining arrays.

Kormanyos, Brian K.↗

Analysis of Spaceborne GPS Systems

A reasonable amount of literature can be found on the general topic of GPS receiving antennas, but very little has been published on spaceborne GPS receiving antennas. This very new topic seems to be so far more of interest for the industrial world than for the academic community. For satellite applications, microstrip antennas are usually preferred over other types of antennas mainly because of their non-electrical characteristics, such as small size, relatively lightweight, shape, possibility of integration with microwave integrated circuits, and relatively low costs. Careful design of patch antennas could meet all the requirements (electrical and non-electrical) of GPS receiving antenna to be mounted on a tethered satellite.

Cosmo, Mario L.↗

Characterization of 720 and 940 MHz Oscillators with Chip Antenna for Wireless Sensors from Room Temperature to 200 and 250 deg C

Oscillators that operate at 720 and 940 MHz and characterized over a temperature range of 25 C to 200 C and 250 C, respectively, are presented. The oscillators are designed on alumina substrates with typical integrated circuit fabrication techniques. Cree SiC MESFETs, thin film metal-insulator-metal capacitors and spiral inductors, and Johanson miniature chip antennas make-up the circuits. The output power and phase noise are presented as a function of temperature and frequency. Index Terms MESFETS, chip antennas, oscillators SiC alumina.

Scardelletti, Maximilian C.↗

Analog Module Architecture for Space-Qualified Field-Programmable Mixed-Signal Arrays

Spacecraft require all manner of both digital and analog circuits. Onboard digital systems are constructed almost exclusively from field-programmable gate array (FPGA) circuits providing numerous advantages over discrete design including high integration density, high reliability, fast turn-around design cycle time, lower mass, volume, and power consumption, and lower parts acquisition and flight qualification costs. Analog and mixed-signal circuits perform tasks ranging from housekeeping to signal conditioning and processing. These circuits are painstakingly designed and built using discrete components due to a lack of options for field-programmability. FPAA (Field-Programmable Analog Array) and FPMA (Field-Programmable Mixed-signal Array) parts exist but not in radiation-tolerant technology and not necessarily in an architecture optimal for the design of analog circuits for spaceflight applications. This paper outlines an architecture proposed for an FPAA fabricated in an existing commercial digital CMOS process used to make radiation-tolerant antifuse-based FPGA devices. The primary concerns are the impact of the technology and the overall array architecture on the flexibility of programming, the bandwidth available for high-speed analog circuits, and the accuracy of the components for high-performance applications.

Edwards, R. Timothy↗

MMIC linear-phase and digital modulators for deep space spacecraft X-band transponder applications

The design concepts, analyses, and development of GaAs monolithic microwave integrated circuit (MMIC) linear-phase and digital modulators for the next generation of space-borne communications systems are summarized. The design approach uses a compact lumped element quadrature hybrid and Metal Semiconductor Field Effect Transistors (MESFET)-varactors to provide low loss and well-controlled phase performance for deep space transponder (DST) applications. The measured results of the MESFET-diode show a capacitance range of 2:1 under reverse bias, and a Q of 38 at 10 GHz. Three cascaded sections of hybrid-coupled reflection phase shifters were modeled and simulations performed to provide an X-band (8415 +/- 50 MHz) DST phase modulator with +/- 2.5 radians of peak phase deviation. The modulator will accommodate downlink signal modulation with composite telemetry and ranging data, with a deviation linearity tolerance of +/- 8 percent and insertion loss of less than 8 +/- 0.5 dB. The MMIC digital modulator is designed to provide greater than 10 Mb/s of bi-phase modulation at X-band.

Mysoor, Narayan R.↗