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At least 199 records · Page 11

Miniaturized Autonomous Extravehicular Robotic Camera (Mini AERCam)

The NASA Johnson Space Center (JSC) Engineering Directorate is developing the Autonomous Extravehicular Robotic Camera (AERCam), a low-volume, low-mass free-flying camera system . AERCam project team personnel recently initiated development of a miniaturized version of AERCam known as Mini AERCam. The Mini AERCam target design is a spherical "nanosatellite" free-flyer 7.5 inches in diameter and weighing 1 0 pounds. Mini AERCam is building on the success of the AERCam Sprint STS-87 flight experiment by adding new on-board sensing and processing capabilities while simultaneously reducing volume by 80%. Achieving enhanced capability in a smaller package depends on applying miniaturization technology across virtually all subsystems. Technology innovations being incorporated include micro electromechanical system (MEMS) gyros, "camera-on-a-chip" CMOS imagers, rechargeable xenon gas propulsion system , rechargeable lithium ion battery, custom avionics based on the PowerPC 740 microprocessor, GPS relative navigation, digital radio frequency communications and tracking, micropatch antennas, digital instrumentation, and dense mechanical packaging. The Mini AERCam free-flyer will initially be integrated into an approximate flight-like configuration for demonstration on an airbearing table. A pilot-in-the-loop and hardware-in-the-loop simulation to simulate on-orbit navigation and dynamics will complement the airbearing table demonstration. The Mini AERCam lab demonstration is intended to form the basis for future development of an AERCam flight system that provides beneficial on-orbit views unobtainable from fixed cameras, cameras on robotic manipulators, or cameras carried by EVA crewmembers.

Fredrickson, Steven E.↗

Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

Full-tape-thickness feature; LTCC 9K7 interconnect↗

NASA's Orbital Debris Optical Program: ES-MCAT Updated and Upgraded

The 1.3m ES-MCAT telescope (or MCAT for short) now has a proven capability for observing objects from Low- Earth Orbit (LEO) out to Geosynchronous (GEO) orbit, and the ability to run all systems autonomously. A GEO survey, the initial focus for MCAT, will commence in late 2019 to map out the current state of the GEO population as input for the ORbital Debris Engineering Model (ORDEM 4.x). This survey will statistically sample the GEO belt (0 to ~15 deg orbital inclinations) to detect both known and unknown targets. If a break-up occurs, additional surveys of the break-up field can be followed for discovery and investigations of daughter debris fragments from the parent satellite. Discovery can be accomplished by tracking orbits near to and including the parent object’s orbit. Targeted observations of debris can be taken with a suite of broadband filters for characterizing individual objects by ratetracking their known or calculated orbital elements (Two-Line Element sets, TLEs). Several modifications and upgrades have been made to the instrumentation and systems originally installed in 2015 and are reported here. In 2018, MCAT’s primary mirror was recoated with a high-end protected, enhanced silver by the ZeCoat Corporation. The CCD chip was replaced in the Spectral Instruments camera with a broad-band antireflective coated chip. The automated weather systems have been modified from the original system, removing some weather sensors and installing replacements that are better suited to Ascension’s weather and environment. A new 2.5-m ObservaDome replaced the Astrohaven dome on the nearby tower platform that will house an auxiliary 0.4-meter telescope. Finally, in 2019, the Observatory Control System was upgraded to 2.0 which includes additional flexibility for automating data collection and reduction. With these updates completed, MCAT is now well on track to reach Full Operational Capability (FOC) in 2019 for its survey, rate-track, and TLE tracking capabilities.

Lederer, S. M.↗

Evaluation of a Programmable Voltage-Controlled MEMS Oscillator, Type SiT3701, Over a Wide Temperature Range

Semiconductor chips based on MEMS (Micro-Electro-Mechanical Systems) technology, such as sensors, transducers, and actuators, are becoming widely used in today s electronics due to their high performance, low power consumption, tolerance to shock and vibration, and immunity to electro-static discharge. In addition, the MEMS fabrication process allows for the miniaturization of individual chips as well as the integration of various electronic circuits into one module, such as system-on-a-chip. These measures would simplify overall system design, reduce parts count and interface, improve reliability, and reduce cost; and they would meet requirements of systems destined for use in space exploration missions. In this work, the performance of a recently-developed MEMS voltage-controlled oscillator was evaluated under a wide temperature range. Operation of this new commercial-off-the-shelf (COTS) device was also assessed under thermal cycling to address some operational conditions of the space environment

Patterson, Richard↗

Lab on a Chip Application Development for Exploration

At Marshall Space Flight Center a new capability has been established to aid the advancement of microfluidics for space flight monitoring systems. Lab-On-a-Chip Application Development (LOCAD) team has created a program for advancing Technology Readiness Levels (TRL) of 1 & 2 to TRL 6 and 7, quickly and economically for Lab-On-a-Chip (LOC) applications. Scientists and engineers can utilize LOCAD's process to efficiently learn about microfluidics and determine if microfluidics is applicable to their needs. Once the applicability has been determined, LOCAD can then perform tests to develop the new fluidic protocols which are different from macro-scale chemical reaction protocols. With this information new micro-devices can be created such as the development of a microfluidic system to aid in the search for life, past and present, on Mars. Particular indicators in the Martian soil can contain the direct evidence of life. But to extract the information from the soil and present it to the proper detectors requires multiple fluidic/chemical operations. This is where LOCAD is providing its unique abilities.

Monaco, Lisa↗

Object Recognition using Feature- and Color-Based Methods

An improved adaptive method of processing image data in an artificial neural network has been developed to enable automated, real-time recognition of possibly moving objects under changing (including suddenly changing) conditions of illumination and perspective. The method involves a combination of two prior object-recognition methods one based on adaptive detection of shape features and one based on adaptive color segmentation to enable recognition in situations in which either prior method by itself may be inadequate. The chosen prior feature-based method is known as adaptive principal-component analysis (APCA); the chosen prior color-based method is known as adaptive color segmentation (ACOSE). These methods are made to interact with each other in a closed-loop system to obtain an optimal solution of the object-recognition problem in a dynamic environment. One of the results of the interaction is to increase, beyond what would otherwise be possible, the accuracy of the determination of a region of interest (containing an object that one seeks to recognize) within an image. Another result is to provide a minimized adaptive step that can be used to update the results obtained by the two component methods when changes of color and apparent shape occur. The net effect is to enable the neural network to update its recognition output and improve its recognition capability via an adaptive learning sequence. In principle, the improved method could readily be implemented in integrated circuitry to make a compact, low-power, real-time object-recognition system. It has been proposed to demonstrate the feasibility of such a system by integrating a 256-by-256 active-pixel sensor with APCA, ACOSE, and neural processing circuitry on a single chip. It has been estimated that such a system on a chip would have a volume no larger than a few cubic centimeters, could operate at a rate as high as 1,000 frames per second, and would consume in the order of milliwatts of power.

Duong, Tuan↗

Open coil structure for bubble-memory-device packaging

Concept has several important advantages over close-wound system: memory and coil chips are separate and interchangeable; interconnections in coil level are eliminated by packing memory chip and electronics in single structure; and coil size can be adjusted to optimum value in terms of power dissipation and field uniformity.

Chen, T. T.↗

Optical integrated-circuit tester

Computer controlled device can check typical medium scale unit in less than one minute. System scans integrated circuit chip with narrow beam of light while simultaneously scanning reference chip.

Micka, E. A.↗

Design and performance of 4 x 5120-element visible and 2 x 2560-element shortwave infrared multispectral focal planes

Two solid-state sensors for use in remote sensing instruments operating in the pushbroom mode are examined. The design and characteristics of the visible/near-infrared (VIS/NIR) device and the short-wavelength infrared (SWIR) device are described. The VIS/NIR is a CCD imager with four parallel sensor lines, each 1024 pixel long; the chip design and filter system of the VIS/NIR are studied. The performance of the VIS/NIR sensor with mask and its system performance are measured. The SWIR is a dual-band line imager consisting of palladium silicide Schottky-barrier detectors coupled to CCD multiplexers; the performance of the device is analyzed. The substrate materials and layout designs used to assemble the 4 x 5120-element VIS/NIR array and the 2 x 2560-element SWIR array are discussed, and the planarity of the butted arrays are verified using a profilometer. The optical and electrical characteristics, and the placement and butting accuracy of the arrays are evaluated. It is noted that the arrays met or exceed their expected performance.

Tower, J. R.↗

Study of optical techniques for the Ames unitary wind tunnel: Digital image processing, part 6

A survey of digital image processing techniques and processing systems for aerodynamic images has been conducted. These images covered many types of flows and were generated by many types of flow diagnostics. These include laser vapor screens, infrared cameras, laser holographic interferometry, Schlieren, and luminescent paints. Some general digital image processing systems, imaging networks, optical sensors, and image computing chips were briefly reviewed. Possible digital imaging network systems for the Ames Unitary Wind Tunnel were explored.

Lee, George↗

Neural network applications in telecommunications

Neural network capabilities include automatic and organized handling of complex information, quick adaptation to continuously changing environments, nonlinear modeling, and parallel implementation. This viewgraph presentation presents Bellcore work on applications, learning chip computational function, learning system block diagram, neural network equalization, broadband access control, calling-card fraud detection, software reliability prediction, and conclusions.

Alspector, Joshua↗

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗

CMOS Image Sensors: Electronic Camera On A Chip

Recent advancements in CMOS image sensor technology are reviewed, including both passive pixel sensors and active pixel sensors. On- chip analog to digital converters and on-chip timing and control circuits permit realization of an electronic camera-on-a-chip. Highly miniaturized imaging systems based on CMOS image sensor technology are emerging as a competitor to charge-coupled devices for low cost uses.

Space Microelectronics Image Sensors APS Digital I↗

Hardware platforms for MEMS gyroscope tuning based on evolutionary computation using open-loop and closed -loop frequency response

We propose a tuning method for MEMS gyroscopes based on evolutionary computation to efficiently increase the sensitivity of MEMS gyroscopes through tuning. The tuning method was tested for the second generation JPL/Boeing Post-resonator MEMS gyroscope using the measurement of the frequency response of the MEMS device in open-loop operation. We also report on the development of a hardware platform for integrated tuning and closed loop operation of MEMS gyroscopes. The control of this device is implemented through a digital design on a Field Programmable Gate Array (FPGA). The hardware platform easily transitions to an embedded solution that allows for the miniaturization of the system to a single chip.

evolvable hardware↗

Closed-Loop Performance Measures for Flight Controllers Subject to Neutron-Induced Upsets

It has been observed that atmospheric neutrons can produce single event upsets in digital flight control hardware. The phenomenon has been studied extensively at the chip level, and now system level experiments are underway. In this paper analytical closed-loop performance measures for the tracking error are developed for a plant that is stabilized by a recoverable computer system subject to neutron induced upsets. The underlying model is a Markov jump-linear system with process noise. The steady-state tracking error is expressed in terms of a generalized observability Gramian.

Gray, W. Steven↗