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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Spacecraft technology

Developments in spacecraft technology are discussed with emphasis on the Explorer satellite program. The subjects considered include the following: (1) nutational behavior of the Explorer-45 satellite, (2) panoramic sensor development, (3) onboard camera signal processor for Explorer satellites, and (4) microcircuit development. Information on the zero gravity testing of heat pipes is included. Procedures for cleaning heat treated aluminum heat pipes are explained. The development of a five-year magnetic tape, an accurate incremental angular encoder, and a blood freezing apparatus for leukemia research are also discussed.

Source record↗
NASA NTRS1975

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Caruso, S. V.↗
NASA NTRS1975

The 1975 NASA/ASEE summer faculty fellowship research program

A research program was conducted to further the professional knowledge of qualified engineering and science faculty members, to stimulate an exchange of ideas between participants and NASA engineers and scientists, and to enrich the research activities of the participants' institutions. Abstracts of reports submitted at the end of the program are presented. Topics investigated include multispectral photography, logic circuits, gravitation theories, information systems, fracture mechanics, holographic interferometry, surface acoustic wave technology, ion beams in the upper atmosphere, and hybrid microcircuits.

Source record↗
NASA NTRS1976

Polymer adhesives for hybrid circuits

Report discusses number of tests used in comparing polymer adhesives with metal bonding processes and includes charts and photographs to illustrate test results. Findings suggest reduced quality control costs when epoxies are used in fabrication of microcircuits.

Caruso, S. V.↗
NASA NTRS1975

Contamination control in hybrid microelectronic modules. Part 3: Specifications for coating material and process controls

Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.

Himmel, R. P.↗
NASA NTRS1976

Contamination control in hybrid microelectronic modules

Thin and thick film test specimens were utilized to study the effects of silicone and epoxy hybrid microcircuit coatings on 0.025 mm diameter aluminum and gold ultrasonic bonds, and 0.051 diameter gold pulsed-thermocompression bonds. Chip-to-substrate and substrate-to-substrate geometries were included. Because sealed packages were utilized, a test pattern design was incorporated that allowed the determination of bond failures by making resistance measurements external to the package after the various environmental tests. All wire bonds were non-destructively pull tested prior to sealing. Tests included the PIN test, temperature cycling, and high temperature storage.

Himmel, R. P.↗
NASA NTRS1976

Electrical properties of epoxies and film resistors

The reliability of hybrid microcircuits has been enhanced in recent years by the use of organic adhesives as a replacement for solder and eutectics. The epoxies have been the most effective and widely used material for this application. Methods for measuring the electrical and mechanical properties of epoxies are developed. Data are given for selected conductive adhesives at high and low frequencies. The temperature coefficients of resistance of thick film resistors are presented.

Sergent, J. E.↗
NASA NTRS1977

Control and computation module development

Software development methods have been investigated and two test bed projects have been chosen to evaluate application techniques of the 8080A and support microcircuits which will satisfy DSN requirements. Final recommendations will reflect successful JPL applications experience.

Winkelstein, R. A.↗
NASA NTRS1979

Calibration standards for PIND tests

Calibrated set of microcircuit packages containing tiny particles with known masses can be used as reference standards for Particle-Impact Noise-Detection (PIND) tests.

Gaudiano, S.↗
NASA NTRS1979

Shock during PIND test frees particles

Recent study on Particle-Impact Noise-Detection (PIND) shows impact at 1,500 to 4,000 G normally imparted to hybrid microcircuits during testing knocks loose stray trapped particle that can be subsequentially removed. Process may be 80 to 90 percent effective in removal of particles depending on type of test utilized.

Caruso, S. V.↗
NASA NTRS1977

Standard high-reliability integrated circuit logic packaging

A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

Slaughter, D. W.↗
NASA NTRS1977

Comparison of DOD tape automated bonding programs

Tape automated bonding (TAB) shows promise of being the predominant assembly and interconnect technique for microcircuit devices in the 1980's. After briefly reviewing the evolution of TAB, consideration was given to factors influencing and motivating TAB, including current major problem areas. Solutions to these problems are being investigated under five Department of Defense programs. These complementary efforts are discussed and compared. The findings are contrasted against recent improvements and advancements in automated wire bonding.

Unger, R. F.↗
NASA NTRS1977

Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuits

A design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings.

Cocca, T.↗
NASA NTRS1977

Sensitivities of particle impact noise detection

The results of a study on Particle Impact Noise Detection commonly referred to as PIND testing is described. Certain sensitivities of PIND testing as applicable to hybrid microcircuits were determined, and techniques for removing particles from sealed hybrid packages were evaluated. Methods for freeing particles which have become trapped or hung up inside the hybrid package and, therefore, give no PIND test response were examined.

Keister, F. Z.↗
NASA NTRS1979

Electrical Characterization of Hughes HCMP 1852D and RCA CDP1852D 8-bit, CMOS, I/O Ports

Twenty-five Hughes HCMP 1852D and 25 RCA CDP1852D 8-bit, CMOS, I/O port microcircuits underwent electrical characterization tests. All electrical measurements were performed on a Tektronix S-3260 Test System. Before electrical testing, the devices were subjected to a 168-hour burn-in at 125 C with the inputs biased at 10V. Four of the Hughes parts became inoperable during testing. They exhibited functional failures and out-of-range parametric measurements after a few runs of the test program.

Stokes, R. L.↗