High induction, power dense transformers to enable adoption of SiC and GaN power electronic devices
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Kernion, Samuel↗
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Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics
A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
Zhou, Feng↗
Gallium Nitride and Related Materials - Device Processing and Materials Characterization for Power Electronics Applications
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Armstrong, Andrew Michael [Sandia National Laborat↗
Hardware-in-the-Loop Efficiency Analysis of Tidal Power Systems
Marine renewable energy presents an opportunity for sustainable power in areas located near and in the marine environment. In particular, tidal energy offers a consistent and reliable resource. However, tidal energy harvesting systems seeking to take advantage of this resource face challenges associated with power electronics. Power conversion electronics struggle with low efficiencies, lack of off-the-shelf options for small-scale energy harvesting systems, and limited opportunities for testing with deployed turbines. This work demonstrates a hardware-in-the-loop experimental design and methodology for characterizing efficiency of tidal turbine power electronics and control methods. The suggested method removes barriers to testing these power electronics by eliminating the need for a physical tidal turbine and generator to produce accurate harvested tidal power profiles.
tidal turbine, hardware-in-the-loop, energy conver↗
BEEAM (Building Electrical Efficiency Analysis Model) [SWR-20-107]
Modern high-performance buildings exhibit an increasing number of building loads that use direct current (DC) electricity internally, rather than alternating current (AC), due to the advent of low-cost computing and advanced power electronics. Powering DC devices from the AC grid requires AC/DC power conversion, which introduces energy losses and reduces efficiency. As DC loads proliferate, the cumulative wasted energy associated with hundreds of millions of AC/DC converters has become one of the broadest energy savings opportunities in buildings. DC power distribution systems have been proposed as an elegant and transformative solution to the problem of DC devices. In a DC distribution system, the building's wires carry DC electricity, rather than AC; and a few centralized, highly efficient AC/DC converters replace the many smaller, less efficient converters that serve individual DC loads. Unfortunately, the trade-offs associated with DC distribution systems are not well understood. Reported energy savings associated with DC power distribution differ widely and have not been well validated. The Building Electrical Efficiency Analysis Model (BEEAM) is a Modelica library that simulates the efficiency of building electrical distribution systems using harmonic power flow. BEEAM can model a wide variety of building distribution topologies, including three-phase AC, single-phase AC, unipolar DC, bipolar DC, and hybrid networks under both balanced and unbalanced load conditions. BEEAM accurately models power electronic converter losses, provides granular estimates of losses throughout the distribution system, and properly models efficiency at part load conditions. Users can package BEEAM within a functional mockup unit (FMU), enabling co-simulation with other modeling platform, such as EnergyPlus. In summary, BEEAM provides a tool suite for fair and accurate comparison of the efficiency of building electrical distribution systems, including AC, DC, and hybrid systems.
Frank, Stephen↗
Hexagonal Boron Nitride: Physical Properties, Hydride Vapor‐Phase Epitaxy Growth of Large‐Diameter Quasi‐Bulk Wafers and Applications
Hexagonal boron nitride ( h ‐BN), with its ultrawide bandgap and 2D structure, holds an immense promise for advanced semiconductor applications. Scaling bulk crystals to large‐diameter wafers, crucial for complex device fabrication, remains a challenge with high temperature, high pressure, and metal flux solution methods. To address this, recent efforts have focused on hydride vapor‐phase epitaxy (HVPE) for producing large diameter thick h ‐BN quasi‐bulk wafers, reaching hundreds of micrometers. These HVPE‐grown quasi‐bulk crystals exhibit excellent c ‐axis long‐range order. Notably, the in‐plane mobility‐lifetime products for both electrons and holes surpass 10 −4 cm 2 V −1 , which are two orders of magnitude greater than the out‐of‐plane (vertical) values, highlighting the potential for high‐performance devices leveraging superior lateral transport. Lateral detectors fabricated from 100 μm thick B‐10 enriched h‐ BN wafers have achieved a record 60% thermal neutron detection efficiency. Based on its physical properties, h‐ BN appears to be an outstanding material of choice for light‐triggered electronic power switches capable of supporting high ‐ voltage and high ‐ power operations. These recent advancements in large‐diameter h ‐BN quasi‐bulk crystal growth, enabled by HVPE, pave the way for applications spanning deep UV photonics, high‐power electronics, high‐efficiency neutron detection, and quantum information technologies, establishing h ‐BN as both a versatile active semiconductor and an ideal substrate.
Jiang, Hongxing [Department of Electrical and Comp↗
Development of a Power Electronics-based Testbed for a Flexible Combined Heat and Power System
A flexible combined heat and power (F-CHP) concept, enabled by a power electronics-based power conditioning system (PCS), has been recently proposed as a cost-effective way for supporting the grid with high penetration of renewable energy sources. To verify the design, control, and performance of the overall system, a laboratory-scale testbed is essential. This paper focuses on the development of a power electronics-based testbed for such a F-CHP system. The developed testbed can test the control, grid-connected mode operation, islanded mode operation, and mode transitions, including planned/unplanned islanding and reconnection, of the F-CHP system. In the grid-connected mode, both the steady state and transients of the ac grid can be emulated, and various grid support functions can be tested with the help of the developed PCS converter. In the islanded mode, the external ac loads can also be supported by the F-CHP system. Also, the central controller, which is implemented in a NI CompactRIO, can be tested. Experimental test results for the grid-connected mode, islanded mode, and mode transitions are provided to validate the testbed design.
24 POWER TRANSMISSION AND DISTRIBUTION↗
Modular Coaxial Power Converter for High-Density Integration into Medium-Voltage Cables
This work proposes to combine the functionality benefits of power electronics with the power density benefits of medium-voltage cables to create a streamlined, high-density power electronics solution that seamlessly integrates with medium-voltage cables. Located at the ends of a medium- or high-voltage line, the proposed converter uses a cascade of coaxial power conversion cells to gradually step down the voltage, and excels in high step-down applications. By mimicking the coaxial geometry of medium-voltage cables, the converter preserves the axisymmetric electric field of the cable which, when combined with a solid insulating dielectric, provides a voltage scaling advantage over conventional planar and PCB-based converter solutions. Similar to medium voltage cables, the converter is fully passively cooled. A passive cooling strategy allows for combined installation with existing medium voltage cable systems without the added cost, maintenance needs, infrastructure, and reliability concerns associated with active cooling systems. The scalability of the modular structure in combination with the integration benefits provide a flexible power electronics system that can adapt to the evolving demands of the grid.
coaxial power conversion cells↗
Multiphysics Co-Optimization Design and Analysis of Double-Side Cooled Silicon Carbide-Based Power Module: Preprint
With the rapid growth of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs), much more rigorous design targets have been set for automotive power electronics, including high power density, high reliability, and low cost. Novel power module and inverter technologies based on wide bandgap (WEG) semiconductors have been developed to meet these design targets, while providing optimal power semiconductor operating temperature and promising thermomechanical performance. Compared with conventional cooling techniques which are normally applied only on one side of power module, double-side cooling approach is now believed to be the solution to enable high power density and low thermal resistance of WEG semiconductor-based power electronics. In this work, we develop a three-phase power module that is double-sided cooled using dielectric fluid jet impingement. In each phase, four silicon carbide (SiC) power semiconductors are bonded to copper busbars without electrical insulation layers. A finite element analysis (FEA) model is created for thermal and thermomechanical analysis. Based on FEA modeling results, we select particular dimensions for a parametric study to optimize thermal and mechanical performance. Using a multi-objective genetic algorithm (MOGA)-based optimization method, we have minimized the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization approach has enabled an efficient design process of power modules with greatly reduced computational cost, as compared to conventional processes that rely on exhaustive numerical simulations and iterations.
ADVANCED PROPULSION SYSTEMS↗
Guest Editorial: Special Issue on InterPACK 2019 - Part 1
This is a collection of papers drawn from the 2019 ASME InterPACK Conference. The content spans the areas of heterogeneous integration, servers, flexible and wearable electronics, photonics, power electronics, energy storage, and autonomous and electric vehicles.
47 OTHER INSTRUMENTATION↗
Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
The continuous push to increase power densities of electric vehicle (EV) traction drive systems necessitates combining electric motor and power electronics into one unit. A single, compact traction drive unit with fewer interconnecting components also facilitates fast, automated assembly of electric vehicles, driving production costs down and enabling wider adoption of EVs. There are a number of challenges associated with the integration of power electronics with the electric machine, including thermal management of the combined traction drive system. However, one important benefit of integration from the thermal management system perspective is the potential for using a single fluid loop instead of two separate cooling systems for the electric machine and the power electronics/inverter. This paper reviews several integration approaches and, employing finite element analysis (FEA), compares thermal management solutions for the combined electric machine and power electronics systems. Namely, three different scenarios are modeled: (1) independent component (motor and power electronics) cooling, which is compared to the combined cooling system approach for (2) radially and (3) axially integrated power electronics modules into the motor enclosure. Temperature distributions for selected thermal loads and thermal resistances from the key heat-generating components to the cooling fluid are compared for each scenario.
47 OTHER INSTRUMENTATION↗
Semiconductor: Supply Chain Deep Dive Assessment
In February 2021, President Biden signed Executive Order (EO) 14017, “America’s Supply Chains,” directing seven executive agencies to evaluate the resilience and security of the nation’s critical supply chains and to craft strategies for six industrial bases that underpin America’s economic and national security. See Sec. 3(b) of E.O. 14017. As part of the one-year response to EO 14017, the U.S. Department of Energy (DOE), through the national laboratories, conducted evaluations of the supply chains that encompass the Energy Sector Industrial Base, with a particular focus on technologies required to decarbonize the U.S. by 2050. This report focuses on one of these technologies, semiconductors, both conventional and wide bandgap (WBG) power electronics (PE). As noted in the 100-Day report, conventional semiconductors are a keystone technology that are essential for the operation of nearly every electronic device, including those that are critical to decarbonization, such as electric vehicles (EVs), industrial and building applications, and electricity generation and end use. In addition, power electronics have been applied to industrial equipment to improve energy efficiency and enhance controllability. Power electronics have also been used to improve the reliability of data centers and critical infrastructure, including the stabilization of the electric grid while subjected to disturbances. Increasingly, power electronics are being used to integrate renewable energy and battery storage systems, enabling new grid services and the development of microgrids. It is estimated that 30% of the electricity used in the U.S. passes through power electronic devices, and studies suggest that this number could reach 80% as power electronics are deployed in more markets. Nearly all forms of electrified transportation will depend on power electronics. Power electronic systems utilize high-capacity semiconductor devices at their core. The continued growth in power electronics depends on sustained innovation in the semiconductor industry.
29 ENERGY PLANNING, POLICY, AND ECONOMY↗
Making Wireless Power Matter (CRADA Final Report)
The Resonant Link project team investigated the integration of their novel, self-resonant magnetic structure for electromagnetic coils into inductive wireless power transfer systems. Relative to conventional wireless power coils, their multi-layer self-resonant structure (the “MSRS”) reduces losses by up to 6x and lowers to BOM cost by up to 10x. These power-dense, cost-effective coils are a promising path towards the first value-add wireless power systems in a variety of applications, from phones to medical devices to kitchen appliances to mobile robots to electric vehicles. The researchers explored development of the power electronics for wireless power transfer systems using the multi-layer self-resonant structure (MSRS) concept that efficiently transmits power over air gaps for in-home applications, including through-wall power transfer, appliances built around the Ki and Qi standards, and other potential use cases This project specifically focused on the power electronics design, development, and testing for these applications. Resonant Link’s proprietary wireless power technology holds the promise of matching the performance of wired chargers in size and efficiency, especially when operated from a DC distribution grid.
42 ENGINEERING↗
High Power Superconducting Electron Linear Accelerators For Industrial Application
Fermilab is executing a technology development program to develop a compact yet powerful electron accelerator. We are leveraging R&D breakthroughs in SRF cavities, cost-effective radio-frequency sources, modern cryo-coolers, and high average current electron guns. We show that a single accelerator module can deliver average beam power as high as 1 MW through detailed thermal, RF, and particle simulations.
Thangaraj, Jayakar Tobin↗
Wide-Bandgap Semiconductor Amplifiers for Fusion Plasma Heating and Control
This paper discusses power electronics developed under the ARPA-E GAMOW program to support nuclear fusion power production. The goal of this project was to develop and assess the potential for wide-bandgap (WBG) semiconductor devices in power electronics to enable high-efficiency and high-voltage solid-state systems for fusion plasma generation, heating, and control. The power electronics use an architecture in which multiple high-power boards can be combined to produce megawatt-level power, where using multiple boards provides high reliability. Two main areas of power electronics boards are developed in this project for fusion plasma heating and control applications: (1) pulse generation and control and (2) radiofrequency generation. The first area is for boards capable of driving high-voltage millisecond pulses at high duty cycles. The envisioned application of these pulses is in plasma control of magnetohydrodynamic instabilities, plasma position, and edge-localized modes. Pulse-width modulation allows for the implementation of a wide variety of linear and nonlinear control systems. The boards developed for this project could actuate control coils based on digital input signals and can be parallelized to provide megawatts of output power. The design of the pulse generator is a low-side load switch. A load switch was designed and constructed that utilized 2-kV-rated field-effect transistor (FET)-based cascodes developed by Qorvo under this project to perform initial testing of these cascodes. The second area is being implemented using class E amplifiers with WBG devices and a reactance steering network to handle inductive or capacitive plasma loads. Applications include ion cyclotron resonance heating (ICRH) and high-harmonic fast-wave (HHFW) heating. A class E reactance steering network is demonstrated in modeling and experiment with a resistive-inductive load that models an inductively-coupled plasma. Power combining of boards with class E reactance steering networks is also simulated and demonstrated experimentally, to enable scaling up to high power. Modeling of high-power-density cooling and remaining useful life is conducted to enable reliable, effectively cooled high-power electronics for fusion applications.
11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
Integration Methods for High-Density Integrated Electric Drives (Final Technical Report)
The project goal was to research, design and fabricate high-power-density, high-performance SiC power electronic modules for motor drive inverters in electric vehicles (EVs) to enable the subsequent motor drive to achieve a power density of 100 kW/l. EVs use electric motors instead of internal combustion engines as the prime mover, and their core components are semiconductor-based power electronic modules. Efficient power electronic modules play a vital role in power conversion systems. The performance of power modules directly affects the energy efficiency and overall performance of electric vehicles. Therefore, it is particularly important to develop power modules with high power density and high electrical performance that will perform reliably under EV environmental conditions. To achieve these goals, advanced electronic packaging technologies are required. This report describes a 5-year effort to integrate key aspects surrounding the basic power devices into the module itself to increase power density. These include sensing and sensing readout circuits, gate driver circuits, and two-sided cooling solutions.
33 ADVANCED PROPULSION SYSTEMS↗