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At least 235 records · Page 13

Graph Embedding Techniques for Bounding Condition Numbers of Incomplete Factor Preconditioning

We extend graph embedding techniques for bounding the spectral condition number of preconditioned systems involving symmetric, irreducibly diagonally dominant M-matrices to systems where the preconditioner is not diagonally dominant. In particular, this allows us to bound the spectral condition number when the preconditioner is based on an incomplete factorization. We provide a review of previous techniques, describe our extension, and give examples both of a bound for a model problem, and of ways in which our techniques give intuitive way of looking at incomplete factor preconditioners.

Guattery, Stephen↗

ISO Observations of Starless Bok Globules: Usually No Embedded Stars

We have used ISOCAM to search the cores of a sample of small Bok globules previously classified to be mostly starless based on analysis of IRAS data. The ISO observations at 6.75microns (LW2 filter) and 14.5microns (LW3 filter) were sufficiently deep to enable detection of any low-mass hydrogen burning star or young stellar object (YSO) embedded in these globules. Of the 20 Bok globules observed by ISOCAM to date, we have reduced the data for 14. Of these, 13 show no evidence for faint red (S(sub v)(LW3) greater than S(sub v)(LW2)) stars missed by IRAS. One (CB68) does show the first mid-infrared detection of the very cool IRAS source toward this cloud, and may be a Class I or 0 YSO. We conclude, based on these new ISO observations, that Bok globules which have no IRAS sources are in general bona fide starless molecular clouds.

Clemens, D.↗

Post-flare loops embedded in a hot coronal fan-like structure

Limb events were demonstrated on the sun in which rising post-flare loops were embedded in hot structures looking in soft X-rays like fans of rays, formed during the flare and extending high into the corona. One of these structures is analyzed and it is suggested that these fans of rays represent temporary ministreamers, along which mass flows into interplanetary space. This suggestion is supported by maps of solar wind density constructed from scintillation measurements.

Svestka, Z.↗

The Intermittently Embedded Herbig AE/BE Stars

We discuss silicate emission profiles observed with the ISO SWS and ground-based IR observations in a population of intermittently embedded Herbig Ae/Be stars which are viewed edge-on to their polarimetrically identified dust and gas disks. The ISO SWS observations confirm the lack of a simple correlation between system age and the profile shape. Comparison with laboratory silicates suggests that much of the observed variation is due to different annealing histories of the grains.

Grady, C. A.↗

Structural Embeddings: Mechanization with Method

The most powerful tools for analysis of formal specifications are general-purpose theorem provers and model checkers, but these tools provide scant methodological support. Conversely, those approaches that do provide a well-developed method generally have less powerful automation. It is natural, therefore, to try to combine the better-developed methods with the more powerful general-purpose tools. An obstacle is that the methods and the tools often employ very different logics. We argue that methods are separable from their logics and are largely concerned with the structure and organization of specifications. We, propose a technique called structural embedding that allows the structural elements of a method to be supported by a general-purpose tool, while substituting the logic of the tool for that of the method. We have found this technique quite effective and we provide some examples of its application. We also suggest how general-purpose systems could be restructured to support this activity better.

Munoz, Cesar↗

Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented.

Ponchak, George E.↗

Effectiveness of Diffusion Barrier Coatings for Mo-Re Embedded in C/SiC and C/C

Advanced high-temperature cooling applications may often require the elevated-temperature capability of carbon/silicon carbide or carbon/carbon composites in combination with the hermetic capability of metallic tubes. In this paper, the effects of C/SiC and C/C on tubes fabricated from several different refractory metals were evaluated. Though Mo, Nb, and Re were evaluated in the present study, the primary effort was directed toward two alloys of Mo-Re, namely, arc cast Mo-41Re and powder metallurgy Mo-47.5Re. Samples of these refractory metals were subjected to either the PyC/SiC deposition or embedding in C/C. MoSi2(Ge), R512E, and TiB2 coatings were included on several of the samples as potential diffusion barriers. The effects of the processing and thermal exposure on the samples were evaluated by conducting burst tests, microhardness surveys, and scanning electron microscopic examination (using either secondary electron or back scattered electron imaging and energy dispersive spectroscopy). The results showed that a layer of brittle Mo-carbide formed on the substrates of both the uncoated Mo-41Re and the uncoated Mo-47.5Re, subsequent to the C/C or the PyC/SiC processing. Both the R512E and the MoSi2(Ge) coatings were effective in preventing not only the diffusion of C into the Mo-Re substrate, but also the formation of the Mo-carbides. However, none of the coatings were effective at preventing both C and Si diffusion without some degradation of the substrate.

Glass, David E.↗

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗

Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on complementary metal oxide semiconductor (CMOS) (low resistivity) Si wafers. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements are used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions.

Ponchak, George E.↗

Embedded Real-Time Linux for Instrument Control and Data Logging

When I moved to the west. coast to take a job at NASA's Ames Research Center in Mountain View, CA, I was impressed with the variety of equipment and software which scientists at the center use to conduct their research. was happy to find that I was just as likely to see a machine running Lenox as one running Windows in the offices and laboratories of NASA Ames (although many people seem to use Moos around here). I was especially happy to find that the particular group with whom I was going to work, the Atmospheric Physics Branch at Ames, relied almost entirely on Lenox machines for their day-to-day work. So it was no surprise that when it was time to construct a new control system for one of their most important pieces of hardware, a switch from an unpredictable DOS-based platform to an Embedded Linux-based one was a decision easily made. The system I am working on is called the Solar Spectral Flux Radiometer (SSFR), a PC-104 based system custom-built by Dr. Warren Gore at Ames. Dr. Gore, Dr. Peter Pilewskie, Dr. Maura Robberies and Larry Pezzolo use the SSFR in their research. The team working on the controller project consists of Dr. Gore, John Pommier, and myself. The SSFR is used by the ,cities Atmospheric Radiation Group to measure solar spectral irradiance at moderate resolution to determine the radiative effect of clouds, aerosols, and gases on climate, and also to infer the physical properties of aerosols and clouds. Two identical SSFR's have been built and successfully deployed in three field missions: 1) the Department of Energy Atmospheric Radiation Measurement (ARM) Enhanced Shortwave Experiment (ARESE) II in February/March, 2000; 2) the Puerto Rico Dust Experiment (PRIDE) in July, 2000; and 3) the South African Regional Science Initiative (SAFARI) in August/September, 2000. Additionally, the SSFR was used to acquire water vapor spectra using the Ames Diameter base-path multiple-reflection absorption cell in a laboratory experiment.

Clanton, Sam↗

Flow-Field Measurement of Device-Induced Embedded Streamwise Vortex on a Flat Plate

Detailed flow-field measurements were performed downstream of a single vortex generator (VG) using an advanced Stereo Digital Particle Image Velocimetry system. Thc passive flow-control devices examined consisted of a low-profile VG with a device height, h, approximately equal to 20 percent of the boundary-layer thickness, sigma, and a conventional VG with h is approximately sigma. Flow-field data were taken at twelve cross-flow planes downstream of the VG to document and quantify the evolution of embedded streamwise vortex. The effects of device angle of attack on vortex development downstream were compared between the low-profile VG and the conventional VG. Key parameters including vorticity, circulation, trajectory, and half-life radius - describing concentration, strength, path, and size, respectively--of the device-induced streamwise vortex were extracted from the flow-field data. The magnitude of maximum vorticity increases as angle of attack increases for the low-profile VG, but the trend is reversed for the conventional VG, probably due to flow stalling around the larger device at higher angles of attack. Peak vorticity and circulation for the low-profile VG decays exponentially and inversely proportional to the distance downstream from the device. The device-height normalized vortex trajectories for the low-profile VG, especially in the lateral direction, follow the general trends of the conventional VG. The experimental database was used to validate the predictive capability of computational fluid dynamics (CFD). CFD accurately predicts the vortex circulation and path; however, improvements are needed for predicting the vorticity strength and vortex size.

Yao, Chung-Sheng↗

Coupling between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing SilSiGe monolithic microwavdmillimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented. A discussion of the electric and magnetic field distributions for the coupled microstrip lines is presented to provide a physical rationale for the presented results.

Ponchak, George E.↗

Coupling Between Microstrip Lines With Finite Width Ground Plane Embedded in Thin Film Circuits

Three-dimensional (3D) interconnects built upon multiple layers of polyimide are required for constructing 3D circuits on CMOS (low resistivity) Si wafers, GaAs, and ceramic substrates. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines a r e susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements a r e used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions. Furthermore, it is shown that coupled microstrip lines establish a slotline type mode between the two ground planes and a dielectric waveguide type mode, and that the via holes recommended here eliminate these two modes.

Ponchak, George E.↗

Embedded Wing Propulsion Conceptual Study

As a part of distributed propulsion work under NASA's Revolutionary Aeropropulsion Concepts or RAC project, a new propulsion-airframe integrated vehicle concept called Embedded Wing Propulsion (EWP) is developed and examined through system and computational fluid dynamics (CFD) studies. The idea behind the concept is to fully integrate a propulsion system within a wing structure so that the aircraft takes full benefits of coupling of wing aerodynamics and the propulsion thrust stream. The objective of this study is to assess the feasibility of the EWP concept applied to large transport aircraft such as the Blended-Wing-Body aircraft. In this paper, some of early analysis and current status of the study are presented. In addition, other current activities of distributed propulsion under the RAC project are briefly discussed.

Kim, Hyun D.↗

Concepts and Development of Bio-Inspired Distributed Embedded Wired/Wireless Sensor Array Architectures for Acoustic Wave Sensing in Integrated Aerospace Vehicles

This paper discusses the modeling of acoustic emissions in plate structures and their sensing by embedded or surface bonded piezoelectric sensor arrays. Three different modeling efforts for acoustic emission (AE) wave generation and propagation are discussed briefly along with their advantages and disadvantages. Continuous sensors placed at right angles on a plate are being discussed as a new approach to measure and locate the source of acoustic waves. Evolutionary novel signal processing algorithms and bio-inspired distributed sensor array systems are used on large structures and integrated aerospace vehicles for AE source localization and preliminary results are presented. These systems allow for a great reduction in the amount of data that needs to be processed and also reduce the chances of false alarms from ambient noises. It is envisioned that these biomimetic sensor arrays and signal processing techniques will be useful for both wireless and wired sensor arrays for real time health monitoring of large integrated aerospace vehicles and earth fixed civil structures. The sensor array architectures can also be used with other types of sensors and for other applications.

Ghoshal, Anindya↗

The Highly Robust Electrical Interconnects and Ultrasensitive Biosensors Based on Embedded Carbon Nanotube Arrays

We report on our recent breakthroughs in two different applications using well-aligned carbon nanotube (CNT) arrays on Si chips, including (1) a novel processing solution for highly robust electrical interconnects in integrated circuit manufacturing, and (2) the development of ultrasensitive electrochemical DNA sensors. Both of them rely on the invention of a bottom-up fabrication scheme which includes six steps, including: (a) lithographic patterning, (b) depositing bottom conducting contacts, (c) depositing metal catalysts, (d) CNT growth by plasma enhanced chemical vapor deposition (PECVD), (e) dielectric gap-filling, and (f) chemical mechanical polishing (CMP). Such processes produce a stable planarized surface with only the open end of CNTs exposed, whch can be further processed or modified for different applications. By depositing patterned top contacts, the CNT can serve as vertical interconnects between the two conducting layers. This method is fundamentally different fiom current damascene processes and avoids problems associated with etching and filling of high aspect ratio holes at nanoscales. In addition, multiwalled CNTs (MWCNTs) are highly robust and can carry a current density of 10(exp 9) A/square centimeters without degradation. It has great potential to help extending the current Si technology. The embedded MWCNT array without the top contact layer can be also used as a nanoelectrode array in electrochemical biosensors. The cell time-constant and sensitivity can be dramatically improved. By functionalizing the tube ends with specific oligonucleotide probes, specific DNA targets can be detected with electrochemical methods down to subattomoles.

Li, Jun↗

Multiscale Modeling of Metallic Materials Containing Embedded Particles

Multiscale modeling at small length scales (10(exp -9) to 10(exp -3) m) is discussed for aluminum matrices with embedded particles. A configuration containing one particle surrounded by about 50 grains and subjected to uniform tension and lateral constraint is considered. The analyses are performed to better understand the effects of material configuration on the initiation and progression of debonding of the particles from the surrounding aluminum matrix. Configurational parameters considered include particle aspect ratio and orientation within the surrounding matrix. Both configurational parameters are shown to have a significant effect on the behavior of the materials as a whole. For elliptical particles with the major axis perpendicular to the direction of loading, a particle with a 1:1 aspect ratio completely debonds from the surrounding matrix at higher loads than particles with higher aspect ratios. As the particle major axis is aligned with the direction of the applied load, increasing amounts of load are required to completely debond the particles.

Phillips, Dawn R.↗

Precise and Efficient Static Array Bound Checking for Large Embedded C Programs

In this paper we describe the design and implementation of a static array-bound checker for a family of embedded programs: the flight control software of recent Mars missions. These codes are large (up to 250 KLOC), pointer intensive, heavily multithreaded and written in an object-oriented style, which makes their analysis very challenging. We designed a tool called C Global Surveyor (CGS) that can analyze the largest code in a couple of hours with a precision of 80%. The scalability and precision of the analyzer are achieved by using an incremental framework in which a pointer analysis and a numerical analysis of array indices mutually refine each other. CGS has been designed so that it can distribute the analysis over several processors in a cluster of machines. To the best of our knowledge this is the first distributed implementation of static analysis algorithms. Throughout the paper we will discuss the scalability setbacks that we encountered during the construction of the tool and their impact on the initial design decisions.

Venet, Arnaud↗