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At least 235 records · Page 13

Fault tolerance using self-checking building-block computers

The paper attempts to define and characterize a set of VLSI (very large scale integration) building-block circuits which can be used to combine existing microprocessors and memories into a wide variety of fault-tolerant computing systems. Such VLSI circuits would transform fault-tolerant computing into an off-the-shelf technology and enable its routine use for new applications. The self-checking computer module (SCCM) is the basic component out of which fault-tolerant computer systems are constructed. Several fault-tolerant configurations of SCCM are discussed, including the standby redundant uniprocessor, the voted/hybrid uniprocessor, and the distributed computer network.

Rennels, D. A.↗

Content-addressable read/write memories for image analysis

The commonly encountered image analysis problems of region labeling and clustering are found to be cases of search-and-rename problem which can be solved in parallel by a system architecture that is inherently suitable for VLSI implementation. This architecture is a novel form of content-addressable memory (CAM) which provides parallel search and update functions, allowing speed reductions down to constant time per operation. It has been proposed in related investigations by Hall (1981) that, with VLSI, CAM-based structures with enhanced instruction sets for general purpose processing will be feasible.

Snyder, W. E.↗

High density circuit technology, part 3

Dry processing - both etching and deposition - and present/future trends in semiconductor technology are discussed. In addition to a description of the basic apparatus, terminology, advantages, glow discharge phenomena, gas-surface chemistries, and key operational parameters for both dry etching and plasma deposition processes, a comprehensive survey of dry processing equipment (via vendor listing) is also included. The following topics are also discussed: fine-line photolithography, low-temperature processing, packaging for dense VLSI die, the role of integrated optics, and VLSI and technology innovations.

Wade, T. E.↗

Chip level modeling of LSI devices

The advent of Very Large Scale Integration (VLSI) technology has rendered the gate level model impractical for many simulation activities critical to the design automation process. As an alternative, an approach to the modeling of VLSI devices at the chip level is described, including the specification of modeling language constructs important to the modeling process. A model structure is presented in which models of the LSI devices are constructed as single entities. The modeling structure is two layered. The functional layer in this structure is used to model the input/output response of the LSI chip. A second layer, the fault mapping layer, is added, if fault simulations are required, in order to map the effects of hardware faults onto the functional layer. Modeling examples for each layer are presented. Fault modeling at the chip level is described. Approaches to realistic functional fault selection and defining fault coverage for functional faults are given. Application of the modeling techniques to single chip and bit slice microprocessors is discussed.

Armstrong, J. R.↗

Detector Arrays With Image-Plane Processing

Image detection and edge processing merged on same VLSI chip. Concept combines relatively large detector with small processor elements as VLSI chip features and has many specific embodiments. New device concept retains relatively large detector element sizes (perhaps 10 to 100 micrometers or larger in diameter) with processing-electronics components of much smaller size (2 micrometers or less), filling in gaps left between detectorelement active areas. Detector-array device helps to perform difference-ofGaussian operation for use in machine-vision edge enhancement and edge detection.

Jobson, D. J.↗

A systolic architecture for the correlation and accumulation of digital sequences

A fully systolic architecture for the implementation of digital sequence correlator/accumulators is described. These devices consist of a two-dimensional array of processing elements that are conceived for efficient fabrication in Very Large Scale Integrated (VLSI) circuits. A custom VLSI chip that was implemented using these concepts is described. The chip, which contains a four-lag three-level sequence correlator and four bits of accumulation with overflow detection, was designed using the Integrated UNIX-Based Computer Aided Design (CAD) System. Applications of such devices include the synchronization of coded telemetry data, alignment of both real time and non-real time Very Large Baseline Interferometry (VLBI) signals, and the implementation of digital filters and processes of many types.

Deutsch, L. J.↗

MIMD computing in the USA - 1984

It is often said that the 1980s are becoming the decade of multiinstruction stream or MIMD computers, while the 1970s could be described as the decade of the SIMD (single instruction stream multiple data stream) computers. The availability of microprocessors and VLSI facilities has led to the proposal and construction of novel computer architectures based on linking many hundreds or even thousands of microprocessors, or specially designed VLSI chips. Some of the larger manufacturers offer computers with a small number of CPUs. Because of the variety of the new developments, it was decided to conduct a survey of proposed and existing MIMD computers in the U.S., taking into account a simple classification of the different devices. Particular attention is given to computers which are designed for numerical work with floating-point numbers and the solution of large problems in physics, chemistry, and engineering.

Hockney, R. W.↗

Theory of Periodic-Binary-Sequence Generators

Algorithms yield feedback shift registers with maximum regularity. Report provides extensive mathematical treatment of new and previous results related to generation of pseudo-noise binary sequences by feedback shift registers. Generator architectures amenable to efficient implementation in very-large-scale integrated (VLSI) circuits. Report includes literature references to applications of such sequences in random-number generation, radar, VLSI testing, data encryption and decryption, algebraic error-detection and error-correction encoding and decoding, and feedback-shift-register synthesis of sequential machines.

Perlman, M.↗

Survey of current correlators and applications

With this summary an attempt is made to contact as many users as possible so as to provide summary data on correlation systems, both in use and as planned. Data on currently available very large scale integration (VLSI) chips and complete systems are included. Also, several planned correlator systems are described and summarized in tabular form. Finally, a description is given of the work being done in the Communications Systems Research Section on VLSI correlator chips and complete correlator systems.

Lahmeyer, C. R.↗

Spacecraft on-board SAR processing technology

This paper provides an assessment of the on-board SAR processing technology for Eos-type missions. The proposed Eos SAR sensor and flight data system are introduced, and the SAR processing requirements are described. The SAR on-board SAR processor architecture selection is discussed, and a baseline processor architecture using a frequency-domain processor for range correlation and a modular fault-tolerant VLSI time-domain parallel array for azimuth correlation are described. The mass storage and VLSI technologies needed for implementing the proposed SAR processing are assessed. It is shown that acceptable processor power and mass characteristics should be feasible for Eos-type applications. A proposed development strategy for the on-board SAR processor is presented.

Liu, K. Y.↗

Wiring Viterbi decoders (splitting deBruijn graphs)

A new Viterbi decoder, capable of decoding convolutional codes with constraint lengths up to 15, is under development for the Deep Space Network (DSN). A key feature of this decoder is a two-level partitioning of the Viterbi state diagram into identical subgraphs. The larger subgraphs correspond to circuit boards, while the smaller subgraphs correspond to Very Large Scale Integration (VLSI) chips. The full decoder is built from identical boards, which in turn are built from identical chips. The resulting system is modular and hierarchical. The decoder is easy to implement, test, and repair because it uses a single VLSI chip design and a single board design. The partitioning is completely general in the sense that an appropriate number of boards or chips may be wired together to implement a Viterbi decoder of any size greater than or equal to the size of the module.

Collins, O.↗

Parallel processing for digital picture comparison

In picture processing an important problem is to identify two digital pictures of the same scene taken under different lighting conditions. This kind of problem can be found in remote sensing, satellite signal processing and the related areas. The identification can be done by transforming the gray levels so that the gray level histograms of the two pictures are closely matched. The transformation problem can be solved by using the packing method. Researchers propose a VLSI architecture consisting of m x n processing elements with extensive parallel and pipelining computation capabilities to speed up the transformation with the time complexity 0(max(m,n)), where m and n are the numbers of the gray levels of the input picture and the reference picture respectively. If using uniprocessor and a dynamic programming algorithm, the time complexity will be 0(m(3)xn). The algorithm partition problem, as an important issue in VLSI design, is discussed. Verification of the proposed architecture is also given.

Cheng, H. D.↗

Pipeline Time- And Transform-Domain Reed-Solomon Decoders

Modification of decoding algorithms leads to simplified conceptual designs for time- and transform-domain Reed-Soloman (RS) decoders suitable for implementation as very-large-scale integrated (VLSI) circuits. New conceptual decoders determine simultaneously errata-locator and errata-evaluator polynomials as part of simplified scheme for corrections of errors and erasures in RS codes. Highly suitable for implementation in both VLSI circuitry and in software on general-purpose computer.

Hsu, In-Shek↗

Modulation and coding for satellite and space communications

Several modulation and coding advances supported by NASA are summarized. To support long-constraint-length convolutional code, a VLSI maximum-likelihood decoder, utilizing parallel processing techniques, which is being developed to decode convolutional codes of constraint length 15 and a code rate as low as 1/6 is discussed. A VLSI high-speed 8-b Reed-Solomon decoder which is being developed for advanced tracking and data relay satellite (ATDRS) applications is discussed. A 300-Mb/s modem with continuous phase modulation (CPM) and codings which is being developed for ATDRS is discussed. Trellis-coded modulation (TCM) techniques are discussed for satellite-based mobile communication applications.

Yuen, Joseph H.↗

Design and implementation of interface units for high speed fiber optics local area networks and broadband integrated services digital networks

The design and implementation of interface units for high speed Fiber Optic Local Area Networks and Broadband Integrated Services Digital Networks are discussed. During the last years, a number of network adapters that are designed to support high speed communications have emerged. This approach to the design of a high speed network interface unit was to implement package processing functions in hardware, using VLSI technology. The VLSI hardware implementation of a buffer management unit, which is required in such architectures, is described.

Tobagi, Fouad A.↗

The Xpress Transfer Protocol (XTP): A tutorial (short version)

The Xpress Transfer Protocol (XTP) is a reliable, light weight transfer layer protocol. Current transport layer protocols such as DoD's Transmission Control Protocol (TCP) and ISO's Transport Protocol (TP) were not designed for the next generation of high speed, interconnected reliable networks such as fiber distributed data interface (FDDI) and the gigabit/second wide area networks. Unlike all previous transport layer protocols, XTP is being designed to be implemented in hardware as a VLSI chip set. By streamlining the protocol, combining the transport and network layers, and utilizing the increased speed and parallelization possible with a VLSI implementation, XTP will be able to provide the end-to-end data transmission rates demanded in the high speed networks without compromising reliability and functionality. This tutorial briefly describes the operation of the XTP protocol and in particular, its error, flow and rate control; inter-networking addressing mechanisms; and multicast support features, as defined in the XTP Protocol Definition Revision 3.4.

Sanders, Robert M.↗

The Xpress Transfer Protocol (XTP): A tutorial (expanded version)

The Xpress Transfer Protocol (XTP) is a reliable, real-time, light weight transfer layer protocol. Current transport layer protocols such as DoD's Transmission Control Protocol (TCP) and ISO's Transport Protocol (TP) were not designed for the next generation of high speed, interconnected reliable networks such as fiber distributed data interface (FDDI) and the gigabit/second wide area networks. Unlike all previous transport layer protocols, XTP is being designed to be implemented in hardware as a VLSI chip set. By streamlining the protocol, combining the transport and network layers and utilizing the increased speed and parallelization possible with a VLSI implementation, XTP will be able to provide the end-to-end data transmission rates demanded in high speed networks without compromising reliability and functionality. This paper describes the operation of the XTP protocol and in particular, its error, flow and rate control; inter-networking addressing mechanisms; and multicast support features, as defined in the XTP Protocol Definition Revision 3.4.

Sanders, Robert M.↗

Single board system for fuzzy inference

The very large scale integration (VLSI) implementation of a fuzzy logic inference mechanism allows the use of rule-based control and decision making in demanding real-time applications. Researchers designed a full custom VLSI inference engine. The chip was fabricated using CMOS technology. The chip consists of 688,000 transistors of which 476,000 are used for RAM memory. The fuzzy logic inference engine board system incorporates the custom designed integrated circuit into a standard VMEbus environment. The Fuzzy Logic system uses Transistor-Transistor Logic (TTL) parts to provide the interface between the Fuzzy chip and a standard, double height VMEbus backplane, allowing the chip to perform application process control through the VMEbus host. High level C language functions hide details of the hardware system interface from the applications level programmer. The first version of the board was installed on a robot at Oak Ridge National Laboratory in January of 1990.

Symon, James R.↗