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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Modified Spot Welder Solders Flat Cables

Soldering device, essentially modified spot welder, melts high-melting-temperature solders without damaging plastic insulation on flat electrical cables. Solder preform rests on exposed conductor of cable, under connector pin. Electrodes press pin/preform/conductor sandwich together and supply pulse of current to melt preform, bonding pin to conductor. Anvil acts as support and heat sink. Device used to solder flexible ribbon cables to subminiature pin connectors.

Haehner, Carl L.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS1985

Rotatable electric cable connecting system

A cable reel assembly is described which is particularly adapted for, but not limited to, a system for providing electrical connection of power and data signals between an orbiter vehicle, such as a space shuttle, and a recovered satellite. The assembly is comprised of two mutually opposing ring type structures having 180 deg relative rotation with one of the structures being held in fixed position while the other structure is rotatable. Motor controlled berthing latches and umbilical cable connectors for the satellite are located on the rim of the rotatable ring structure. The electrical cable assembly is fed in two sections from the orbiter vehicle into the outer rim portion of the fixed ring structure where they are directed inwardly and attached to two concentrically coiled metal bands whose respective ends are secured to inner and outer post members of circular sets of guide pins located on opposing circular plate members, one rotatable and one fixed. The cable sections are fed out as three output cable sections through openings in the central portion of the circular plate of the rotatable ring structure where they are directed to the latches and connectors located on its rim.

Manges, D. R.↗
NASA NTRS2011

Cable Tester Box

Cables are very important electrical devices that carry power and signals across multiple instruments. Any fault in a cable can easily result in a catastrophic outcome. Therefore, verifying that all cables are built to spec is a very important part of Electrical Integration Procedures. Currently, there are two methods used in lab for verifying cable connectivity. (1) Using a Break-Out Box and an ohmmeter this method is time-consuming but effective for custom cables and (2) Commercial Automated Cable Tester Boxes this method is fast, but to test custom cables often requires pre-programmed configuration files, and cables used on spacecraft are often uniquely designed for specific purposes. The idea is to develop a semi-automatic continuity tester that reduces human effort in cable testing, speeds up the electrical integration process, and ensures system safety. The JPL-Cable Tester Box is developed to check every single possible electrical connection in a cable in parallel. This system indicates connectivity through LED (light emitting diode) circuits. Users can choose to test any pin/shell (test node) with a single push of a button, and any other nodes that are shorted to the test node, even if they are in the same connector, will light up with the test node. The JPL-Cable Tester Boxes offers the following advantages: 1. Easy to use: The architecture is simple enough that it only takes 5 minutes for anyone to learn how operate the Cable Tester Box. No pre-programming and calibration are required, since this box only checks continuity. 2. Fast: The cable tester box checks all the possible electrical connections in parallel at a push of a button. If a cable normally takes half an hour to test, using the Cable Tester Box will improve the speed to as little as 60 seconds to complete. 3. Versatile: Multiple cable tester boxes can be used together. As long as all the boxes share the same electrical potential, any number of connectors can be tested together.

Lee, Jason H.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS1988

Loss-Compensated Optical Sensor Systems

Variations in fiber losses little effect on outputs. Fiber-optic sensing system conceptually related to electrical bridge circuit scarcely affected by variations in losses of optical fibers and connectors. Versions of system investigated for use as linear- and angular-position sensors for advanced aircraft controls. Position accuracies of 8 to 10 bits eventually achieved.

Beheim, Glenn↗
NASA NTRSDate not supplied

Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits

A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.

DC Powered Oven↗
NASA NTRS1991

Mechanized fluid connector and assembly tool system with ball detents

A fluid connector system is disclosed which includes a modified plumbing union having a rotatable member for drawing said union into a fluid tight condition. A drive tool is electric motor actuated and includes a reduction gear train providing an output gear engaging an integral peripheral spur gear on the rotatable member. Coaxial alignment means are attached to both the connector assembly and the drive tool. A hand lever actuated latching system includes a plurality of circumferentially spaced latching balls selectively wedged against the alignment means attached to the connector assembly or to secure the drive tool with its output gear in mesh with the integral peripheral spur gear. The drive motor is torque, speed, and direction controllable.

Zentner, Ronald C.↗
NASA NTRS2010

SSME Electrical Harness and Cable Development and Evolution

The Space Shuttle Main Engine (SSME) electrical harness and cable system consists of the various interconnecting devices necessary for operation of complex rocket engine functions. Thirty seven harnesses incorporate unique connectors, backshell adapters, conductors, insulation, shielding, and physical barriers for a long maintenance-free life while providing the means to satisfy performance requirements and to mitigate adverse environmental influences. The objective of this paper is to provide a description of the SSME electrical harness and cable designs as well as the development history and lessons learned.

Abrams, Russ↗
NASA NTRS1970

Flat conductor cable connector with contact separation seal

Cable connector is developed in which each pair of contact elements is isolated by plastic cells and the mating interface is sealed by an elastic gasket. So insulated, the connector may be operated under high vacuum conditions at voltages up to 600 V ac without electrical leakage or intercontact ionization.

Angele, W.↗
NASA NTRS1983

Photovoltaic stand-alone modular systems, phase 2

The final hardware and system qualification phase of a two part stand-alone photovoltaic (PV) system development is covered. The final design incorporated modular, power blocks capable of expanding incrementally from 320 watts to twenty kilowatts (PK). The basic power unit (PU) was nominally rated 1.28 kWp. The controls units, power collection buses and main lugs, electrical protection subsystems, power switching, and load management circuits are housed in a common control enclosure. Photo-voltaic modules are electrically connected in a horizontal daisy-chain method via Amp Solarlok plugs mating with compatible connectors installed on the back side of each photovoltaic module. A pair of channel rails accommodate the mounting of the modules into a frameless panel support structure. Foundations are of a unique planter (tub-like) configuration to allow for world-wide deployment without restriction as to types of soil. One battery string capable of supplying approximately 240 ampere hours nominal of carryover power is specified for each basic power unit. Load prioritization and shedding circuits are included to protect critical loads and selectively shed and defer lower priority or noncritical power demands. The baseline system, operating at approximately 2 1/2 PUs (3.2 kW pk.) was installed and deployed. Qualification was successfully complete in March 1983; since that time, the demonstration system has logged approximately 3000 hours of continuous operation under load without major incident.

Naff, G. J.↗
NASA NTRS1987

Reliable Wiring Harness

New harness for electrical wiring includes plugs that do not loosen from vibration. Ground braids prevented from detaching from connectors and constrained so braids do not open into swollen "birdcage" sections. Spring of stainless steel encircles ground braid. Self-locking connector contains ratchet not only preventing connector from opening, but tightens when vibrated.

Gaspar, Kenneth C.↗
NASA NTRS1992

High temperature solder device for flat cables

A high temperature solder device for flat cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially available resistance welding machine such as the Split Tip Electrode microwelder by Weltek, which consists of two separate electrode halves with a removable dielectric spacer in between. The microwelder is not used to weld the items together, but to provide a controlled compressive force on, and energy pulse to, a solder preform placed between a pin of the connector and a conductor of the flexible flat ribbon cable. When the microwelder is operated, an electric pulse will flow down one electrode, through the solder preform and back up the other electrode. This pulse of electrical energy will cause the solder preform to heat up and melt, joining the pin and conductor.

Haehner, Carl L.↗
NASA NTRS1980

Securing connector pins to a PC board

Solder preforms hold pins firmly to withstand repeated insertion and removal of circuit cards. Advantage is excellent electrical continuity between board circuits and pins.

Graham, D.↗
NASA NTRS1993

Easy-To-Use Connector

Quick-connect/disconnect mechanism consists of two mating assemblies put together easily, even when initially misaligned by fairly large amounts. Used as electrical- or fluid-connection interface. Operated by humans or robots when fast connections must be made without precise positioning, -- for example, on offshore oil rigs, ship-to-dock links, nuclear facilities, and aircraft at loading gates.

Wightman, William D.↗
NASA NTRS1994

Bipolar Ag-Zn battery

The silver-zinc (AgZn) battery system has been unique in its ability to safely satisfy high power demand applications with low mass and volume. However, a new generation of defense, aerospace, and commercial applications will impose even higher power demands. These new power demands can be satisfied by the development of a bipolar battery design. In this configuration the power consuming, interelectrode current conductors are eliminated while the current is then conducted via the large cross-section electrode substrate. Negative and positive active materials are applied to opposite sides of a solid silver foil substrate. In addition to reducing the weight and volume required for a specified power level, the output voltage performance is also improved as follows. Reduced weight through: elimination of the plastic cell container; elimination of plate leads and intercell connector; and elimination of internal plate current collector. Increased voltage through: elimination of resistance of current collector; elimination of resistance of plate lead; and elimination of resistance of intercell connector. EPI worked previously on development of a secondary bipolar silver zinc battery. This development demonstrated the electrical capability of the system and manufacturing techniques. One difficulty with this development was mechanical problems with the seals. However, recent improvements in plastics and adhesives should eliminate the major problem of maintaining a seal around the periphery of the bipolar module. The seal problem is not as significant for a primary battery application or for a requirement for only a few discharge cycles. A second difficulty encountered was with activation (introducing electrolyte into the cell) and with venting gas from the cell without loss of electrolyte. During previous work, the following projections for energy density were made from test data for a high power system which demonstrated in excess of 50 discharge/charge cycles. Projected system power = 100 kilowatts; discharge time = 30 seconds; discharge current density = 1.75 amps/sq in.; system weight = 86 lbs (9.7 WH/lb); and system volume = 1071 cu. in. (.78 WH/cu. in.). EPI is currently working on a development program to produce a bipolar silver-zinc battery design for NASA. The potential application would be to power electromechanical actuators for space launch vehicles.

Giltner, L. John↗
NASA NTRS2005

Preliminary low temperature tests of a digital signal processor

This paper describes an initial experiment performed to assess the electrical behavior of the Innovative Integration board containing a Digital Signal Processor (DSP) with its JTAG (Blackhawk) connector at low temperatures. The objective of the experiment is to determine the lowest temperature at which the DSP can operate. The DSP was tested at various low-temperatures and a Genetic Algorithm was used as the DSP test program.

temperatures↗