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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

Array automated assembly task, phase 2. Low cost silicon solar array project

Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.

Rhee, S. S.↗

Solar array strip and a method for forming the same

A flexible solar array strip is formed by providing printed circuitry between flexible layers of a nonconductive material, depositing solder pads on the printed circuitry, and storing the resulting substrate on a drum from which it is then withdrawn and advanced along a linear path. Solderless solar cells are serially transported into engagement with the pads and are infrared radiation to melt the solder and attach the cells to the circuitry. Excess flux is cleaned from the solar cells which are then encapsulated in a protective coating. The resulting array is then wound on a drum.

Mueller, R. L.↗

Metallization of Large Silicon Wafers

A metallization scheme was developed which allows selective plating of silicon solar cell surfaces. The system is comprised of three layers. Palladium, through the formation of palladium silicide at 300 C in nitrogen, makes ohmic contact to the silicon surface. Nickel, plated on top of the palladium silicide layer, forms a solderable interface. Lead-tin solder on the nickel provides conductivity and allows a convenient means for interconnection of cells. To apply this metallization, three chemical plating baths are employed.

Pryor, R. A.↗

Automated Solar-Array Assembly

Large arrays are rapidly assembled from individual solar cells by automated production line developed for NASA's Jet Propulsion Laboratory. Apparatus positions cells within array, attaches interconnection tabs, applies solder flux, and solders interconnections. Cells are placed in either straight or staggered configurations and may be connected either in series or in parallel. Are attached at rate of one every 5 seconds.

Soffa, A.↗

Terminal Strip Facilitates Printed-Circuit Board Changes

Laminanted copper and polyimide terminal strip makes it easy to modify printed-circuit (PC) board, after board has been fabricated. When epoxied over conductors or insulating portion of PC board, strip provides series of solder-coated copper conductor pads to which integrated-circuit leads are soldered for functional changes. Terminal strips accommodate leads on dual inline IC package or as staggered single or multiple leads on planar mounted flatpacks.

Pinto, E. A.↗

U.S. welding technology - Constraints to space implementation

U.S. and European efforts to develop welding techniques for satellite solar arrays are described. Soldering practices in the U.S. have benefitted from Mo solders, which are well fitted to Si solar cell material thermal characteristics. Analyses have indicated that welds are the preferred method for interconnections and bonds. Extensive work has been done with the parallel gap resistance method (RW), which involves process heat generated by passing a current through resistive layers. Confining the primary heat input to the interconnector/cell contact interface results in welds being formed beneath both electrodes. Pulse welding has become the dominant RW technique in Europe, while ultrasonic welding is used in the U.S.; silver is employed as the interconnect material on both continents. The bonding techniques have been developed empirically instead of theoretically. An IR inspection technique has been produced for monitoring the weld temperature.

Stella, P. M.↗

The NASA welding assessment program

The potential cost and performance advantages of welding was understood but ignored by solar panel manufacturers in the U.S. Although NASA, DOD and COMSAT have supported welding development efforts, soldering remains the only U.S. space qualified method for interconnecting solar cells. The reason is that no U.S. satellite prime contractor found it necessary, due to mission requirements, to abandon the space proven soldering process. It appears that the proposed NASA space station program will provide an array requirement, a 10 year operation in a low Earth orbital environment, that mandates welding. The status of welding technology in the U.S. is assessed.

Scott-Monck, J.↗

Welded solar cell interconnection

The efficiency of the welding of solar-cell interconnects is compared with the efficiency of soldering such interconnects, and the cases in which welding may be superior are examined. Emphasis is placed on ultrasonic welding; attention is given to the solar-cell welding machine, the application of the welding process to different solar-cell configurations, producibility, and long-life performance of welded interconnects. Much of the present work has been directed toward providing increased confidence in the reliability of welding using conditions approximating those that would occur with large-scale array production. It is concluded that there is as yet insufficient data to determine which of three methods (soldering, parallel gap welding, and ultrasonic welding) provides the longest-duration solar panel life.

Stofel, E. J.↗

Series Connection of Solar Cells

Roll soldering from continuous string of cells. Automatic, continuous process attaches interconnecting strips to series string of silicon solar cells. Manufacturing process attaches each conductor from positive side of one cell to negative side of next. For reliability, 22 contacts are soldered on each side of each cell.

Keenan, R.↗

All-metal, compact heat exchanger for space cryocoolers

This report describes the development of a high performance, all metal compact heat exchanger. The device is designed for use in a reverse Brayton cryogenic cooler which provides five watts of refrigeration at 70 K. The heat exchanger consists of a stainless steel tube concentrically assembled within a second stainless steel tube. Approximately 300 pairs of slotted copper disks and matching annular slotted copper plates are positioned along the centerline axis of the concentric tubes. Each of the disks and plates has approximately 1200 precise slots machined by means of a special electric discharge process. Positioning of the disk and plate pairs is accomplished by means of dimples in the surface of the tubes. Mechanical and thermal connections between the tubes and plate/disk pairs are made by solder joints. The heat exchanger assembly is 9 cm in diameter by 50 cm in length and has a mass of 10 kg. The predicted thermal effectiveness is greater than 0.985 at design conditions. Pressure loss at design conditions is less than 5 kPa in both fluid passages. Tests were performed on a subassembly of plates integrally soldered to two end headers. The measured thermal effectiveness of the test article exceeded predicted levels. Pressure losses were negligibly higher than predictions.

Swift, Walter L.↗

A comparison of paper and computer procedures in a Shuttle flight environment

The Electronic Procedures Experiment (EPROC) was flown as part of the Human Factors Assessment (HFA) experiment aboard the SpaceHab-1/STS-57 mission. EPROC is concerned with future, longer-duration missions which will increasingly rely on electronic procedures since they are more easily launched, updated in-flight, and offer automatic or on-request capabilities not available with paper. A computer-based task simulating a Space Station Propulsion System task was completed by one crewmember. The crewmember performed the task once using paper and once using computer procedures. A soldering and desoldering task was performed by another crewmember. Soldering was completed with paper procedures and desoldering was completed using computer procedures. Objective data was collected during each task session from the computer programs, videotapes, and crew notations in the paper and computer procedures. After each task session, subjective data was collected through the use of a computer-based questionnaire program. Resultant recommendations will be made available to future designers of electronic procedures systems for manned-space missions and other related uses.

Michael O'Neal↗

SpaceHab 1 maintenance experiment

The SpaceHab 1 flight on STS-57 served as a test platform for evaluation of two space station payloads. The first payload evaluated a space station maintenance concept using a sweep signal generator and a 48-channel logic analyzer to perform fault detection and isolation. Crew procedures files, test setup diagram files, and software to configure the test equipment were created on the ground and uplinked on the astronauts' voice communication circuit to perform tests in flight. In order to use these files, the portable computer was operated in a multi-window configuration. The test data transmitted to the ground allowing the ground staff to identify the cause of the fault and provide the crew with the repair procedures and diagrams. The crew successfully repaired the system under test. The second payload investigated hand soldering and de-soldering of standard components on printed circuit (PC) boards in zero gravity. It also used a new type of intra-vehicular foot restraints which uses the neutral body posture in zero-g to provide retention of the crew without their conscious attention.

Bohannon, Jackie W.↗

Joining Carbon-Carbon Composites and High-Temperature Materials with High Energy Electron Beams

1. Program goals addressed during this period. Experimental work was directed at formation of a low-stress bond between carbon- carbon and aluminum, with the objective of minimizing the heating of the aluminum substrate, thereby minimizing stresses resulting from the coefficient of thermal expansion (CTE) difference between the aluminum and carbon-carbon. A second objective was to form a bond between carbon-carbon and aluminum with good thermal conductivity for electronic thermal management (SEM-E) application. 2. Substrates and joining materials selected during this period. Carbon-Carbon Composite (CCC) to Aluminum. CCC (Cu coated) to Aluminum. Soldering compounds based on Sn/Pb and Sn/Ag/Cu/Bi compositions. 3. Soldering experiments performed. Conventional techniques. High Energy Electron Beam (HEEB) process.

Goodman, Daniel↗

Orbital Processing of Eutectic Rod-Like Arrays

The eutectic is one of only three solidification classes that exist. The others are isostructural and peritectic-class reactions, respectively. Simplistically, in a binaryeutectic phase diagram, a single liquid phase isothermally decomposes to two solid phases in a cooperative manner. The melting point minimum at the eutectic composition, isothermal solidification temperature, near-isocompositional solidification and refined solidification microstructure lend themselves naturally to such applications as brazing and soldering; industries that eutectic alloys dominate. Interest in direct process control of microstructures has led, more recently, to in-situ eutectic directional solidification with applications in electro-magnetics and electro-optics. In these cases, controlled structural refinement and the high aspect ratio and regularity of the distributed eutectic phases is highly significant to the fabrication and application of these in-situ natural composites. The natural pattern formation and scaling of the dispersed phase on a sub-micron scale has enormous potential application, since fabricating bulk materials on this scale mechanically has proven to be particularly difficult. It is thus of obvious importance to understand the solidification of eutectic materials since they are of great commercial significance. The dominant theory that describes eutectic solidification was derived for diffusion-controlled growth of alloys where both solid eutectic phases solidify metallically, i.e. without faceting at the solidification interface. Both high volume fraction (lamellar) and low volume fraction (rod-like) regular metallic arrays are treated by this theory. Many of the useful solders and brazements, however, and most of the regular in-situ composites are characterized by solidification reactions that are faceted/non-faceted in nature, rather than doubly non-faceted (metallic). Further, diffusion-controlled growth conditions are atypical terrestrially since gravitationally-driven convection is pervasive. As a consequence, it is important to determine whether these faceted/non-faceted composites behave in the same manner as their doubly non-faceted counterparts, particularly in the presence of convection. Prior analytical convective sensitivity testing of this theory predicted insensitivity. Prior experimental testing of this theory offered broad-based agreement between theory and experiment, though most results were for high volume fraction lamellar eutectics that solidified without faceting at the solidification interface. Directional solidification experiments of low volume fraction rod eutectics under damped (microgravity or magnetic field) conditions, however, have demonstrated significant sensitivity, challenging this fundamental theory. More recent theories have been proposed which introduce kinetic undercooling, faceting, fluid shear of the solute redistribution zone and the possibility that the interface composition is not the same as the bulk liquid composition. This program tests the established and proposed analytical theories and addresses the origins of discrepancies between the experimental and analytical results.

Larson, David J., Jr.↗

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗

Implications of Pb-free microelectronics assembly in aerospace applications

The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

Pb-free electronics manufacturing↗

Lead free 0201 assembly and thermal cycle/aging reliability

The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.

isothermal aging↗