Search NASA⌕ Search

SEARCH · Search NASA

Results for “printed electronics”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 253 records · Page 14
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Teaching, learning, and planetary exploration

The progress accomplished in the first five months of the three-year grant period of Teaching, Learning, and Planetary Exploration is presented. The objectives of this project are to discover new education products and services based on space science, particularly planetary exploration. An Exploration in Education is the umbrella name for the education projects as they are seen by teachers and the interested public. As described in the proposal, our approach consists of: (1) increasing practical understanding of the potential role and capabilities of the research community to contribute to basic education using new discoveries; (2) developing an intellectual framework for these contributions by supplying criteria and templates for the teacher's stories; (3) attracting astronomers, engineers, and technical staff to the project and helping them form productive education partnerships for the future, (4) exploring relevant technologies and networks for authoring and communicating the teacher's stories; (5) enlisting the participation of potential user's of the teacher's stories in defining the products; (6) actually producing and delivering many educationally useful teacher's stories; and (7) reporting the pilot study results with critical evaluation. Technical progress was made by assembling our electronic publishing stations, designing electronic publications based on space science, and developing distribution approaches for electronic products. Progress was made addressing critical issues by developing policies and procedures for securing intellectual property rights and assembling a focus group of teachers to test our ideas and assure the quality of our products. The following useful materials are being produced: the TOPS report; three electronic 'PictureBooks'; one 'ElectronicArticle'; three 'ElectronicReports'; ten 'PrinterPosters'; and the 'FaxForum' with an initial complement of printed materials. We have coordinated with planetary scientists and astronomers both at the technical and policy level to assure the efficiency and ultimate utility of these efforts to derive educational benefits from the space science and exploration program as a whole.

Brown, Robert A.↗
DOE OSTI2025

3D printed polymer gaskets for custom-form batteries

Additive manufacturing (AM) processes, like 3D printing, help to facilitate complex and customizable battery geometries which can provide design freedom and enhance volumetric energy density within electronic devices. AM materials must have the thermal and mechanical properties that enable printability, and when used in batteries, AM materials must also be chemically and electrochemically compatible with the battery chemistry. The compatibility between AM materials and the battery is of particular importance for the cell packaging materials which must be inert and are often overlooked. This study systematically studies AM-compatible polymeric materials for use as gaskets in lithium-ion cells. The materials investigated include three thermoplastics suitable for material extrusion printing: polylactic acid (PLA), polycarbonate, and polypropylene/polyethylene copolymer (PPPEC); and two photoresins suitable for vat photopolymerization (VPP) printing: an acrylate-based photoresin and a polyethylene glycol diacrylate photoresin. The AM gasket materials were tested in comparison to a conventional commercial polypropylene gasket. Mechanical testing (swell measurements and material stiffness) and electrochemical testing (linear sweep voltammetry and galvanostatic cycling of full cells) demonstrated that PLA and the VPP polymers were the least compatible with the lithium-ion battery chemistry, despite their prevalent use in studies of AM batteries, and that PPPEC was the most compatible.

3D printing↗
DOE OSTI2024

Tip-Induced 3D Printing on the Nanoscale with Field Emission Scanning Probes

3D printing down to the nanoscale remains a significant challenge. In this paper, the study explores the use of scanning probes that emit low-energy electrons (<100 eV) coupled with the localized injection and electron-induced decomposition of precursor molecules, for the precise localized deposition of 3D nanostructures. The experiments are performed inside the chamber of a scanning electron microscope (SEM), enabling the use of the in-built gas injector system (GIS) with gaseous naphthalene precursor for carbon deposition, as well as immediate inspection of the deposits by SEM. Substrate materials are planar fused silica with thin conductive coatings and non-planar copper wedges. After investigation of the deposition process parameters, various 2D and 3D carbon deposits are grown. Vertical nanowires several microns in length with a diameter <100 nm are achieved and 3D deposits with a high degree of nanoscale branching are also obtained, presumably due to a charging effect. High aspect ratio carbon nanostructures such as those demonstrated here can be employed as miniaturized electrodes or field emitters. The tip-based approach presented thus paves the way toward 3D nanoscale printing of various materials and functional nanostructures.

3D printing↗
NASA NTRS2006

The Use of Liquid Isopropyl Alcohol and Hydrogen Peroxide Gas Plasma to Biologically Decontaminate Spacecraft Electronics

Legitimate concern exists regarding sending spacecraft and their associated hardware to solar system bodies where they could possibly contaminate the body's surface with terrestrial microorganisms. The NASA approved guidelines for sterilization as set forth in NPG 8020.12C, which is consistent with the biological contamination control objectives of the Committee on Space Research (COSPAR), recommends subjecting the spacecraft and its associated hardware to dry heat-a dry heat regimen that could potentially employ a temperature of 110(deg)C for up to 200 hours. Such a temperature exposure could prove detrimental to the spacecraft electronics. The stimulated growth of intermetallic compounds (IMCs) in metallic interconnects and/or thermal degradation of organic materials composing much of the hardware could take place over a prolonged temperature regimen. Such detrimental phenomena would almost certainly compromise the integrity and reliability of the electronics. Investigation of sterilization procedures in the medical field suggests that hydrogen peroxide (H202) gas plasma (HPGP) technology can effectively function as an alternative to heat sterilization, especially for heat-sensitive items. Treatment with isopropyl alcohol (IPA) in liquid form prior to exposure of the hardware to HPGP should also prove beneficial. Although IPA is not a sterilant, it is frequently used as a disinfectant because of its bactericidal properties. The use of IPA in electronics cleaning is widely recognized and has been utilized for many years with no adverse affects reported. In addition, IPA is the principal ingredient of the test fluid used in ionic contamination testers to assess the amount of ionic contamination found on the surfaces of printed wiring assemblies. This paper will set forth experimental data confirming the feasibility of the IPA/H202 approach to reach acceptable microbial reduction (MR) levels of spacecraft electronic hardware. In addition, a proposed process flow in which both IPA liquid and HPGP are utilized will be presented in Section 7.0.

microbial reduction↗
DOE OSTI2025

Wafer-Free Crystalline Silicon Solar Cells (CRADA Final Report)

This CRADA project, based on the DOE Solar Energy Technologies Office (SETO) Solar Prize Voucher program, helped Leap Photovoltaics to develop methodologies to immobilize Si particles by permanently attaching them to an Al-coated substrate and thereby forming carrier-selective electrical contacts to the Si particles. The bigger goal was to help Leap Photovoltaics develop these immobilized and contacted particle arrays into relatively efficient, inexpensive, and industrially relevant solar cells. By using Si particles instead of wafers in a solar cell absorber layer, one can avoid costs associated with growing monocrystalline Si ingots, then diamond-sawing them into wafers, then processing wafers into cells – a mainstream practice in today's high-efficiency Si cell and module technology. Monocrystalline or polycrystalline Si particles can be obtained in various ways: for example, Si kerf from wafer sawing is monocrystalline; recycled Si cell wafers can be ball-milled into particles; particles can be grown using various gas-phase techniques (mostly from SiH4). These Si particles can be assembled onto a substrate and serve as an absorber layer for the solar cell, absorbing photons to generate photocarriers. The challenge with this technique is to collect photocarriers from individual Si particles, with separation of photogenerated electrons to the negative cell’s electrode and positive photogenerated holes to the positive electrode. Therefore, each particle must have two isolated, carrier-selective contacts: one for electrons and one for holes. Plus, particles need to be immobilized onto a solid substrate. The goal of this work was focused on the immobilization of Si particles and creating hole-selective contact to them at the same time, using industrially relevant Si photovoltaic (PV) cell technology: screen printing of Al back-surface field electrodes. This is used in the mainstream Propane Education and Research Council (PERC) technology for hole-collecting contacts at the back of the cell. The work performed at NREL consisted of screen printing of Al metal paste on substrates, spreading Si particles onto it, and thermally processing the structures to form hole-collecting contacts. The final structures were investigated by scanning electron microscopy (SEM) after focused ion beam (FIB) cross-sectioning and polishing. The work was done jointly by NREL staff and Leap Photovoltaics (Leap PV) employees stationed at NREL. The samples were then taken to Leap PV for further processing. Training the Leap PV employee on various NREL techniques (laser cutting, screen printing, thermal processing, characterization) was part of the scope.

14 SOLAR ENERGY↗
NASA NTRS2020

Electrodynamic Dust Shield Housing for RASSOR Redesign and Fabrication

Abstract—An Electrodynamic Dust Shield (EDS) was to be mounted over the cameras of the Regolith Advanced Surface Systems Operations Robot (RASSOR) to mitigate the clouding effects and abrasive properties of lunar dust. This report discusses the redesign process and physical fabrication of the housing unit planned to attach the EDS to the RASSOR camera. The two-piece 3D-Printed design consists of a holder and cover unit. The EDS Holder seats the EDS near two live copper contacts that are to be wired into the main electronics housing. The EDS Cover seats two metal leaf spring tabs to bridge the connections between the copper contacts and EDS electrodes, as well as a centralized O-ring that is pressed flush against the EDS to mitigate dust intrusion. All components were modeled, printed, and checked for proper electrical contact and mechanical fit. The built-up assembly was subsequently tested in the Electrostatics and Surface Physics Laboratory (ESPL) and demonstrated good dust clearing performance.

Alexander Lacerna↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
DOE OSTI2026

Search for low-mass electron-recoil dark matter using a single-charge sensitive SuperCDMS-HVeV detector

We present constraints on low-mass dark matter electron scattering and absorption interactions using a SuperCDMS high-voltage eV-resolution (HVeV) detector. Data were taken underground in the NEXUS facility located at Fermilab with an overburden of 225 meters of water equivalent. The experiment benefits from the minimizing of luminescence from the printed circuit boards in the detector holder used in all previous HVeV studies. A blind analysis of 6.1 g · days of exposure produces exclusion limits for dark matter-electron scattering cross sections for masses as low as 1 MeV/𝑐 2 , as well as on the photon-dark photon mixing parameter and the coupling constant between axionlike particles and electrons for particles with masses >1.2 eV/𝑐 2 probed via absorption processes.

dark matter direct detection↗
DOE OSTI2025

Rapid Bayesian High Entropy Alloy Designs Fabricated via Wire Arc Additive Manufacturing

Purpose: This project seeks to demonstrate a new high-throughput (rapid) alloy design technique applied to creating new high entropy alloys (HEAs) for extreme environments. High entropy alloys shift the design paradigm from being focused on a single principal element (e.g. nickel-based alloys) to target alloys that include high atomic fractions (X >10%) of multiple elements. These HEA materials can exhibit sluggish diffusion and enhanced corrosion resistance, ideal for potential applications in advanced ultra supercritical (A-USC) steam cycles for power generation. Scope: The addition of multiple elements in high atomic fractions creates an enormous design space that cannot easily be investigated by traditional material design strategies such as designed of experiments (DOE). This project utilizes a Bayesian machine learning algorithm that has been modified to work with calculation of phase diagrams (CALPHAD) software. This Bayesian algorithm reduces manual inputs and increase the likelihood of achieving an optimal solution. Compositional inputs to this algorithm will be assessed using existing material property models for high temperature strength and corrosion resistance. The target for alloy performance will be a 15% (~100 ⁰C) increase in allowable service temperature beyond heat-resistant stainless steels while maintaining or improving alloy cost and corrosion resistance. Haynes 230 was selected as a baseline, which is 57 wt% Ni with 22 wt% Cr 14 wt% W, and 2 wt% Mo as solid solution strengtheners. In addition to rapid design via Bayesian machine learning, the alloys were rapidly fabricated using a multi-wire arc additive manufacturing (mWAAM) technique which allows for precise control of alloy composition and assessing of alloy design “windows” to study composition effects. Build speeds for wire-arc additive processes are among the highest for additive technologies enabling rapid and reliable sample fabrication when compared to conventional methods such as arc button melting. The mWAAM samples will be rapidly characterized via instrumented indentation for room temperature modulus and strength and for elevated temperature strength via hot hardness tests. After being screened with hardness testing, potential alloys will be further evaluated with conventional microscopy techniques including scanning electron microscopy (SEM) and transmission electron microscopy (TEM) to assess agreement with modeling results. The most promising compositions will also be evaluated by printing full sized tensile specimens for mechanical behavior tests at elevated temperatures. Results: Bayesian machine learning of a single performance function was initially used to optimize five performance metrics: 1) single phase stability, 2) yield strength, 3) creep resistance (low diffusion coefficient), 4) freezing range (weldability), and 5) material cost. The single performance function was suboptimal as assumptions had to be made about the results while formulating the optimization. A goal-oriented Bayesian optimization strategy (Hanaoka, 2021) was implemented with CALPHAD for use with the five metrics above. This multi-objective Bayesian optimization (MOBO) enabled the design of NiCrCoFe alloys with V and W additions. A base composition of NiCoCr was selected as Ni provides a stable FCC matrix, Cr aids corrosion/oxidation resistance, and Co is a solid-solutions strengthener that also improves creep by increasing the activation energy. Fe helps reduce diffusion coefficients and cost. Finally, V and W were selected for their reasonable solubility and high atomic misfit to aid in solid solution strengthening. Cracking of the mWAAM specimens was an early issue, and the Easton solidification cracking model (Easton et al., 2014a) was selected for addition to the MOBO function. High performing alloys fabricated by mWAAM included Ni 28 Cr 25 Co 26 Fe 15 V 8 and Ni 62 Cr 18 Co 1 Fe 3 W 15 . It was observed that even after adapting the mWAAM process for W, the W did not fully dissolve. To fully evaluate the Ni 62 Cr 18 Co 1 Fe 3 W 15 composition, a cored wire (80-20 NiCr sheath/powder core) was manufactured and printed via WAAM, and HIP’ing was utilized to homogenize and densify the printed alloy. The V and W alloys produced met metrics 1 (solid solution), 4 (solidification cracking), and 5 (cost). However, an unmodeled mechanism of thermal stress cracking was identified in the WAAM produced materials, perhaps exacerbated by the lack of grain boundary strengthening elements (B, C). Conclusions & Recommendations: A high-throughput (rapid) alloy design technique was applied to designing and manufacturing new high entropy alloys (HEAs) for extreme environments utilizing MOBO and mWAAM. The developed process was rapid and effective in addressing the mechanisms included in the model. The lack of grain boundary strengthening element additions (e.g., B, C) was a simplification that likely produced thermal stress cracking that turned into a large part of the investigation. Additions on the order of 0.005 wt% B and 0.05 wt% C likely would have minimized thermal stress grain boundary cracking. Overall, the high throughput design strategy is promising for rapid design of metrics-driven alloys for advanced ultra supercritical (A-USC) steam cycles for power generation. The MOBO and mWAAM process could be commercialized to accelerate metrics-driven alloy design. In addition, the cored-wire process utilized for scale-up is a promising high-volume process for WAAM alloy development and scale-up.

36 MATERIALS SCIENCE↗
NASA NTRS2011

Fault Detection, Isolation and Recovery (FDIR) Portable Liquid Oxygen Hardware Demonstrator

The Fault Detection, Isolation and Recovery (FDIR) hardware demonstration will highlight the effort being conducted by Constellation's Ground Operations (GO) to provide the Launch Control System (LCS) with system-level health management during vehicle processing and countdown activities. A proof-of-concept demonstration of the FDIR prototype established the capability of the software to provide real-time fault detection and isolation using generated Liquid Hydrogen data. The FDIR portable testbed unit (presented here) aims to enhance FDIR by providing a dynamic simulation of Constellation subsystems that feed the FDIR software live data based on Liquid Oxygen system properties. The LO2 cryogenic ground system has key properties that are analogous to the properties of an electronic circuit. The LO2 system is modeled using electrical components and an equivalent circuit is designed on a printed circuit board to simulate the live data. The portable testbed is also be equipped with data acquisition and communication hardware to relay the measurements to the FDIR application running on a PC. This portable testbed is an ideal capability to perform FDIR software testing, troubleshooting, training among others.

Oostdyk, Rebecca L.↗
DOE OSTI2025

Search for low-mass electron-recoil dark matter using a single-charge sensitive SuperCDMS-HVeV Detector

We present constraints on low mass dark matter-electron scattering and absorption interactions using a SuperCDMS high-voltage eV-resolution (HVeV) detector. Data were taken underground in the NEXUS facility located at Fermilab with an overburden of 225 meters of water equivalent. The experiment benefits from the minimizing of luminescence from the printed circuit boards in the detector holder used in all previous HVeV studies. A blind analysis of $6.1\,\mathrm{g\cdot days}$ of exposure produces exclusion limits for dark matter-electron scattering cross-sections for masses as low as $1\,\mathrm{MeV}/c^2$, as well as on the photon-dark photon mixing parameter and the coupling constant between axion-like particles and electrons for particles with masses $>1.2\,\mathrm{eV}/c^2$ probed via absorption processes.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2025

Microstructure characteristics of LPBF&HIP fabricated graded composite transition joint between ferritic steel and austenitic stainless steel

Graded composite transition joints (GCTJs) offer a promising alternative to conventional dissimilar metal welds (DMWs) by enabling smooth compositional and microstructural transitions. However, GCTJs fabricated solely through additive manufacturing (AM) face challenges such as heat accumulation, complex parameter control, and elemental segregation. In this study, we propose a novel approach that relies on AM to design a spatially graded structure in one alloy and then employs hot isostatic pressing (HIP) as a diffusion bonding method to join it with a second alloy. Here, this method combines the flexibility of AM with the powder net-shaping advantage of HIP. Specifically, a series of closely packed austenitic stainless steel 304 conical structures were printed using laser powder bed fusion (LPBF) and then combined with ferritic steel P91 powder via HIP. By using electron backscatter diffraction (EBSD), electron probe microanalysis (EPMA), and transmission electron microscopy (TEM) techniques, the microstructure characteristics of the GCTJ of 304&P91, especially the interdiffusion zone (IDZ), have been systematically investigated. The microstructure at the interface transitions from austenite-ferrite (A+F) to austenite-martensite-ferrite (A+M+F), and finally to martensite-ferrite (M+F) due to diffusion. Additionally, the diffusion width between 304 and P91 increases with the volume fraction of P91. This unique design also ensures a gradual transition in both hardness and thermal expansion coefficient from 304 to P91, thereby enabling a smooth gradient in functional properties. Overall, this study proposes a novel approach for fabricating GCTJs and contributes to advancing design concepts in the field of dissimilar metal joining.

Additively manufacturing (AM)↗
NASA NTRS1976

Contrast enhancement of transparencies

System can enhance or reduce contrast of photographic transparency for printing or projection by using constructive and destructive interference of collimated laser beam. System is potentially less expensive than electronic CRT methods and is more accurate than trial-and-error manual techniques.

Shulman, A. R.↗
NASA NTRS1984

Improved Coil for Hydrogen Dissociators

Flat coil has rigid printed circuit substrate. New coil structure minimizes RF electric field near glass walls of plasma vessel; therefore reduces direct electron bombardment of glass. Design lends itself well to high production and standardized dimensions.

Vessot, R.↗
NASA NTRS1996

Research and Technology Highlights 1995

The mission of the NASA Langley Research Center is to increase the knowledge and capability of the United States in a full range of aeronautics disciplines and in selected space disciplines. This mission is accomplished by performing innovative research relevant to national needs and Agency goals, transferring technology to users in a timely manner, and providing development support to other United States Government agencies, industry, other NASA Centers, the educational community, and the local community. This report contains highlights of the major accomplishments and applications that have been made by Langley researchers and by our university and industry colleagues during the past year. The highlights illustrate both the broad range of research and technology (R&T) activities carried out by NASA Langley Research Center and the contributions of this work toward maintaining United States leadership in aeronautics and space research. An electronic version of the report is available at URL http://techreports.larc.nasa.gov/RandT95. This color version allows viewing, retrieving, and printing of the highlights, searching and browsing through the sections, and access to an on-line directory of Langley researchers.

Source record↗
NASA NTRS2011

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Strickland, S. M.↗
NASA NTRS2013

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew↗