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At least 253 records · Page 14

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NASA NTRS1987

A theoretical comparison of internal gravity wave propagation and dissipation in high and low temperature thermospheres Implications for orbiting spacecraft

In this paper the propagation and dissipation characteristics of a number of individual internal gravity waves are discussed and compared by using a multilayer, time-averaged model in which the waves lose energy due to viscous, thermal conduction and ion-drag dissipation. From this both the height and horizontal distance (from an assumed 'source') at which the waves achieve a maximum density amplitude may be determined. Such calculations are performed for both a very hot and a very cold thermosphere, and the subsequent differences in the wave characteristics and their relation to the control of orbiting spacecraft for each of these is discussed.

Hickey, M. P.↗

DOE OSTI2022

Thermal-Hydraulics Modeling and Simulations of Hot Pool Using the SAS-CFD Coupled Code

The main goal of this activity is to test the dynamic coupling of the SAS4A/SASSYS-1 (SAS) and CFD models, using a recently patched version of the SAS code intended to address an undocumented limitation that hindered the Versatile Test Reactor (VTR) simulation efforts in FY21. As described in previous VTR calculation reports, the undocumented limitation in SAS v5.4 does not allow the user to activate the CFD coupling option during restart calculations. Since the analysts were unaware of this limitation, prior SAS-CFD simulation results for the protected station blackout (PSBO) transient were erroneous. Root-cause analysis was performed to determine the cause of this undocumented limitation in SAS v5.4, the SAS software was updated in a new patch, and the SAS-CFD simulations were repeated with this patched software. The results of the SAS-CFD simulations documented in this report show that the software patch does address the cited issue, and that the patched software indeed supports the activation of the CFD coupling model in restart calculations. The SAS development team will determine the schedule for implementing the patch in an official software release. This report documents updated SAS-CFD simulations of the PSBO transient response in the VTR. The hot pool is modeled with the CFD code STAR-CCM+, which is coupled at the flow boundaries to the SAS model of the primary heat transport system. SAS computes the mass flow rate and temperature at each core subassembly outlet, the thermal insulation cavity bypass, and the IHX inlet windows. CFD in turn computes the absolute pressure and temperature at each of these boundaries. The SAS code will ignore the temperature data at flow boundaries where flow is directed into the hot pool, i.e., at the core subassembly outlets unless flow reversal occurs. Similarly, CFD will ignore temperature data at boundaries where the flow is directed out of the hot pool, i.e., at the IHX inlets except under flow reversal. The focus of this work is to ensure that the SAS software patch addresses the undocumented limitation described in prior VTR calculation reports, rather than the accurate assessment of thermal stratification in the VTR during protected transients. This motivates the development of a new, simplified CFD model with a coarser mesh to accelerate the testing process. The updated model, and simplifying assumptions, are documented in this report. In future work, the thermal stratification assessment should be performed in more detail. The simplified CFD model can be improved by performing grid convergence studies sensitivity studies of turbulence parameters (e.g., Prandtl number, turbulence production and dissipation parameters) on temperature distributions and thermal stratification.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

NASA NTRS2017

Thermal Analysis of the X3 Hall Thruster

Electric propulsion has generated significant interest recently as a mass efficient thrust option for deep space missions. This increased interest has drawn a renewed focus on improving the efficiency of electric propulsion thrusters, specifically Hall thrusters. Hall thrusters are a specific subset of ion engines that accelerate charged particles using a Hall current. Recent research into the 12.5 kW HERMeS (Hall Effect Rocket with Magnetic Shielding) for use on the proposed Asteroid Redirect Robotic Mission (ARRM) has shown the desire to use these devices on flight missions outside of earth orbit. This paper will focus on another Hall thruster, the X3. The X3 is a 100 kW class Hall effect thruster used for laboratory technology development. What makes the X3 unique, relative to more contemporary Hall thrusters beyond the order of magnitude increase in discharge power, is that the X3 is a 3 channel, nested Hall thruster. Common Hall thrusters typically have one annular channel where the plasma is constrained and used to charge the fuel and accelerated. The X3’s 3 channels are nested in a concentric format, with each channel fitting in a single plane. This presents very unique thermal modeling challenges with respect to quantifying the impact of plasma thermal loading and cross talk between the power dissipating components for each channel. This work will discuss the development of the X3 thermal model and the efforts to validate it with experimental data. Furthermore, some of the unique challenges that appear when trying to model high power components will be discussed. The X3 represents a challenging and interesting example of the issues affecting thermal modeling of high power electric propulsion thrusters which will become more prevalent as their use becomes more common. II

Hofer, Richard Jr.↗

DOE OSTI2023

Hierarchical thermal-conductive polymer nanocomposites for thermal management

Managing heat in electrical conductors is a major challenge to meet the demands for sustainable energy use and electrical reliability, most notably power electronics and energy-critical electrical machines. Achieving such disparate functionalities, such as high temperature thermal and electrical reliability, require rational design and manufacturing of thermal conductor material and its hierarchical structures. Here we present hierarchical thermal-conductive nanocomposites, consisting of nanostructured ceramic conformal coating and aligned ultrahigh molecular weight polyethylene fiber, to tailor heat dissipation in electric conductors. The hybrid aligned thermal interface exhibits a highly desirable temperature dependent anisotropic high thermal conductivity with 0.98W m –1 K –1 and dielectric strength with 3.4. In addition, electrically insulating thermal interfaces demonstrate high-performing and reliable electrical systems under the dynamic load conditions. The surface temperature of heterogeneous ceramic-polymer encapsulated conductor is 17.8 °C lower than that of polymer-encapsulated conductor at the same electrical load. Consequently, the findings shown here hold great promises for directing heat extraction in electrical machine systems, advancing thermal management for emerging electronic applications.

36 MATERIALS SCIENCE↗

NASA NTRS2024

x Thermal Straps

Thermal straps, also known as heat straps or flexible conductive links, offer design solutions for enhancing the thermal bond of two items that may need to be mechanically decoupled. The need for mechanical decoupling can be driven by requirements for things like vibration or load isolation, or simply by packaging constraints. A few examples include thermal straps used to mechanically isolate delicate spaceborne detectors from cryocooler vibrations, or thermal straps coupling a high-dissipation electronic component to a heat sink on an adjacent surface in a volume optimized electronics unit.

thermal, heat transfer, straps↗

NASA NTRSDate not supplied

Development and Application of a Novel Calorimetry Technique for the Study of Lithium-Ion Cell Thermal Runaway

Lithium-ion battery technology is widely used and is attractive due to demonstrated specific energies in the 200-300 W-hr/kg range. The excellent, mass-efficient energy storage capability of lithium-ion batteries has led to their use on many aerospace platforms. However, lithium-ion batteries can exhibit thermal runaway behavior wherein stored electrochemical energy is released rapidly as a result of thermal or mechanical failure, electrochemical abuse, internal or external short circuiting. A single cell undergoing thermal runaway within a battery has the potential to induce thermal runaway in adjacent cells if heat dissipation is not properly managed and can result in a catastrophic failure of the battery. Designing batteries that are resistant to thermal runaway propagation requires an understanding of, not only, total energy yield but also the means by which that energy is liberated from the cell. While Accelerating Rate Calorimetry and other techniques provide total thermal runaway energy yield, they do not provide the fractional breakdown of energy liberated via conduction through the cell casing from that which is vented from the cell as hot gases and effluents. Such data are needed to inform battery thermal design and analysis. To measure the total energy yield, the fraction conducted through the cell casing, and the fraction lost due to gases and effluents, NASA developed Fractional Thermal Runaway Calorimetry (FTRC). Two calorimeters have been developed and demonstrated, the Small-format- and Large-format Fractional Thermal Runaway Calorimeters (S-FTRC and L-FTRC, respectively). The technique has been successfully applied to small- and large-format cells (2.4-3.5 Ah and >100 Ah capacity, respectively) and has given new insights into Li-ion cell thermal runaway. Development of the calorimeters is discussed and results from the initial thermal runaway testing campaigns are presented.

Lithium-Ion Cell↗

NASA NTRS1986

Plasma turbulence and impulsive UV line emission in solar flares

Observations show that hard X-ray burst and UV lines rise and fall simultaneously on time scales of seconds. Hydrodynamic simulations of beam-heated atmospheres, based on collisional transport, however, produce only a gradual fall in UV emission, when the beam flux falls, due to the long time scale of conductive relaxation. It is suggested that this discrepancy might be explained by onset of plasma turbulence driven by the strong heat flux or by the beam return current going unstable. Such turbulence greatly reduces electrical and thermal conductivities. Fall in electrical conductivity reduces the hard X-ray flux by enhanced ohmic dissipation of the return current, while fall in thermal conductivity may cause the UV line to fall by reducing the transition region thickness.

Brown, John C.↗

DOE OSTI2023

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).

ADVANCED PROPULSION SYSTEMS↗

NASA NTRS2012

Nanoengineered Thermal Materials Based on Carbon Nanotube Array Composites

State-of-the-art integrated circuits (ICs) for microprocessors routinely dissipate power densities on the order of 50 W/cm2. This large power is due to the localized heating of ICs operating at high frequencies and must be managed for future high-frequency microelectronic applications. As the size of components and devices for ICs and other appliances becomes smaller, it becomes more difficult to provide heat dissipation and transport for such components and devices. A thermal conductor for a macro-sized thermal conductor is generally inadequate for use with a microsized component or device, in part due to scaling problems. A method has been developed for providing for thermal conduction using an array of carbon nanotubes (CNTs). An array of vertically oriented CNTs is grown on a substrate having high thermal conductivity, and interstitial regions between adjacent CNTs in the array are partly or wholly filled with a filler material having a high thermal conductivity so that at least one end of each CNT is exposed. The exposed end of each CNT is pressed against a surface of an object from which heat is to be removed. The CNT-filler-composite adjacent to the substrate provides improved mechanical strength to anchor CNTs in place, and also serves as a heat spreader to improve diffusion of heat flux from the smaller volume (CNTs) to a larger heat sink.

Li, Jun↗

DOE OSTI2020

Thermal boundary conductance between high thermal conductivity boron arsenide and silicon

Thermal boundary conductance (TBC) is important for heat dissipation in light-emitting diodes (LEDs). In this study, we predicted the TBC between the high thermal conductivity boron arsenide (BAs) and silicon (Si) by nonequilibrium molecular dynamics (MD) simulations. From the thermal conductivity accumulation function with respect to phonon frequency, the dominant phonon frequencies for heat conduction in BAs are extremely different from those in Si. However, our nonequilibrium MD simulations indicated that the TBC of the BAs/Si interface was still high compared to most other interfaces, even though there was a major frequency mismatch in the thermal conductivity accumulation function between BAs and Si. The primary reason for the high TBC is the overlap of phonon density of states between BAs and Si in the frequency range of 5–8 THz. The range of predicted TBC of the BAs/Si interface was between 200 and 300 MW/m2 K in the temperature range of 300–700 K, and the values of the TBC were not sensitive to the temperature. We also found that the TBCs in Si/BAs and Si/Ge interfaces were close to each other considering the simulation uncertainty. This work indicates BAs as an excellent material for heat dissipation across the interfaces.

Wei, Zhiyong (ORCID:000000018686451X)↗

DOE OSTI2022

A Comprehensive Numerical and Experimental Study for the Passive Thermal Management in Battery Modules and Packs

Cooling plates in battery packs of electric vehicles play critical roles in passive thermal management systems to reduce risks of catastrophic thermal runaway. In this work, a series of numerical simulations and experiments are carried out to unveil the role of cooling plates (both between cells and a bottom plate parallel to the cell stack) on the thermal behavior of battery modules and packs under nail penetrations. First, we investigated the role of side cooling plates on the thermal runaway propagation mitigation in battery modules (1S3P) and packs (3S3P) by varying the key parameters of the side cooling plates, such as plate thicknesses, thermal contact resistances, and materials. Then, three important factors for passive thermal management systems are identified: (i) thermal mass of side cooling plates, (ii) interfacial thermal contact resistances, and (iii) the effective heat transfer coefficients at exterior surfaces. The roles of bottom cooling plates on thermal runaway propagation mitigation in 1S3P and 1S5P battery modules are numerically investigated by comparing the thermal behavior of the modules with only side cooling plates and with both side and bottom cooling plates.

25 ENERGY STORAGE↗

NASA NTRS1981

Bypass diode integration

Protective bypass diodes and mounting configurations which are applicable for use with photovoltaic modules having power dissipation requirements in the 5 to 50 watt range were investigated. Using PN silicon and Schottky diode characterization data on packaged diodes and diode chips, typical diodes were selected as representative for each range of current carrying capacity, an appropriate heat dissipating mounting concept along with its environmental enclosure was defined, and a thermal analysis relating junction temperature as a function of power dissipation was performed. In addition, the heat dissipating mounting device dimensions were varied to determine the effect on junction temperature. The results of the analysis are presented as a set of curves indicating junction temperature as a function of power dissipation for each diode package.

Shepard, N. F., Jr.↗

DOE OSTI2022

Reactor fuel pellets with thermally-conductive inserts, and related reactor fuel pellet arrangements

Fuel pellets and fuel pellet arrangements include thermally-conductive inserts within a fuel. The inserts have at least one portion of a thermally-conductive material, such as radially-extending fins. The inserts are configured to dissipate heat during use of the fuel pellets, while minimizing the amount of the total volume of the fuel pellet that is occupied by non-fissile material. The inclusion of heat-dissipating inserts enables the fuel pellets to exhibit improved thermal performance over the lifetime of the fuel, including a relatively low peak temperature and relatively low integrated average temperatures, while the minimal volume of the inserts avoids significantly decreasing the percent of enrichment achievable.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

NASA NTRS1971

Thermal excursion can cause bond problems.

The purpose of this paper is to illustrate the failure mode caused by thermal deformation and how thermal deformation affects bond integrity. Wege bonding in small-signal transistors, microcircuits and LSI circuits is the subject of this work. Repeated switching of the devices between high and low power at a rate that allows thermal expansion and contraction in the interconnecting wire causes the wire to flex at the point of reduced cross-sectional area until finally the wire breaks due to metal fatigue. It was observed that the thermal deformation was related to many factors such as device power dissipation, current density in the wire, wi *e dress and length, thermal time constant and frequency of operation.

Nowakowski, M. F.↗

DOE OSTI2026

Direct Observation of Vortex Liquid Droplets in the Iron Pnictide Superconductor CaKFe 4 As 4 at 0.5T c

Type-II superconductors under magnetic fields remain in a quantum-coherent, non-dissipative state as long as vortices are pinned. Dissipation emerges when vortices depin, a process often driven by thermal fluctuations and commonly associated with a melting transition from a vortex solid to a vortex liquid. Macroscopic experiments almost always observe this transition close to the superconducting critical temperature 𝑇 𝑐 . However, how the vortex solid responds to thermal fluctuations at the scale of individual vortices, far below the melting transition, remains largely unexplored. Here, we use scanning tunneling microscopy (STM) to directly visualize vortices in the iron-based superconductor CaKFe 4 ⁢As 4 (𝑇 𝑐 ≈35 K ). We observe the formation of vortex liquid droplets—spatially localized regions where vortices exhibit strong thermal fluctuations—at temperatures as low as 0.5 𝑇 𝑐 . These results demonstrate that the onset of dissipation at the local scale occurs at temperatures significantly below 𝑇𝑐 in type-II superconductors, revealing a previously unrecognized regime of vortex dynamics.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

NASA NTRS2006

Are Ring Current Ions Lost in Electromagnetic Ion Cyclotron Wave Dispersion Relation?

Electromagnetic ion cyclotron (EMIC) waves are widely observed in the inner and outer magnetosphere, at geostationary orbit, at high latitudes along the plasmapause, and at the ionospheric altitudes. Interaction of the Ring Current (RC) ions and EMIC waves causes ion scattering into the loss cone and leads to decay of the RC, especially during the main phase of storms when the RC decay times of about one hour or less are observed. The oblique EMIC waves damp due to Landau resonance with the thermal plasmaspheric electrons, and subsequent transport of the dissipating wave energy into the ionosphere below causes an ionosphere temperature enhancement. Induced scattering of these waves by the plasmaspheric thermal ions leads to ion temperature enhancement, and forms a so-called hot zone near the plasmapause where the temperature of core plasma ions can reach tens of thousands of degrees. Relativistic electrons in the outer radiation belt also interact well with the EMIC waves, and during the main and/or recovery phases of the storms these electrons can easily be scattered into the loss cone over a time scale from several hours to a day. The plasma density distribution in the magnetosphere and the ion content play a critical role in EMIC wave generation and propagation, but the wave dispersion relation in the known RC-EMIC wave interaction models is assumed to be determined by the thermal plasma distribution only. In these models, the modification of the EMIC wave dispersion relation caused by the RC ions is not taken into account, and the RC ions are only treated as a source of free energy in order to generate EMIC waves. At the same time, the RC ions can dominate the thermal magnetospheric content in the night MLT sector at great L shells during the main and/or recovery storm phase. In this study, using our self-consistent RC-EMIC wave model [Khazanov et al., 2006], we simulate the May 1998 storm in order to quantify the global EMIC wave redistribution caused by taking into account the RC ions in the EMIC wave dispersion relation. The dramatic wave pattern redistribution is observed in the postdusk-predawn MLT sector (night sector) for L greater than 5. We found the intense EMIC waves (about a few nT) there during the main and early recovery phases of the storm. The observed wave generation in this sector is caused by taking into account the EMIC wave dispersion change due to the RC ions. There are no waves at these locations in our model if the RC ions are taken into account in the wave growth rate only, and the wave dispersion relation is only governed by the thermal plasmaspheric model.

Khazanov, G. V.↗

NASA NTRS2006

Effect of Ring Current Ions on Electromagnetic Ion Cyclotron Wave Dispersion Relation

Gamayunov, K. V.↗

DOE OSTI2020

Visualizing Energy Transfer at Buried Interfaces in Layered Materials Using Picosecond X-Rays

Understanding the fundamentals of nanoscale heat propagation is crucial for next-generation electronics. For instance, weak van der Waals bonds of layered materials are known to limit their thermal boundary conductance (TBC), presenting a heat dissipation bottleneck. In this paper we present a new non-destructive method to probe heat transport in nanoscale crystalline materials using time-resolved x-ray measurements of photo-induced thermal strain. This technique directly monitors time-dependent temperature changes in the crystal and the subsequent relaxation across buried interfaces by measuring changes in the c-axis lattice spacing after optical excitation. We investigate films of five different layered transition metal dichalcogenides MoX 2 [X= S, Se, Te] and WX 2 [X= S, Se] as well as graphite and a W-doped alloy of MoTe 2 , on c-plane sapphire substrates, finding TBC values in the range 10-30 MWm -2 K -1 at room temperature. In conjunction with molecular dynamics simulations, we show that the high thermal resistances are a consequence of weak interfacial van der Waals bonding and low phonon irradiance. This work paves the way for an improved understanding of thermal bottlenecks in emerging three-dimensional heterogeneously integrated technologies.

36 MATERIALS SCIENCE↗