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Results for “CIRCUIT RELIABILITY”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Characterizing Microfluidic Operations Underlying an Electrowetting Heat Pipe on the International Space Station

Electrowetting heat pipes (EHPs) are a newly conceptualized class of heat pipes, wherein the adiabatic wick section is replaced by electrowetting-based pumping of the condensate (as droplets) to the evaporator. Specific advantages include the ability to transport high heat loads over long distances, low thermal resistance and power consumption, and the absence of moving mechanical parts. In this work, we describe characterization of key microfluidic operations (droplet motion and splitting) underlying the EHP on the International Space Station (ISS). The testing was performed under the Advanced Passive Thermal eXperiment (APTx) project, a project to test a suite of passive thermal control devices funded by the ISS Technology Demonstration Office at NASA JSC (Johnson Space Center). A rapid manufacturing method was used to fabricate the electrowetting device on a printed circuit board. Key device-related considerations were to ensure reliability and package the experimental hardware within a confined space. Onboard the ISS, experiments were conducted to study electrowetting-based droplet motion and droplet splitting, by imaging droplet manipulation operations via pre-programmed electrical actuation sequences. An applied electric field of 36 Volts per micron resulted in droplet speeds approaching 10 millimeters per second. Droplet splitting dynamics were observed and the time required to split droplets was quantified. Droplet motion data was analyzed to estimate the contact line friction coefficient. Overall, this demonstration is the first-ever electrowetting experiment in space. The obtained results are useful for future design of the EHP and other electrowetting-based systems for microgravity applications.

Electrowetting↗
NASA NTRS1975

Hybrid measurement chains for the SAS-C spacecraft

Spacecraft electronic systems usually demand tight packaging. It was this consideration which initially forced us to consider hybrid circuits for the analog signal processing circuits in the Small Astronomy Satellite-C (SAS-C) scientific payload. We gradually discovered that increased reliability, low power consumption, and reduced program costs all followed. This paper will attempt to share our laboratory's first experience with hybrid circuits and indicate those areas which we found to be important.

Goeke, R. F.↗
NASA NTRS1991

Q-switched laser prelase detection circuit

A compact electronic circuit was developed to detect prelasing in Q-swithed pulsed laser systems and once detected to shut down the laser before the next laser pulse occurs. The circuit is small, compact, and uses a minimum of components which makes it quite economical, thus readily lending itself to commercial applications. It can easily be incorporated into virtually any Q-switched laser system or reliability of a laser system by reducing a source of possible costly optical damage. The circuit operation and instrument requirements necessary to incorporate the circuit into a laser system are discussed.

Lockard, George E.↗
NASA NTRS2016

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

Body of Knowledge (BOK)↗
NASA NTRS1971

Automatic transmission line monitor

Monitor improves complex network reliability in computer data links and command transmission lines. System evaluates circuit performance against preselected criteria, identifies and stores data indicating out-of-tolerance conditions, conducts closed loop testing, and provides for operation under command of digital computer that determines restoration priorities.

Parsons, W. E.↗
NASA NTRS1977

Microprocessor Seminar, phase 2

Workshop sessions and papers were devoted to various aspects of microprocessor and large scale integrated circuit technology. Presentations were made on advanced LSI developments for high reliability military and NASA applications. Microprocessor testing techniques were discussed, and test data were presented. High reliability procurement specifications were also discussed.

Scott, W. R.↗
NASA NTRS1983

Inherent overload protection for the series resonant converter

The overload characteristics of the full bridge series resonant power converter are considered. This includes analyses of the two most common control methods presently in use. The first of these uses a current zero crossing detector to synchronize the control signals and is referred to as the alpha controller. The second is driven by a voltage controlled oscillator and is referred to as the gamma controller. It is shown that the gamma controller has certain reliability advantages in that it can be designed with inherent short circuit protection. Experimental results are included for an 86 kHz converter using power metal-oxide-semiconductor field-effect transistors (MOSFETs).

King, R. J.↗
NASA NTRS1990

Simulation of the Australian Mobilesat signalling scheme

The proposed Australian Mobilesat system will provide a range of circuit switched voice/data services using the B-series satellites. The reliability of the signalling scheme between the Network Management Station (NMS) and the mobile terminal (MT) is of critical importance to the performance of the overall system. Simulation results of the performance of the signalling scheme under various channel conditions and coding schemes are presented.

Rahman, Mushfiqur↗
NASA NTRSDate not supplied

Advancing Metasurfaces Towards New Frontiers: Nonvolatile Reconfigurable Optics

The applications of adaptive optics extend across multiple sectors, encompassing areas such as LiDAR, biological and chemical sensing, and free-space communications. In this study, we report on the design, fabrication, testing, and modeling of electrically reconfigurable metasurfaces using a low-loss high contrast phase change material, Ge2Sb2Se4Te integrated with an IR-transparent silicon microheater. Through this work, we introduce a reliable architecture for switching PCM-based metasurfaces within an integrated circuit configuration which is compatible with standard foundry fabrication processes. We demonstrate the capability of controlling the transmission of electromagnetic waves through the precise stimulation of PCM-based pixels, each spanning a few hundred microns, over numerous cycles. By leveraging PCM-based pixels, we unlock the potential to create metasurfaces encompassing a diverse range of functionalities such as dielectric filters, metalens, or beam steering devices, which is governed by the design of the meta-atoms. Further, we perform an in-depth investigation into the failure mechanism utilizing techniques such as Fourier transform IR spectroscopy (FTIR), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and thermal modeling. According to our results, due to a sharp temperature rise at the PCM/heater interface, we observe severe delamination of the PCM from the heater. More uniform PCM deposition, better adhesion at the PCM/heater interface, and a more uniform temperature distribution in the device could potentially mitigate the failure and lead to a longer life-time. By addressing these challenges, we aim to unlock the full potential of PCM-based devices and advance the field of adaptive optics.

Phase change material↗
NASA NTRS1989

Product assurance technology for procuring reliable, radiation-hard, custom LSI/VLSI electronics

Advanced measurement methods using microelectronic test chips are described. These chips are intended to be used in acquiring the data needed to qualify Application Specific Integrated Circuits (ASIC's) for space use. Efforts were focused on developing the technology for obtaining custom IC's from CMOS/bulk silicon foundries. A series of test chips were developed: a parametric test strip, a fault chip, a set of reliability chips, and the CRRES (Combined Release and Radiation Effects Satellite) chip, a test circuit for monitoring space radiation effects. The technical accomplishments of the effort include: (1) development of a fault chip that contains a set of test structures used to evaluate the density of various process-induced defects; (2) development of new test structures and testing techniques for measuring gate-oxide capacitance, gate-overlap capacitance, and propagation delay; (3) development of a set of reliability chips that are used to evaluate failure mechanisms in CMOS/bulk: interconnect and contact electromigration and time-dependent dielectric breakdown; (4) development of MOSFET parameter extraction procedures for evaluating subthreshold characteristics; (5) evaluation of test chips and test strips on the second CRRES wafer run; (6) two dedicated fabrication runs for the CRRES chip flight parts; and (7) publication of two papers: one on the split-cross bridge resistor and another on asymmetrical SRAM (static random access memory) cells for single-event upset analysis.

Buehler, M. G.↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
NASA NTRS2003

Electronic Components and Circuits for Extreme Temperature Environments

Planetary exploration missions and deep space probes require electrical power management and control systems that are capable of efficient and reliable operation in very low temperature environments. Presently, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. Electronics capable of operation at cryogenic temperatures will not only tolerate the hostile environment of deep space but also reduce system size and weight by eliminating or reducing the radioisotope heating units and their associate structures; thereby reducing system development as well as launch costs. In addition, power electronic circuits designed for operation at low temperatures are expected to result in more efficient systems than those at room temperature. This improvement results from better behavior and tolerance in the electrical and thermal properties of semiconductor and dielectric materials at low temperatures. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical components, circuits, and systems suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices and systems for reliable use down to cryogenic temperatures. Some of the commercial-off-the-shelf as well as developed components that are being characterized include switching devices, resistors, magnetics, and capacitors. Semiconductor devices and integrated circuits including digital-to-analog and analog-to-digital converters, DC/DC converters, operational amplifiers, and oscillators are also being investigated for potential use in low temperature applications. An overview of the NASA Glenn Research Center Low Temperature Electronic Program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained through in-house component and circuit testing will also be discussed. Ongoing research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, Richard L.↗
NASA NTRS1975

HOME - An application of fault-tolerant techniques and system self-testing

Hard Over Monitoring Equipment (HOME) has been designed to complement and enhance the flight safety of a flight research helicopter. HOME is an independent, highly reliable, and fail-safe special purpose computer that monitors the flight control commands issued by the flight control computer of the helicopter. In particular, HOME detects the issuance of a hazardous hard-over command for any of the four flight control axes and transfers the control of the helicopter to the flight safety pilot. The design of HOME incorporates certain reliability and fail-safe enhancement design features, such as triple modular redundancy, majority logic voting, fail-safe dual circuits, independent status monitors, in-flight self-test, and a built-in preflight exerciser. The HOME design and operation is described with special emphasis on the reliability and fail-safe aspects of the design.

Holden, D. G.↗
NASA NTRS1980

Stitch-bond parallel-gap welding for IC circuits

Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.

Chvostal, P.↗
NASA NTRS2018

FPGA Reliability and Failure Rate Analysis for Launch and Space Vehicles Environments

Field Programmable Gate Arrays (FPGAs) integrated circuits (IC) are one of the key electronic components in today's sophisticated launch and space vehicle complex avionic systems, largely due to their superb reprogrammable and reconfigurable capabilities combined with relatively low non-recurring engineering costs (NRE) and short design cycle. Consequently, FPGAs are prevalent ICs in communication protocols and control signal commands. This paper will demonstrate guidelines to estimate FPGA failure rates for ascent and in space operations. The guidelines will account for hardware and radiation-induced failures, as well as Bayesian updates to failure rates. The hardware contribution of the approach accounts for physical failures of the FPGA IC. The radiation portion will expand on FPGA susceptibility to different space radiation environments.

Al Hassan, Mohammad↗
NASA NTRS1979

Fault-tolerant computer system

More reliable computers could be assembled by connecting four proposed VSLI "building block" circuits with built-in error detection to standard microprocessors and memory devices to form self checking computer module. Each building block detects its own malfunctions and single bit errors found in memory.

Avizienis, A. A.↗