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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS1996

ACTS Aeronautical Terminal Experiment System Description and Link Analysis

During the summer of 1994, the performance of an experimental mobile satellite communication system was demonstrated to industry and government representatives by the NASA Lewis Research Center (LeRC) and the Jet Propulsion Laboratory (JPL). The system was based on the advanced communications technology satellite (ACTS) and consisted of a K-/Ka-band active monolithic microwave integrated circuit (MMIC) phased array antenna system, ACTS mobile terminal (AMT) and link evaluation terminal (LET). A LeRC research aircraft, Learjet model 25, was outfitted with the active MMIC phased array antenna system and AMT and served as the experimental 20/30 Ghz aeronautical terminal. The LET at LeRC in Cleveland, OH, was interfaced with portions of fixed-AMT equipment and together provided the gateway station functions including ACTS interface and public service telephone network (PSTN) interface. The ACTS was operated in its microwave switch matrix (MSM) mode with a spot beam for the Learjet and another spot beam dedicated to the LET. The Learjet was flown over several major cities across the US and demonstrated the feasibility of a full-duplex compressed voice links for an aeronautical terminal through the 20/30 Ghz ACTS channel. This paper presents a technical description of the system including the MMIC phased array antenna system, AMT, Learjet, LET, and ACTS. The array antenna system consists of a 30 Ghz transmit array (LeRc/Texas Instruments) and two 20 Ghz receive arrays (USAF Rome Lab., Boeing, and Martin Marietta), each one very small with sufficient performance for a satellite voice link. The AMT consists of 2.4/4.8/9.6 Kbps voice coder/decoder, modem, PSTN interface and RF/IF converters. Link analysis is presented and compared to the actual performance data collected during the demonstration flights.

Sohn, Philip↗
NASA NTRS1995

Novel Techniques for Millimeter-Wave Packages

A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wide-band RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.

Herman, Martin I.↗
NASA NTRS2000

High-Q X-Band and K-Band Micromachined Spiral Inductors for Use in Si-Based ICs

A micromachined structure with reduced parasitics is proposed to enhance the resonant frequency and the quality factor (Q) of a spiral inductor. Inductors with various etch depths have been fabricated on a high resistivity Si substrate. Two-port S-parameters measurement is taken to characterize the performance of the inductors. With an etch depth of 20 micron, a fabricated 1.8 nH spiral inductor achieves a maximum resonant frequency of 25.6 GHz and a maximum Q of 20.2 at 14.5 GHz. This technology is compatible with SiGe/Si HBT technology, and the spiral inductors are especially suitable for Si-based monolithic microwave integrated circuit (MMIC) applications.

Lu, Liang-Hung↗
NASA NTRS2001

Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented.

Ponchak, George E.↗
NASA NTRS2001

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗
NASA NTRS2001

Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on complementary metal oxide semiconductor (CMOS) (low resistivity) Si wafers. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements are used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions.

Ponchak, George E.↗
NASA NTRS2002

Coupling Between CPW and Slotline Modes in Finite Ground CPW with Unequal Ground Plane Widths

The coupling between the desired CPW mode and the unwanted, slotline, mode is presented for finite ground coplanar waveguides with unequal ground plane widths. Measurements, quasi-static conformal mapping, and Method of Moment analysis are performed to determine the dependence of the slotline mode excitation on the physical dimensions of the FGC line and on the frequency range of operation. Introduction: Finite ground coplanar waveguide (FGC) is often used in low cost Monolithic Microwave Integrated Circuits (MMICs) because of its many advantages over microstrip and conventional CoPlanar Waveguide (CPW). It is uniplanar, which facilitates easy connection of series and shunt elements without via holes, supports a low loss, quasi-TEM mode over a wide frequency band, and since the ground planes are electrically and physically narrow, typically less than lambda/5 wide where lambda is the guided wavelength, they reduce the circuit size and the influence of higher order modes. However, they still support the parasitic slotline mode that plagues all CPW transmission lines.

Ponchak, George E.↗
NASA NTRS2002

Experimental Analysis of Reduced-Sized Coplanar Waveguide Transmission Lines

An experimental investigation of the use of capacitive loading of coplanar waveguides to reduce their line length and, thus the size, of monolithic microwave integrated circuits is presented. The reduced sized coplanar waveguides are compared to unloaded transmission lines and to lumped element transmission line segments. The phase bandwidth, defined by 2 percent error in S(sub 21), and the return loss bandwidth, defined by a return loss greater than 15 dB, of coplanar waveguides reduced from 0 to 90 percent are compared, and the insertion loss as a function of the size reduction is presented.

Ponchak, George E.↗
NASA NTRS1995

ACTS Aeronautical Terminal Experiment (AERO-X)

During the summer of 1994, the performance of an experimental mobile satellite communication system was demonstrated. Using the Advanced Communications Technology Satellite (ACTS) and the ACTS Mobile Terminal (AMT), the system demonstrated an active Monolithic Microwave Integrated Circuit (MMIC) phased-array antenna system. The antenna system was installed onboard one of NASA Lewis Research Center's research aircraft, a Learjet Model 25. It proved the viability of in-flight satellite communications services via small, flush, mountable electronic phased-array antennas. The overall system setup for the ACTS Aeronautical Terminal Experiment (AERO-X) is illustrated. The Link Evaluation Terminal (LET) at Lewis in Cleveland, Ohio, interfaced with fixed-AMT equipment, providing a seamless connection with the Public Service Telephone Network. As the Learjet was flown over several major cities across the U.S., this demonstration system allowed passengers onboard to make telephone calls as if they were using a cellular system. ACTS was operated in its microwave switch matrix mode with a spot beam for the Learjet and another spot beam dedicated to the LET.

Source record↗
NASA NTRS1996

Highly Efficient Amplifier for Ka-Band Communications

An amplifier developed under a Small Business Innovation Research (SBIR) contract will have applications for both satellite and terrestrial communications. This power amplifier uses an innovative series bias arrangement of active devices to achieve over 40-percent efficiency at Ka-band frequencies with an output power of 0.66 W. The amplifier is fabricated on a 2.0- by 3.8-square millimeter chip through the use of Monolithic Microwave Integrated Circuit (MMIC) technology, and it uses state-of-the-art, Pseudomorphic High-Electron-Mobility Transistor (PHEMT) devices. Although the performance of the MMIC chip depends on these high-performance devices, the real innovations here are a unique series bias scheme, which results in a high-voltage chip supply, and careful design of the on-chip planar output stage combiner. This design concept has ramifications beyond the chip itself because it opens up the possibility of operation directly from a satellite power bus (usually 28 V) without a dc-dc converter. This will dramatically increase the overall system efficiency. Conventional microwave power amplifier designs utilize many devices all connected in parallel from the bias supply. This results in a low-bias voltage, typically 5 V, and a high bias current. With this configuration, substantial I(sup 2) R losses (current squared times resistance) may arise in the system bias-distribution network. By placing the devices in a series bias configuration, the total current is reduced, leading to reduced distribution losses. Careful design of the on-chip planar output stage power combiner is also important in minimizing losses. Using these concepts, a two-stage amplifier was designed for operation at 33 GHz and fabricated in a standard MMIC foundry process with 0.20-m PHEMT devices. Using a 20-V bias supply, the amplifier achieved efficiencies of over 40 percent with an output power of 0.66 W and a 16-dB gain over a 2-GHz bandwidth centered at 33 GHz. With a 28-V bias, a power level of 1.1 W was achieved with a 12-dB gain and a 36-percent efficiency. This represents the best reported combination of power and efficiency at this frequency. In addition to delivering excellent power and gain, this Ka-band MMIC power amplifier has an efficiency that is 10 percent greater than existing designs. The unique design offers an excellent match for spacecraft applications since the amplifier supply voltage is closely matched to the typical value of spacecraft bus voltage. These amplifiers may be used alone in applications of 1 W or less, or several may be combined or used in an array to produce moderate power, Ka-band transmitters with minimal power combining and less thermal stress owing to the combination of excellent efficiency and power output. The higher voltage operation of this design may also save mass and power because the dc-dc power converter is replaced with a simpler voltage regulator.

Source record↗
NASA NTRS2005

RF MEMS Phase Shifters and their Application in Phase Array Antennas

Electronically scanned arrays are required for space based radars that are capable of tracking multiple robots, rovers, or other assets simultaneously and for beam-hopping communication systems between the various assets. ^Traditionally, these phased array antennas used GaAs Monolithic Microwave Integrated Circuit (MMIC) phase shifters, power amplifiers, and low noise amplifiers to amplify and steer the beam, but the development of RF MEMS switches over the past ten years has enabled system designers to consider replacing the GaAs MMIC phase shifters with RF Micro-Electro Mechanical System (MEMS) phase shifters. In this paper, the implication of replacing the relatively high loss GaAs MMICs with low loss MEMS phase shifters is investigated.

Scardelletti, Maximilian↗
NASA NTRS1999

K-Band Phased Array Developed for Low- Earth-Orbit Satellite Communications

Future rapid deployment of low- and medium-Earth-orbit satellite constellations that will offer various narrow- to wide-band wireless communications services will require phased-array antennas that feature wide-angle and superagile electronic steering of one or more antenna beams. Antennas, which employ monolithic microwave integrated circuits (MMIC), are perfectly suited for this application. Under a cooperative agreement, an MMIC-based, K-band phased-array antenna is being developed with 50/50 cost sharing by the NASA Lewis Research Center and Raytheon Systems Company. The transmitting array, which will operate at 19 gigahertz (GHz), is a state-of-the-art design that features dual, independent, electronically steerable beam operation ( 42 ), a stand-alone thermal management, and a high-density tile architecture. This array can transmit 622 megabits per second (Mbps) in each beam from Earth orbit to small Earth terminals. The weight of the total array package is expected to be less than 8 lb. The tile integration technology (flip chip MMIC tile) chosen for this project represents a major advancement in phased-array engineering and holds much promise for reducing manufacturing costs.

Anzic, Godfrey↗
NASA NTRS2000

Low-Cost Tracking Ground Terminal Designed to Use Cryogenically Cooled Electronics

A computer-controlled, tracking ground terminal will be assembled at the NASA Glenn Research Center at Lewis Field to receive signals transmitted by the Glenn's Direct Data Distribution (D3) payload planned for a shuttle flight in low Earth orbit. The terminal will enable direct data reception of up to two 622-megabits-per-second (Mbps) beams from the space-based, K-band (19.05-GHz) transmitting array at an end-user bit error rate of up to 10(exp -12). The ground terminal will include a 0.9-m-diameter receive-only Cassegrain reflector antenna with a corrugated feed horn incorporating a dual circularly polarized, K-band feed assembly mounted on a multiaxis, gimbaled tracking pedestal as well as electronics to receive the downlink signals. The tracking system will acquire and automatically track the shuttle through the sky for all elevations greater than 20 above the horizon. The receiving electronics for the ground terminal consist of a six-pole microstrip bandpass filter, a three-stage monolithic microwave integrated circuit (MMIC) amplifier, and a Stirling cycle cryocooler (1 W at 80 K). The Sterling cycle cryocooler cools the front end of the receiver, also known as the low-noise amplifier (LNA), to about 77 K. Cryocooling the LNA significantly increases receiver performance, which is necessary so that it can use the antenna, which has an aperture of only 0.9 m. The following drawing illustrates the cryoterminal.

Wald, Lawrence W.↗
NASA NTRS2001

Status of the Direct Data Distribution (D(exp 3)) Experiment

NASA Glenn Research Center's Direct Data Distribution (D3) project will demonstrate an advanced, high-performance communications system that transmits information from an advanced technology payload carried by a NASA spacecraft in low Earth orbit (LEO) to a small receiving terminal on Earth. The space-based communications package will utilize a solid-state, K-band phased-array antenna that electronically steers the radiated energy beam toward a low-cost, tracking ground terminal, thereby providing agile, vibration-free, electronic steering at reduced size and weight with increased reliability. The array-based link will also demonstrate new digital processing technology that will allow the transmission of substantially increased amounts of latency-tolerant data collected from the LEO spacecraft directly to NASA field centers, principal investigators, or into the commercial terrestrial communications network. The technologies demonstrated by D3 will facilitate NASA's transition from using Government-owned communication assets to using commercial communication services. The hardware for D3 will incorporate advanced technology components developed under the High Rate Data Delivery (HRDD) Thrust Area of NASA's Office of Aerospace Technology Space Base Program at Glenn's Communications Technology Division. The flight segment components will include the electrically steerable phased-array antenna, which is being built by the Raytheon System Corporation and utilizes monolithic microwave integrated circuit (MMIC) technology operating at 19.05 GHz; and the digital encoder/modulator chipset, which uses four-channel orthogonal frequency division multiplexing (OFDM). The encoder/modulator will use a chipset developed by SICOM, Inc., which is both bandwidth and power efficient. The ground segment components will include a low-cost, open-loop tracking ground terminal incorporating a cryoreceiver to minimize terminal size without compromising receiver capability. The project is planning to hold a critical design review in the second quarter of fiscal year 2002.

Wald, Lawrence↗
NASA NTRS2003

Laser-Ablated Ba(0.50)Sr(0.50)TiO3/LaAlO3 Films Analyzed Statistically for Microwave Applications

Scanning phased-array antennas represent a highly desirable solution for futuristic near-Earth and deep space communication scenarios requiring vibration-free, rapid beam steering and enhanced reliability. The current state-of-practice in scanning phased arrays is represented by gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) technology or ferrite phase shifters. Cost and weight are significant impediments to space applications. Moreover, conventional manifold-fed arrays suffer from beam-forming loss that places considerable burden on MMIC amplifiers. The inefficiency can result in severe thermal management problems.

Romanofsky, Robert R.↗
NASA NTRS2005

Ka-Band Wide-Bandgap Solid-State Power Amplifier: Hardware Validation

Motivated by recent advances in wide-bandgap (WBG) gallium nitride (GaN) semiconductor technology, there is considerable interest in developing efficient solid-state power amplifiers (SSPAs) as an alternative to the traveling-wave tube amplifier (TWTA) for space applications. This article documents proof-of-concept hardware used to validate power-combining technologies that may enable a 120-W, 40 percent power-added efficiency (PAE) SSPA. Results in previous articles [1-3] indicate that architectures based on at least three power combiner designs are likely to enable the target SSPA. Previous architecture performance analyses and estimates indicate that the proposed architectures can power combine 16 to 32 individual monolithic microwave integrated circuits (MMICs) with >80 percent combining efficiency. This combining efficiency would correspond to MMIC requirements of 5- to 10-W output power and >48 percent PAE. In order to validate the performance estimates of the three proposed architectures, measurements of proof-of-concept hardware are reported here.

Epp, L.↗
NASA NTRS2005

A Ka-Band Wide-Bandgap Solid-State Power Amplifier: Architecture Performance Estimates

Motivated by recent advances in wide-bandgap (WBG) gallium nitride (GaN) semiconductor technology, there is considerable interest in developing efficient solidstate power amplifiers (SSPAs) as an alternative to the traveling-wave tube amplifier (TWTA) for space applications. This article documents the results of a study to investigate power-combining technology and SSPA architectures that can enable a 120-W, 40 percent power-added efficiency (PAE) SSPA. Results of the study indicate that architectures based on at least three power combiner designs are likely to enable the target SSPA. The proposed architectures can power combine 16 to 32 individual monolithic microwave integrated circuits (MMICs) with >80 percent combining efficiency. This corresponds to MMIC requirements of 5- to 10-W output power and >48 percent PAE. For the three proposed architectures [1], detailed analysis and design of the power combiner are presented. The first architecture studied is based on a 16-way septum combiner that offers low loss and high isolation over the design band of 31 to 36 GHz. Analysis of a 2-way prototype septum combiner had an input match >25 dB, output match >30 dB, insertion loss <0.02 dB, and isolation >30 dB over the design band. A 16-way design, based on cascading this combiner in a binary fashion, is documented. The second architecture is based on a 24-way waveguide radial combiner. A prototype 24-way radial base was analyzed to have an input match >30 dB (under equal excitation of all input ports). The match of the mode transducer that forms the output of a radial combiner was found to be >27 dB. The functional bandwidth of the radial base and mode transducer, which together will form a radial combiner/divider, exceeded the design band. The third architecture employs a 32-way, parallel-plate radial combiner. Simulation results indicated an input match >24 dB, output match >22 dB, insertion loss <0.23 dB, and adjacent port isolation >20 dB over the design band. All three architectures utilize a low-loss MMIC amplifier module based on commercial MMIC packaging and a custom microstrip-to-rectangular-waveguide transition. The insertion loss of the module is expected to be 0.45 dB over the design band.

Epp, L.↗