Search NASA⌕ Search

SEARCH · Search NASA

Results for “system (MEMS)”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS2005

A Unifying Multibody Dynamics Algorithm Development Workbench

The development of new and efficient algorithms for multibody dynamics has been an important research area. These algorithms are used for modeling, simulation, and control of systems such as spacecraft, robotic systems, automotive applications, the human body, manufacturing operations, and micro-electromechanical systems (MEMS). At JPL's Dynamics and Real Time Simulation (DARTS) Laboratory we have developed software that serves as a computational workbench for these algorithms. This software utilizes the mathematical perspective of the spatial operator algebra, which allows the development of dynamics algorithms and new insights into multibody dynamics.

Ziegler, John L.↗
NASA NTRS2006

Reducing Stray Light To Characterize Nirspec Subsystems: The Focal Plane Array And Micro-Shutter Array

The James Webb Space Telescope (JWST) is an infrared, space-based telescope scheduled for launch in 2013. JWST includes four scientific instruments, including the Near Infrared Spectrometer (NIRSpec), which operates in the wavelength range from 0.6 to 5 microns. NASA/Goddard Space Flight Center (GSFC) is responsible for two NIRSpec subsystems: the detector subsystem, with its focal plane array (FPA), and the micro-shutter subsystem, with its micro-shutter array (MSA). The FPA is comprised of two side-by-side Rockwell Scientific HgCdTe 2kx2k detectors, with detectors and readout electronics optimized for low noise. The MSA is a GSFC developed micro-electro-mechanical system (MEMS) that serves as a programmable slit mask, allowing NIRSpec to obtain simultaneous spectra of >100 objects in a single field of view. We present the optical characterization test plan of the FPA. The test plan is driven by many requirements: cryogenic operating temperature, a flight-like beam shape, and multi-wavelength photon flux from 1 to 60,000 per second, thus low stray light is critical. We use commercial optical modeling software to predict stray light effects at the FPA. We also present the optical contrast test plan of the MSA. Since each individual shutter element operates in on/off fashion, the most important optical metric is contrast. The MSA structure is designed to minimize stray and scattered light, and the test setup reduces stray light such that the optical contrast requirement is met.

Connelly, Joseph A.↗
NASA NTRS2006

Phase Calibration of Microphones by Measurement in the Free-field

Over the past several years, significant effort has been expended at NASA Langley developing new Micro-Electro-Mechanical System (MEMS)-based microphone directional array instrumentation for high-frequency aeroacoustic measurements in wind tunnels. This new type of array construction solves two challenges which have limited the widespread use of large channel-count arrays, namely by providing a lower cost-per-channel and a simpler method for mounting microphones in wind tunnels and in field-deployable arrays. The current generation of array instrumentation is capable of extracting accurate noise source location and directivity on a variety of airframe components using sophisticated data reduction algorithms [1-2]. Commercially-available MEMS microphones are condenser-type devices and have some desirable characteristics when compared with conventional condenser-type microphones. The most important advantages of MEMS microphones are their size, price, and power consumption. However, the commercially-available units suffer from certain important shortcomings. Based on experiments with array prototypes, it was found that both the bandwidth and the sound pressure limit of the microphones should be increased significantly to improve the performance and flexibility of the microphone array [3]. It was also desired to modify the packaging to eliminate unwanted Helmholtz resonance s exhibited by the commercial devices. Thus, new requirements were defined as follows: Frequency response: 100 Hz to 100 KHz (+/-3dB) Upper sound pressure limit: Design 1: 130 dB SPL (THD less than 5%) Design 2: 150-160 dB SPL (THD less than 5%) Packaging: 3.73 x 6.13 x 1.3 mm can with laser-etched lid. In collaboration with Novusonic Acoustic Innovation, NASA modified a Knowles SiSonic MEMS design to meet these new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size [4]. Hence a substitution based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. The free-field sensitivity (voltage per unit sound pressure) was obtained using the procedure outlined in reference 4. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone. The free-field calibration procedure along with representative sensitivity and phase responses for the new high-frequency MEMS microphones are presented here.

Shams, Qamar A.↗
NASA NTRS2007

Review of Polyimides Used in the Manufacturing of Micro Systems

Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.

Wilson, William C.↗
NASA NTRS2007

Array Phase Shifters: Theory and Technology

While there are a myriad of applications for microwave phase shifters in instrumentation and metrology, power combining, amplifier linearization, and so on, the most prevalent use is in scanning phased-array antennas. And while this market continues to be dominated by military radar and tracking platforms, many commercial applications have emerged in the past decade or so. These new and potential applications span low-Earth-orbit (LEO) communications satellite constellations and collision warning radar, an aspect of the Intelligent Vehicle Highway System or Automated Highway System. In any case, the phase shifters represent a considerable portion of the overall antenna cost, with some estimates approaching 40 percent for receive arrays. Ferrite phase shifters continue to be the workhorse in military-phased arrays, and while there have been advances in thin film ferrite devices, the review of this device technology in the previous edition of this book is still highly relevant. This chapter will focus on three types of phase shifters that have matured in the past decade: GaAs MESFET monolithic microwave integrated circuit (MMIC), micro-electromechanical systems (MEMS), and thin film ferroelectric-based devices. A brief review of some novel devices including thin film ferrite phase shifters and superconducting switches for phase shifter applications will be provided. Finally, the effects of modulo 2 phase shift limitations, phase errors, and transient response on bit error rate degradation will be considered.

Romanofsky, Robert R.↗
NASA NTRS2004

Silicon micromachined broad band light source

A micro electromechanical system (MEMS) broad band incandescent light source includes three layers: a top transmission window layer; a middle filament mount layer; and a bottom reflector layer. A tungsten filament with a spiral geometry is positioned over a hole in the middle layer. A portion of the broad band light from the heated filament is reflective off the bottom layer. Light from the filament and the reflected light of the filament are transmitted through the transmission window. The light source may operate at temperatures of 2500 K or above. The light source may be incorporated into an on board calibrator (OBC) for a spectrometer.

George, Thomas↗
NASA NTRS2003

Radio frequency telemetry system for sensors and actuators

The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote powering/receiving device. Such technology has many applications, but is especially useful in the biomedical area.

Simons, Rainee N.↗
NASA NTRS2006

Holographic memory using beam steering

A method, apparatus, and system provide the ability for storing holograms at high speed. A single laser diode emits a collimated laser beam to both write to and read from a photorefractice crystal. One or more liquid crystal beam steering spatial light modulators (BSSLMs) or Micro-Electro-Mechanical Systems (MEMS) mirrors steer a reference beam, split from the collimated laser beam, at high speed to the photorefractive crystal.

Chao, Tien-Hsin↗
NASA NTRS2007

Multiple internal seal right micro-electro-mechanical system vacuum package

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Hayworth, Ken J.↗
NASA NTRS2006

Free-field Calibration of the Pressure Sensitivity of Microphones at Frequencies up to 80 kHz

A free-field (FF) substitution method for calibrating the pressure sensitivity of microphones at frequencies up to 80 kHz is demonstrated with both grazing and normal incidence geometries. The substitution-based method, as opposed to a simultaneous method, avoids problems associated with the non-uniformity of the sound field and, as applied here, uses a 1/2 -inch air-condenser pressure microphone as a known reference. Best results were obtained with a centrifugal fan, which is used as a random, broadband sound source. A broadband source minimizes reflection-related interferences that often plague FF measurements. Calibrations were performed on 1/4-inch FF air-condenser, electret, and micro-electromechanical systems (MEMS) microphones in an anechoic chamber. The accuracy of this FF method is estimated by comparing the pressure sensitivity of an air-condenser microphone, as derived from the FF measurement, with that of an electrostatic actuator calibration and is typically 0.3 dB (95% confidence), over the range 2-80 kHz.

Herring, G. C.↗
NASA NTRS2008

Multiple internal seal ring micro-electro-mechanical system vacuum packaging method

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Hayworth, Ken J.↗
NASA NTRS2008

Novel Carbon Dioxide Microsensor Based on Tin Oxide Nanomaterial Doped With Copper Oxide

Carbon dioxide (CO2) is one of the major indicators of fire and therefore its measurement is very important for low-false-alarm fire detection and emissions monitoring. However, only a limited number of CO2 sensing materials exist due to the high chemical stability of CO2. In this work, a novel CO2 microsensor based on nanocrystalline tin oxide (SnO2) doped with copper oxide (CuO) has been successfully demonstrated. The CuO-SnO2 based CO2 microsensors are fabricated by means of microelectromechanical systems (MEMS) technology and sol-gel nanomaterial-synthesis processes. At a doping level of CuO: SnO2 = 1:8 (molar ratio), the resistance of the sensor has a linear response to CO2 concentrations for the range of 1 to 4 percent CO2 in air at 450 C. This approach has demonstrated the use of SnO2, typically used for the detection of reducing gases, in the detection of an oxidizing gas.

Xu, Jennifer C.↗
NASA NTRS2008

MEMS/ECD Method for Making Bi(2-x)Sb(x)Te3 Thermoelectric Devices

A method of fabricating Bi(2-x)Sb(x)Te3-based thermoelectric microdevices involves a combination of (1) techniques used previously in the fabrication of integrated circuits and of microelectromechanical systems (MEMS) and (2) a relatively inexpensive MEMS-oriented electrochemical-deposition (ECD) technique. The present method overcomes the limitations of prior MEMS fabrication techniques and makes it possible to satisfy requirements.

Lim, James↗
NASA NTRS2009

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

Jhabvala, Murzy↗
NASA NTRS2007

Microstrip Antenna Arrays on Multilayer LCP Substrates

A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.

Thompson, Dane↗