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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2026

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

xEMU↗
NASA NTRSDate not supplied

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

thermal analysis↗
NASA NTRSDate not supplied

Power and Propulsion Element Steerable High Gain Antenna Lunar Transit Thermal Analysis Tracking Methodology

The Power and Propulsion Element (PPE) is an ion thruster propulsion spacecraft developed as an element of Space Reactor (SR-1) Freedom to provide propulsion, communications and power for the spacecraft. PPE was originally being developed for the use with the lunar orbiting space station Gateway as one of the first two planned elements. PPE was to be launched with the Habitation and Logistics Outpost (HALO) element in a configuration called the Co-Manifested Vehicle (CMV) that would arrive at a Near-Rectilinear Halo Orbit (NRHO) around the Moon via a lunar transit spiral trajectory phase. The PPE communication system is equipped with two Steerable High Gain Antennas (SHGA) each steered by a two-axis gimbal (TAG) mechanism. A thermal analysis was conducted during the near-Earth spiral phase of the mission using Thermal Desktop (TD). This analysis utilized multiple axis Earth tracking articulators in combination with SINDA system internal environmental heating symbols to produce accurate Earth ground station tracking communication system temperatures. This presentation provides an overview of the communication system thermal model and the analysis methodology.

Thermal Analysis↗
NASA NTRSDate not supplied

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics↗
NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness↗
NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography↗
DOE OSTI2024

Method and apparatus for providing thermal wear leveling

Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

Roberts, David A.↗
NASA NTRS1992

Thermal expansion behavior of LDEF metal matrix composites

The effects of the space environment on the thermal expansion stability of metal matrix composites (graphite/Al and graphite/Mg) will be presented. A sample from each category of metal matrix composites mounted on the leading and trailing edge was chosen for analysis of the temperature-time-thermal strain histories. Typical thermal expansion curves over the same range of temperature were selected at the beginning, mid, and end of the recording duration. The thermal expansion of selected post-flight LDEF samples were measured over the same range of temperature in the laboratory using a Michelson laser interferometer. The thermal strains were monitored concurrently with a laser interferometer and a mounted strain gage.

T. D. Le↗
NASA NTRS1975

Chapter 3: Thermal Exchanges and Temperature Stress

Thermal comfort during space flight is discussed. Heat production of man during space flight and wear loss as a mean of dissipating heat are described. Water cooled garments are also considered, along with tolerance for extreme heat and body heat storage. Models of human temperature regulation are presented in the form of documented FORTRAN programs.

Paul Webb↗
NASA NTRSDate not supplied

Thermal Analysis on Large Format Lithium-Ion Batteries in Thermal Runaway

Lithium-ion (Li-ion) batteries can deliver electrical power across a large range of applications, and large format versions of these batteries are common in aerospace for their low mass and energy dense properties. Li-ion cells usage has increased as they are more power dense than fuel cells and have overall higher performance over lead-acid/NiCd batteries. However, Li-ion cells can experience Thermal Runaway (TR) via electro-chemical, mechanical, or thermal abuse. TR is a phenomenon where the stored energy in a cell is rapidly released along with vented gases and other effluents. A cell is generally determined to be in TR if its internal heat generation has surpassed its ability to dissipate that heat. If a Li-ion cell enters TR, propagation within the battery may occur. Propagation is the chain reaction that can occur to nearby cells due to a cell that has entered TR initially. Understanding a battery’s susceptiveness to propagation is necessary to evaluate risks associated with TR phenomenon. To determine if a battery is designed in a sufficient manner to prevent battery propagation if single cell TR occurs, testing and thermal analysis of the battery must be conducted. The presentation for TFAWS 2026 will cover considerations for battery TR thermal analysis, such as: testing methods, influences on the cells, failure mechanisms, and TR parameters. This presentation will include a walkthrough of an example battery TR thermal analysis, and the results thereof.

Lithium Ion Batteries↗
DOE OSTI2026

Mechanistic origin of solvent-dependent thermal stability in sodiated Sn anodes for sodium-ion batteries

Understanding the thermal stability of high-energy density alloy anodes is critical for the safe deployment of sodium-ion batteries (SIBs). Here, accelerating rate calorimetry (ARC), post-mortem characterizations, and density functional theory (DFT) calculations are combined to understand the thermal reactivity of fully sodiated Sn, Sn-hard carbon (HC) blends, and HC anodes in carbonate- and ether-based electrolytes. ARC measurements show that propylene carbonate (PC) causes earlier self-heating rate (SHR) onset and higher reactivity than tetraethylene glycol dimethyl ether (TEGDME), indicating inferior thermal stability. Sodiated Sn exhibits better thermal stability than sodiated HC, while Sn-HC blends show intermediate behavior that improves with increasing Sn content. Post-ARC analyses reveal desodiation of Na15Sn4 to metallic Sn with particle coalescence, whereas Sn-HC blends and HC retain finer morphologies. PC promotes Sn oxidation to SnO, while TEGDME suppresses oxide formation; NaPF6-containing electrolytes additionally form NaF. DFT calculations show that PC adsorption lowers Na extraction energy and enhances interfacial electronic interactions, facilitating Na release and reductive decomposition. These results establish a direct correlation between solvent-dependent reaction pathways and thermal stability in SIB alloy anodes.

Accelerating rate calorimetry↗
NASA NTRS1995

Sixth Annual Thermal and Fluids Analysis Workshop

The Sixth Annual Thermal and Fluids Analysis Workshop was held at the Ohio Aerospace Institute, Brook Park, Ohio cosponsored by NASA Lewis Research Center and the Ohio Aerospace Institute, August 15-19, 1994. The workshop consisted of classes, vendor demonstrations, and paper sessions. The classes and vendor demonstrations provided participants with the information on widely used tools for thermal and fluids analysis. The paper sessions provided a forum for the exchange of information and ideas among thermal and fluids analysis. Paper topics included advances a uses of established thermal and fluids computer codes (such as SINDA and TRASYS) as well as unique modeling techniques and applications.

Doug Darling↗
NASA NTRSDate not supplied

A Simplified Model of VIPER Thermal Management System. Part I: Loop Heat Pipe

NASA’s Volatiles Investigating Polar Exploration Rover (VIPER) uses a combination of loop heat pipes (LHPs) and heaters as the primary hardware to modulate the temperature of the electronic boxes and payloads instruments. LHPs have been designed and instrumented to be capable of passive and active shutdown. The goal of the passive shutdown, using a thermal control valve (TCV) to limit the flow of the working fluid, is to preserve thermal energy and avoid unnecessary heat leaks during lunar night. The goal of the active shutdown on the other hand, is to forcefully increase the vehicle internal temperature to bakeout the payload instruments. Several numerical modeling tools are available to analyze LHP performance under the complex set of operational requirements and environments levied on the VIPER Thermal Management System (TMS). Yet, while those numerical modeling tools are capable of detailed performance analysis, they tend to take large computational resources and long computational time. In this paper, a model of a single LHP developed based on control volume approach is presented. By using the control volume approach, the complex geometry of the LHP, and the components attached to it, are reduced to thermal lump capacitances, thus reducing the computation effort. This paper also describes the effort to correlate the proposed LHP model using thermal vacuum (TVAC) test data.

Loop Heat Pipe↗
NASA NTRSDate not supplied

A Simplified Model of VIPER Thermal Management System. Part I: Loop Heat Pipe

NASA’s Volatiles Investigating Polar Exploration Rover (VIPER) uses a combination of loop heat pipes (LHPs) and heaters as the primary hardware to modulate the temperature of the electronic boxes and payloads instruments. LHPs have been designed and instrumented to be capable of passive and active shutdown. The goal of the passive shutdown, using a thermal control valve (TCV) to limit the flow of the working fluid, is to preserve thermal energy and avoid unnecessary heat leaks during lunar night. The goal of the active shutdown on the other hand, is to forcefully increase the vehicle internal temperature to bakeout the payload instruments. Several numerical modeling tools are available to analyze LHP performance under the complex set of operational requirements and environments levied on the VIPER Thermal Management System (TMS). Yet, while those numerical modeling tools are capable of detailed performance analysis, they tend to take large computational resources and long computational time. In this paper, a model of a single LHP developed based on control volume approach is presented. By using the control volume approach, the complex geometry of the LHP, and the components attached to it, are reduced to thermal lump capacitances, thus reducing the computation effort. This paper also describes the effort to correlate the proposed LHP model using thermal vacuum (TVAC) test data.

Loop Heat Pipe↗