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At least 289 records · Page 16

Reliability of area array packages with 1500-2500 I/Os

This report first provides a literature survey for designing, manufacturing, and reliability test results for area array packages with 1500 to 2500 inputs/outputs (I/Os). It then presents test matrix on design, yield, and workmanship defects on assembly and environmental testing, including thermal cycle and mechanical drop-test evaluation results for FCBGA1704, FPBGA432, and PBGA676 I/Os packages assembled onto printed circuit/wiring boards (PCBs/PWBs). Finally, it summarizes lessons learned from test results for assembly and environmental testing along with optical, scanning electron microscopy (SEM), and x-ray photomicrographs showing damage progress.

Ghaffarian, Reza↗

Recovery of valuable metals from electronic waste using a novel ammonia-based hydrometallurgical process

The growing quantity of waste electrical and electronic equipment (WEEE), also known as electronic waste (E-waste), has been an area of growing public concern. The abundance of valuable metals contained in waste printed circuit boards (WPCBs) has made it a promising secondary resource, especially for Cu and Au. Although the recovery of metals from WPCBs via hydrometallurgical routes has been studied extensively over the past 20 years, most of the research has been limited in the laboratory. In current hydrometallurgical processes, strong acids and expensive oxidizers are often used to ensure a high recovery of metals without considering the sustainability aspects of the environment and economics. To improve upon current hydrometallurgical offerings, the current study seeks to develop an energy-saving, environmentally friendly, economic and sustainable process to efficiently recover the valuable metals from real-world end-of-life WPCBs. The new contributions presented in this study are 1) design and evaluation of a comprehensive hydrometallurgical flowsheet; 2) employment of real end-of-life PCBs as feed materials in an investigation on Cu-NH3 leaching kinetics; 3) further application of kinetic model on a counter flow process simulation; and 4) evaluation of the influences by co-existing metals in Au-S2O3 leaching and recommendation for favorable leaching conditions.

01 COAL, LIGNITE, AND PEAT↗

Dielectric Barrier Discharge Electrothermal Heating and Additive Manufacturing of Thermoset Parts

Additive manufacturing of thermosets requires a mechanism for solidifying deposited layers in order to prevent part collapse. To accomplish this, non‐equilibrium plasma is proposed for its ability to target, heat, and cure printed thermosetting resin. Non‐equilibrium plasmas have not been used for the curing of liquid thermoset composites, and so their impact on an uncured resin is unknown. Here this work investigates the mechanism through which dielectric barrier discharge (DBD) heats an epoxy/carbon nanotube (CNT) composite under atmospheric conditions. Plasma applied to resin surfaces is found to cause rapid heating, with heating rate controlled by adjusting the applied power. Heating is localized to within the top 0.5 mm of the sample surface and maximum temperature is found to depend on sample conductivity, indicating the heating reaction occurs through a combination of electron conduction and ion bombardment. Characterization of composites cured using plasma shows oxidation and roughening of the surface. Based on the heating and surface studies, several demonstrative prints are performed using in situ plasma curing. This work shows the potential of DBD plasma to rapidly heat liquid substrates and demonstrates how plasma curing expands the capability of existing direct ink write (DIW) printer technologies.

3D printing↗

Design and Development of Aerogel-Based Antennas for Aerospace Applications: A Final Report to the NARI Seedling

As highly porous solids possessing low density and low dielectric permittivity combined with good mechanical properties, polyimide (PI) aerogels offer great promise as an enabling technology for lightweight aircraft antenna systems. While they have been aggressively explored for thermal insulation, barely any effort has been made to leverage these materials for antennas or other applications that take advantage of their aforementioned attributes. In Phase I of the NARI Seedling Project, we fabricated PI aerogels with properties tailored to enable new antenna concepts with performance characteristics (wide bandwidth and high gain) and material properties (low density, environmental stability, and robustness) superior to the state of practice (SOP). We characterized electromagnetic properties, including permittivity, reflectivity, and propagation losses for the aerogels. Simple, prototype planar printed circuit patch antennas from down-selected aerogel formulations were fabricated by molding the aerogels to net shapes and by gold-metalizing the pattern onto the templates via electron beam evaporation in a clean room environment. These aerogel based antennas were benchmarked against current antenna SOP, and exhibited both broader bandwidth and comparable or higher gain performance at appreciably lower mass. Phase II focused on the success of the Phase I results pushing the PI aerogel based antenna technology further by exploring alternative antenna design (i.e., slot coupled antennas) and by examining other techniques for fabricating the antennas including ink jet printing with the goal of optimizing antenna performance and simplifying production. We also examined new aerogel formulations with better moisture and solvent resistance to survive processing conditions. In addition, we investigated more complex antenna designs including passive phased arrays such as 2x4 and 4x8 element arrays to assess the scalability of the aerogel antenna concept. Furthermore, we explored the possibility of developing these arrays in thin, flexible form to make conformable antennas.

insulation↗

Solar system lithograph set for earth and space science

A color lithographs of many of the celestial bodies within our solar system are contained in this educational set of materials. Printed on the back of each lithograph is information regarding the particular celestial body. A sheet with information listing NASA resources and electronic resources for education is included.

Source record↗

Amplitude-Stabilized Oscillator for a Capacitance-Probe Electrometer

A multichannel electrometer voltmeter that employs a mechanical resonator maintained in sustained amplitude-stabilized oscillation has been developed for the space-based measurement of an Internal Electrostatic Discharge Monitor (IESDM) sensor. The IESDM is new sensor technology targeted for integration into a Space Environmental Monitor (SEM) subsystem used for the characterization and monitoring of deep dielectric charging on spacecraft. Creating a stable oscillator from the mechanical resonator was achieved by employing magnetic induction for sensing the resonator s velocity, and forcing a current through a coil embedded in the resonator to produce a Lorentz actuation force that overcomes the resonator s dissipative losses. Control electronics employing an AGC loop provide conditions for stabilized, constant amplitude harmonic oscillation. The prototype resonator was composed of insulating FR4 printed-wireboard (PWB) material containing a flat, embedded, rectangular coil connected through flexure springs to a base PWB, and immersed in a magnetic field having two regions of opposite field direction generated by four neodymium block magnets. In addition to maintaining the mechanical movement needed for the electrometer s capacitor-probe transducer, this oscillator provides a reference signal for synchronous detection of the capacitor probe s output signal current so drift of oscillation frequency due to environmental effects is inconsequential.

Blaes, Brent R.↗

Metal additively manufactured wavy fin cold-plate architecture for improved thermal-hydraulic performance

Rapid growth in artificial intelligence and data center workloads demands high-performance liquid cooling to manage increasing chip power. This study presents two metal-additive-manufactured cold plates with sinusoidal fins, constant-amplitude wavy fins and linearly variable-amplitude wavy fins and compares them against metal-additive-manufactured straight fins using experiments conducted at 1 kW heat dissipation as well as high-fidelity 3D conjugate computational fluid dynamic simulations. The cold plates were printed in AlSi10Mg material and underwent design using a Python-automated workflow prior to manufacture and testing. The experiments show that wavy fins reduce the normalized thermal resistance by 35 to 45 % at water flow rates from 1 to 4 LPM. At a fixed 20 kPa pressure drop, the variable-waviness design lowered peak surface temperature by 9 °C and thermal resistance by 51 %, while edge-channel maldistribution in the constant wavy fin design limited gains. A thermal resistance breakdown revealed that 55–63 % of the total thermal resistance in wavy designs comes from base heat conduction, 27–33 % from fin heat conduction, and 9–13 % from fin heat convection, indicating the need to address conduction bottlenecks. Parametric sweeps identify a 3 mm fin pitch as optimal, and that horizontal inlet/outlet manifolds further reduce pressure drop by 30–60 % and thermal resistance by 9–16 % relative to vertical inlet-outlet manifolds. The results yield comprehensive guidelines for fin geometry, manifold alignment, material selection and additive-manufacturing constraints to realize high-performance liquid-cooled cold plates for power-dense electronics.

3d printing↗

Biocontamination and particulate detection system

A method for determining the characteristics and amount of microscopic contaminants lodged on a photographed surface is disclosed. An image enhanced full color photographic negative and print are taken of the contaminated surface. Three black and white prints are developed subsequently from red, green and blue separation filter overlays of the color negative. Both the color and three monochromatic prints are then scanned to extract in digital form a profile of any contaminant possibly existing on the surface. The resulting profiles are electronically analyzed and compared with data already stored relating to known contaminants.

Jacobs, J. M.↗

Solder joint fatigue analysis under low temperature Martian conditions

Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.

low temperature↗

Unitary Shaft-Angle and Shaft-Speed Sensor Assemblies

The figure depicts a unit that contains a rotary-position or a rotary-speed sensor, plus electronic circuitry necessary for its operation, all enclosed in a single housing with a shaft for coupling to an external rotary machine. This rotation sensor unit is complete: when its shaft is mechanically connected to that of the rotary machine and it is supplied with electric power, it generates an output signal directly indicative of the rotary position or speed, without need for additional processing by other circuitry. The incorporation of all of the necessary excitatory and readout circuitry into the housing (in contradistinction to using externally located excitatory and/or readout circuitry) in a compact arrangement is the major difference between this unit and prior rotation-sensor units. The sensor assembly inside the housing includes excitatory and readout integrated circuits mounted on a circular printed-circuit board. In a typical case in which the angle or speed transducer(s) utilize electromagnetic induction, the assembly also includes another circular printed-circuit board on which the transducer windings are mounted. A sheet of high-magnetic permeability metal ("mu metal") is placed between the winding board and the electronic-circuit board to prevent spurious coupling of excitatory signals from the transducer windings to the readout circuits. The housing and most of the other mechanical hardware can be common to a variety of different sensor designs. Hence, the unit can be configured to generate any of variety of outputs by changing the interior sensor assembly. For example, the sensor assembly could contain an analog tachometer circuit that generates an output proportional (in both magnitude and sign or in magnitude only) to the speed of rotation.

Alhorn, Dean C.↗

Degradation science: Integrating modeling and experiments to predict localized corrosion processes (Annual Progress Report)

Additively manufactured (AM) eutectic high-entropy alloys (EHEAs), such as nano-lamellar AlCoCrFeNi 2.1 , have excellent strength, ductility, and wear resistance even at elevated temperatures, but their corrosion behavior in aggressive acids at different length scales remain poorly understood. This work investigates the corrosion behavior of laser powder bed–fused (L-PBF) AlCoCrFeNi 2.1 as a function of annealing temperatures, probing degradation mechanisms from nanoscopic to macroscopic length scales. The alloy is dual phase consisting of a ductile FCC L1 2 phase and a high-strength BCC B2 phase. Rapid solidification during L-PBF produces a far-from-equilibrium nano-lamellar structure with nearly homogeneous elemental distribution, which tends to evolve upon annealing toward Cr/Co/Fe-enriched FCC and Al/Ni-enriched B2. Three conditions were studied: as-printed, 600 °C/5 h, and 1000 °C/1 h, over which B2 lamellae coarsen, lamellar spacing increases, and elemental segregation becomes more prominent. Microstructure and chemistry were characterized by scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS), while in-situ electrochemical atomic force microscopy (EC-AFM) was used to link early (<5 h) local dissolution to microstructure after exposure in sulfuric acid. EC-AFM highlights preferential dissolution of the BCC/B2 phase where the surrounding matrix is Cr-depleted and directly quantifies the dissolution rates within individual phases, tracks the transition from early nano-scale attack to partial repassivation, to correlate height differences with current and impedance responses. To monitor longer-term behavior (up to 96 h), ex-situ AFM, SEM, and confocal imaging were combined with conventional bulk electrochemical tests, bridging nanoscale observations to micro/meso-scale damage morphologies. At the meso-scale, the deepest dissolution channels align with the build-direction lamellae and melt-pool boundaries, indicating that printing directionality guides the propagation of these localized corrosion sites. Annealing modifies corrosion by restructuring BCC/FCC phase fractions, lamellar spacing, and Cr/Al segregation, thereby changing the cathode/anode ratio and passive film stability. The results clarify how as-printed and annealed nano-lamellar architectures differ in their susceptibility to selective dissolution; how elemental segregation competes with residual stresses along the build direction. With these insights, future work will use CALPHAD-guided alloy modification to stabilize higher Cr contents in the B2 phase while retaining a dominant FCC+B2/BCC microstructure, with the goal of designing mechanically robust, corrosion-resistant EHEAs for safety-critical applications to leverage the LLNL’s broader national and global security mission.

36 MATERIALS SCIENCE↗

Post-build stress-relief optimization for laser powder bed fusion 316H stainless steel

Nuclear energy remains a critical component of a diversified and efficient energy portfolio, offering reliable, high-capacity, and low-carbon power. However, in the U.S., aging infrastructure and the slow qualification and deployment of advanced materials and manufacturing techniques hinder progress in next-generation reactor technologies. This study explores the application of laser powder bed fusion (LPBF) additive manufacturing for stainless steel 316H, with a focus on optimizing post-build heat treatments to enhance material properties for high-temperature nuclear applications. The research targets the optimization of stress-relief temperatures to alleviate postbuild residual stresses, ensuring improvements in the microstructural corelated properties. A series of microstructural and mechanical evaluations were performed on LPBF-printed SS-316H samples which were subjected to annealing at temperatures varying between 650 °C and 850 °C. X-ray diffraction, scanning electron microscopy, and transmission electron microscopy analyses revealed that increasing the heattreatment temperature accelerated dislocation recovery. Vickers microhardness measurements showed an initial reduction in values, followed by stabilization over extended durations at all the temperatures. While higher temperatures facilitated faster recovery, they also promoted carbide precipitation along grain and solidification cell boundaries, narrowing the safe processing window. In contrast, heat treatment at 650°C preserved the cellular substructure and enabled controlled carbide precipitation over time. In conclusion, these findings highlight the importance of time–temperature optimization and suggest that 650°C for up to 2 h provides the most favorable balance between recovery and carbide control for a stress-relief treatment.

316 stainless steel↗

Adhesion of Self-Complementary, Sinusoidal Surfaces Fabricated Using Two-Photon Polymerization

Microscale, pick-and-place assembly is a non-lithographic assembly method poised to impact diverse fields including flexible electronics, microfluidics and robotics. However, a major technological challenge is the need to deterministically control adhesion between parts. Here, switchable adhesion involving 3D-printed, self-complementary surfaces is demonstrated. Mechanical properties of metasurfaces pressed against flat, rigid substrates are modeled using finite element methods. A series of flat slabs and metastructured slabs with 2D sinusoidal surfaces are printed using two-photon polymerization (2PP) of a shape-memory resin. The surface frequency of featured slabs was varied between $3.\bar3$ mm −1 and $26.\bar6$ mm −1 with similar amplitudes. Adhesion between printed metasurfaces and glass and between printed, self-complementary metasurfaces is studied above and below the cured resin’s glass transition temperature (∼45 °C). Simple heating of adhering surfaces to above 60 °C lowers adhesion, and compression of surfaces while above the glass transition temperature followed by cooling to room temperature elevates adhesion. The nominal adhesive strength between printed, self-complementary surfaces, as determined by the maximum observable pull-off stress, exceeds 3 MPa. Further tailoring complementary surfaces for adhesion control may facilitate microscale disassembly for recovery of components or precious metals.

amorphous materials↗

A densitometric analysis of commercial 35mm films

IIaO films have been subjected to various sensitometric tests. The have included thermal and aging effects and reciprocity failure studies. In order to compare the special IIaO film with popular brands of 35 mm films and their possible use in astrophotography, Agfa, Fuji and Kodak print and slide formats, as well as black and white and color formats, were subjected to sensitometric, as well as densitometric analysis. A scanning electron microscope was used to analyze grain structure size, and shape as a function of both speed and brand. Preliminary analysis of the grain structure using an ISI-SS40 scanning electron microscope indicates that the grain sizes for darker densities are much larger than the grain size for lighter densities. Researchers analyze the scanning electron microscope findings of the various grains versus densities as well as enhancement of the grains, using the IP-8500 Digital Image Processor.

Hammond, Ernest C., Jr.↗

Electronic Packaging Techniques

A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

Source record↗

MCM Polarimetric Radiometers for Planar Arrays

A polarimetric radiometer that operates at a frequency of 40 GHz has been designed and built as a prototype of multiple identical units that could be arranged in a planar array for scientific measurements. Such an array is planned for use in studying the cosmic microwave background (CMB). All of the subsystems and components of this polarimetric radiometer are integrated into a single multi-chip module (MCM) of substantially planar geometry. In comparison with traditional designs of polarimetric radiometers, the MCM design is expected to greatly reduce the cost per unit in an array of many such units. The design of the unit is dictated partly by a requirement, in the planned CMB application, to measure the Stokes parameters I, Q, and U of the CMB radiation with high sensitivity. (A complete definition of the Stokes parameters would exceed the scope of this article. In necessarily oversimplified terms, I is a measure of total intensity of radiation, while Q and U are measures of the relationships between the horizontally and vertically polarized components of radiation.) Because the sensitivity of a single polarimeter cannot be increased significantly, the only way to satisfy the high-sensitivity requirement is to make a large array of polarimeters that operate in parallel. The MCM includes contact pins that can be plugged into receptacles on a standard printed-circuit board (PCB). All of the required microwave functionality is implemented within the MCM; any required supporting non-microwave ("back-end") electronic functionality, including the provision of DC bias and control signals, can be implemented by standard PCB techniques. On the way from a microwave antenna to the MCM, the incoming microwave signal passes through an orthomode transducer (OMT), which splits the radiation into an h + i(nu) beam and an h - i(nu) beam (where, using complex-number notation, h denotes the horizontal component, nu denotes the vertical component, and +/-i denotes a +/-90deg phase shift). Each of these beams enters the MCM through one of two WR-22 waveguide input terminals in the lid of the MCM. The h + i(nu0 and h - i(nu) signals are amplified, then fed to a phase-discriminator hybrid designed specifically to fit the predominantly planar character of the MCM geometry and to enable determination of Q and U. The phase-discriminator hybrid generates four outputs, which are detected and used to calculate I, Q, and U.

Kangaslahti, Pekka↗

High Contrast Imaging With MEMS Deformable Mirrors in the Decadal Survey Testbed

Deformable mirrors (DMs) are an essential part of any coronagraphic, high contrast instrument. They mitigate optical aberrations in the system and can even be used to generate contrast for the coronagraph. MEMS DMs from Boston Micromachines have been selected as the baseline for two flagship space telescopes proposed to the 2020 Decadal Survey. Although MEMS DMs have over a decade of heritage on ground-based telescopes and in in-air testbeds around the globe, they have not been tested in vacuum down to the ∼10−10 contrast level needed to image terrestrial exoplanets. In this paper, we describe vacuum tests of MEMS DMs in the Decadal Survey Testbed at the Jet Propulsion Laboratory. The first challenge was a bright, temporally incoherent signal, which was identified as electronics noise and removed with a low-pass filter. After that, the contrast has been limited in broadband light by the strong print-through on the DM surfaces. We performed numerical simulations to confirm that conclusion and to characterize the improvements needed to the MEMS DM surfaces and the testbed layout to attain our goal of 10−10 contrast.

Seo, Byoung-Joon↗

Conductive Carbon Nanotube Inks for Use with Desktop Inkjet Printing Technology

Inkjet printing is a common commercial process. In addition to the familiar use in printing documents from computers, it is also used in some industrial applications. For example, wire manufacturers are required by law to print the wire type, gauge, and safety information on the exterior of each foot of manufactured wire, and this is typically done with inkjet or laser printers. The goal of this work was the creation of conductive inks that can be applied to a wire or flexible substrates via inkjet printing methods. The use of inkjet printing technology to print conductive inks has been in testing for several years. While researchers have been able to get the printing system to mechanically work, the application of conductive inks on substrates has not consistently produced adequate low resistances in the kilohm range. Conductive materials can be applied using a printer in single or multiple passes onto a substrate including textiles, polymer films, and paper. The conductive materials are composed of electrical conductors such as carbon nanotubes (including functionalized carbon nanotubes and metal-coated carbon nanotubes); graphene, a polycyclic aromatic hydrocarbon (e.g., pentacene and bisperipentacene); metal nanoparticles; inherently conductive polymers (ICP); and combinations thereof. Once the conductive materials are applied, the materials are dried and sintered to form adherent conductive materials on the substrate. For certain formulations, increased conductivity can be achieved by printing on substrates supported by low levels of magnetic field alignment. The adherent conductive materials can be used in applications such as damage detection, dust particle removal, smart coating systems, and flexible electronic circuitry. By applying alternating layers of different electrical conductors to form a layered composite material, a single homogeneous layer can be produced with improved electrical properties. It is believed that patterning alternate layers of different conductors may improve electrical pathways through alignment of the conductors and band gap optimization. One feature of this innovation is that flexible conductive traces could be accomplished with a conductive ink having a surface resistivity of less than 10 ohms/square. Another result was that a composite material comprising a mixture of carbon nanotubes and metallic nanoparticles could be applied by inkjet printing to flexible substrates, and the resulting applied material was one to two orders of magnitude more conductive than a material made by printing inks containing carbon nanotubes alone.

Roberson, Luke↗