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NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗

NASA NTRS2017

Interconnect and Packaging Technologies for Terahertz Communication Systems

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Micromachining↗

NASA NTRS2005

Apparatus for Precise Indium-Bump Bonding of Microchips

An improved apparatus has been designed and built for use in precise positioning and pressing of a microchip onto a substrate (which could, optionally, be another microchip) for the purpose of indium-bump bonding. The apparatus (see figure) includes the following: A stereomicroscope, A stage for precise positioning of the microchip in rotation angle (theta) about the nominally vertical pressing axis and in translation along two nominally horizontal coordinate axes (x and y), and An actuator system that causes a bonding tip to press the microchip against the substrate with a precisely controlled force. In operation, the microscope and the stage are used to position the microchip under the bonding tip and to align the indium bumps on the chip and the substrate, then the actuator system is used to apply a prescribed bonding force for a prescribed time. The improved apparatus supplants a partly similar prior apparatus that operated with less precision and repeatability, producing inconsistent and unreliable bonds. Results of the use of the prior apparatus included broken microchips, uneven bonds, and bonds characterized, variously, by overcompression or undercompression. In that apparatus, the bonding force was generated and controlled by use of a micrometer head positioned over the center of a spring-loaded scale, and the force was applied to the microchip via the scale, which was equipped for digital readout of the force. The inconsistency of results was attributed to the following causes: It was not possible to control the bonding force with sufficient precision or repeatability. Particularly troublesome was the inability to control the force at levels less than the weight of 150 g. Excessive compliance in the spring-loaded scale, combined with deviations from parallelarity of the substrate and bonding-tip surfaces, gave rise to nonuniformity in the pressure applied to the microchip, thereby generating excessive stresses and deformations in the microchip. In the improved apparatus, the bonding tip and the components that hold the substrate and the microchip are more rigid and precise than in the prior apparatus, so as to ensure less deviation from parallelarity of the bonding-tip and substrate surfaces, thereby ensuring more nearly uniform distribution of bonding force over the area of the microchip. The bonding force is now applied through, and measured by, a load cell that makes it possible to exert finer control over the force. The force can be set at any value between 0 and the weight of 800 g in increments of 0.2 g.

Wild, Larry↗

NASA NTRS2024

Conclusions of a Mini Technical Interchange Meeting on New Cross Risk Integration Projects Managed by the NASA Space Radiation Element

To enable deep space exploration and sustained human presence in space, the NASA Human Research Program’s (HRP) Space Radiation Element (SRE) funds research to characterize and mitigate adverse health outcomes from exposure to space radiation that include risks of carcinogenesis, cardiovascular disease, and central nervous system decrements. Recently, the SRE was tasked with supporting multiple HRP Elements with innovative and enabling projects to inform risk characterization, facilitate mitigation activities, and support crew health and performance. These projects, such as precision health initiative, NASA Omics Archive (NOA) and human sample repositories, are agnostic to any HRP Element, hence the name, Cross-Risk Integration Projects (CRIP). CRIP serves 3 broad purposes: - Services: Generate samples and data and manage the receipt, inventory, archive, and ultimate redistribution of biospecimens created in HRP-funded spaceflight and analog research activities—includes NASA Omics Archive project and various human and animal sample repositories. - Method Development: Identify and evaluate new-to-NASA research or analysis methods or techniques that could fundamentally improve existing or planned research efforts—includes the Translational Radiation Research and Countermeasures Project. - Enabling Capabilities: Demonstrate real-world application by adapting, adopting, and/or developing capabilities to benefit crew health and performance and improve risk mitigation—includes Precision Health Initiative (Pharmacogenomics) and advanced biological systems and engineered tissue microsystems initiative (tissue chips, organ-on-a-chip). To identify new technologies, future work, and solicitations, the SRE organizes themed sessions at annual HRP Investigators’ Workshops (IWS). These technical interchange meetings (TIMs) provide a venue for the scientific community to present ongoing work and engage in open discussion of results, limitations of current approaches, and incorporation of novel experimental strategies, model systems, and other innovative techniques. Here, a summary of the studies presented at the SRE-sponsored mini-TIM at the HRP IWS along with the goals and objectives of the CRIP projects is communicated. The 90-min TIM had 6 speakers who presented impressive novel ideas and work, some of which are funded under CRIP by the Space Radiation Element.

Janapriya Saha↗

NASA NTRSDate not supplied

Destination: Mars. Biology Research to Support Human Space Exploration

This is a public talk about astronaut health risks during deep space exploration, including exposure to deep space radiation (galactic cosmic rays and solar particle events), microgravity and other stressors, and about the research currently being done at NASA Ames and other institutions to investigate and mitigate these risks. I will specifically focus on the risk posed by exposure to deep space radiation, and will briefly describe my own research on developing human brain-on-a-chip models to investigate its impact on the central nervous system.

human spaceflight, space radiation, organ-on-a-chi↗

NASA NTRS2005

Beyond G-band : a 235 GHz InP MMIC amplifier

We present results on an InP monolithic millimeter- wave integrated circuit (MMIC) amplifier having 10-dB gain at 235 GHz. We designed this circuit and fabricated the chip in Northrop Grumman Space Technology's (NGST) 0.07- m InP high electron mobility transistor (HEMT) process. Using a WR3 (220-325 GHz) waveguide vector network analyzer system interfaced to waveguide wafer probes, we measured this chip on-wafer for -parameters. To our knowledge, this is the first time a WR3 waveguide on-wafer measurement system has been used to measure gain in a MMIC amplifier above 230 GHz.

high electron mobility transistors (HEMTs)↗

NASA NTRS1981

Application of microprocessors in an upper atmosphere instrument package

A servo-driven magnetometer table measuring offset from magnetic north has been developed by NASA to calculate payload azimuth required to point at a celestial target. Used as an aid to the study of gamma-ray phenomena, the high-altitude balloon-borne instrument determines a geocentric reference system, and calculates a set of pointing directions with respect to the system. Principal components include the magnetometer, stepping motor, microcomputer, and gray code shaft encoder. The single-chip microcomputer is used to control the orientation of the system, and consists of a central processing unit, program memory, data memory and input/output ports. Principal advantages include a low power requirement, consuming 6 watts, as compared to 30 watts consumed by the previous system.

Lim, T. S.↗

NASA NTRS1999

Miniature X-Ray Bone Densitometer

The purpose of the Dual Energy X-ray Absorptiometry (DEXA) project is to design, build, and test an advanced X-ray absorptiometry scanner capable of being used to monitor the deleterious effects of weightlessness on the human musculoskeletal system during prolonged spaceflight. The instrument is based on the principles of dual energy x-ray absorptiometry and is designed not only to measure bone, muscle, and fat masses but also to generate structural information about these tissues so that the effects on mechanical integrity may be assessed using biomechanical principles. A skeletal strength assessment could be particularly important for an astronaut embarking on a remote planet where the consequences of a fragility fracture may be catastrophic. The scanner will employ multiple projection images about the long axis of the scanned subject to provide geometric properties in three dimensions, suitable for a three-dimensional structural analysis of the scanned region. The instrument will employ advanced fabrication techniques to minimize volume and mass (100 kg current target with a long-term goal of 60 kg) of the scanner as appropriate for the space environment, while maintaining the required mechanical stability for high precision measurement. The unit will have the precision required to detect changes in bone mass and geometry as small as 1% and changes in muscle mass as small as 5%. As the system evolves, advanced electronic fabrication technologies such as chip-on-board and multichip modules will be combined with commercial (off-the-shelf) parts to produce a reliable, integrated system which not only minimizes size and weight, but, because of its simplicity, is also cost effective to build and maintain. Additionally, the system is being designed to minimize power consumption. Methods of heat dissipation and mechanical stowage (for the unit when not in use) are being optimized for the space environment.

Charles, Harry K., Jr.↗

NASA NTRS2000

NASA's 3D Flight Computer for Space Applications

The New Millennium Program (NMP) Integrated Product Development Team (IPDT) for Microelectronics Systems was planning to validate a newly developed 3D Flight Computer system on its first deep-space flight, DS1, launched in October 1998. This computer, developed in the 1995-97 time frame, contains many new computer technologies previously never used in deep-space systems. They include: advanced 3D packaging architecture for future low-mass and low-volume avionics systems; high-density 3D packaged chip-stacks for both volatile and non-volatile mass memory: 400 Mbytes of local DRAM memory, and 128 Mbytes of Flash memory; high-bandwidth Peripheral Component Interface (Per) local-bus with a bridge to VME; high-bandwidth (20 Mbps) fiber-optic serial bus; and other attributes, such as standard support for Design for Testability (DFT). Even though this computer system did not complete on time for delivery to the DS1 project, it was an important development along a technology roadmap towards highly integrated and highly miniaturized avionics systems for deep-space applications. This continued technology development is now being performed by NASA's Deep Space System Development Program (also known as X2000) and within JPL's Center for Integrated Space Microsystems (CISM).

Alkalai, Leon↗

NASA NTRS1985

Test chip assembler and test program generator

One of the major problems in working at the geometry level for the generation of either test structure or functional circuit designs is the amount of labor involved in the design phase. To reduce the amount of labor involved in both the design and test of the structures used, JPL has developed a design and test program consisting of a Test Chip Assembler (TCA) and a Test Program Generator (TPG), which creates the geometrical description of the structures and generates the necessary test information using a high-level language. This system reduces the design time for a test chip by a factor of 30. To analyze the data obtained from wafer probing, a statistical package called STMJPL was developed. Some of the capabilities of the JPL software (STMJPL) are described.

Pina, C. A.↗

NASA NTRS1989

On testing VLSI chips for the big Viterbi decoder

A general technique that can be used in testing very large scale integrated (VLSI) chips for the Big Viterbi Decoder (BVD) system is described. The test technique is divided into functional testing and fault-coverage testing. The purpose of functional testing is to verify that the design works functionally. Functional test vectors are converted from outputs of software simulations which simulate the BVD functionally. Fault-coverage testing is used to detect and, in some cases, to locate faulty components caused by bad fabrication. This type of testing is useful in screening out bad chips. Finally, design for testability, which is included in the BVD VLSI chip design, is described in considerable detail. Both the observability and controllability of a VLSI chip are greatly enhanced by including the design for the testability feature.

Hsu, I. S.↗

NASA NTRS2003

Low-Power SOI CMOS Transceiver

The work aims at developing a low-power Silicon on Insulator Complementary Metal Oxide Semiconductor (SOI CMOS) Transceiver for deep-space communications. RF Receiver must accomplish the following tasks: (a) Select the desired radio channel and reject other radio signals, (b) Amplify the desired radio signal and translate them back to baseband, and (c) Detect and decode the information with Low BER. In order to minimize cost and achieve high level of integration, receiver architecture should use least number of external filters and passive components. It should also consume least amount of power to minimize battery cost, size, and weight. One of the most stringent requirements for deep-space communication is the low-power operation. Our study identified that two candidate architectures listed in the following meet these requirements: (1) Low-IF receiver, (2) Sub-sampling receiver. The low-IF receiver uses minimum number of external components. Compared to Zero-IF (Direct conversion) architecture, it has less severe offset and flicker noise problems. The Sub-sampling receiver amplifies the RF signal and samples it using track-and-hold Subsampling mixer. These architectures provide low-power solution for the short- range communications missions on Mars. Accomplishments to date include: (1) System-level design and simulation of a Double-Differential PSK receiver, (2) Implementation of Honeywell SOI CMOS process design kit (PDK) in Cadence design tools, (3) Design of test circuits to investigate relationships between layout techniques, geometry, and low-frequency noise in SOI CMOS, (4) Model development and verification of on-chip spiral inductors in SOI CMOS process, (5) Design/implementation of low-power low-noise amplifier (LNA) and mixer for low-IF receiver, and (6) Design/implementation of high-gain LNA for sub-sampling receiver. Our initial results show that substantial improvement in power consumption is achieved using SOI CMOS as compared to standard CMOS process. Potential advantages of SOI CMOS for deep-space communication electronics include: (1) Radiation hardness, (2) Low-power operation, and (3) System-on-Chip (SOC) solutions.

Fujikawa, Gene↗

NASA NTRS2001

Mini AERCam: A Free-Flying Robot for Space Inspection

The NASA Johnson Space Center Engineering Directorate is developing the Autonomous Extravehicular Robotic Camera (AERCam), a free-flying camera system for remote viewing and inspection of human spacecraft. The AERCam project team is currently developing a miniaturized version of AERCam known as Mini AERCam, a spherical nanosatellite 7.5 inches in diameter. Mini AERCam development builds on the success of AERCam Sprint, a 1997 Space Shuttle flight experiment, by integrating new on-board sensing and processing capabilities while simultaneously reducing volume by 80%. Achieving these productivity-enhancing capabilities in a smaller package depends on aggressive component miniaturization. Technology innovations being incorporated include micro electromechanical system (MEMS) gyros, "camera-on-a-chip" CMOS imagers, rechargeable xenon gas propulsion, rechargeable lithium ion battery, custom avionics based on the PowerPC 740 microprocessor, GPS relative navigation, digital radio frequency communications and tracking, micropatch antennas, digital instrumentation, and dense mechanical packaging. The Mini AERCam free-flyer will initially be integrated into an approximate flight-like configuration for laboratory demonstration on an airbearing table. A pilot-in-the-loop and hardware-in-the-loop simulation to simulate on-orbit navigation and dynamics will complement the airbearing table demonstration. The Mini AERCam lab demonstration is intended to form the basis for future development of an AERCam flight system that provides on-orbit views of the Space Shuttle and International Space Station unobtainable from fixed cameras, cameras on robotic manipulators, or cameras carried by space-walking crewmembers.

Fredrickson, Steven↗

NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗

NASA NTRS1997

Hierarchical Simulation to Assess Hardware and Software Dependability

This thesis presents a method for conducting hierarchical simulations to assess system hardware and software dependability. The method is intended to model embedded microprocessor systems. A key contribution of the thesis is the idea of using fault dictionaries to propagate fault effects upward from the level of abstraction where a fault model is assumed to the system level where the ultimate impact of the fault is observed. A second important contribution is the analysis of the software behavior under faults as well as the hardware behavior. The simulation method is demonstrated and validated in four case studies analyzing Myrinet, a commercial, high-speed networking system. One key result from the case studies shows that the simulation method predicts the same fault impact 87.5% of the time as is obtained by similar fault injections into a real Myrinet system. Reasons for the remaining discrepancy are examined in the thesis. A second key result shows the reduction in the number of simulations needed due to the fault dictionary method. In one case study, 500 faults were injected at the chip level, but only 255 propagated to the system level. Of these 255 faults, 110 shared identical fault dictionary entries at the system level and so did not need to be resimulated. The necessary number of system-level simulations was therefore reduced from 500 to 145. Finally, the case studies show how the simulation method can be used to improve the dependability of the target system. The simulation analysis was used to add recovery to the target software for the most common fault propagation mechanisms that would cause the software to hang. After the modification, the number of hangs was reduced by 60% for fault injections into the real system.

Ries, Gregory Lawrence↗

NASA NTRS2011

Surface acoustic wave coding for orthogonal frequency coded devices

Methods and systems for coding SAW OFC devices to mitigate code collisions in a wireless multi-tag system. Each device producing plural stepped frequencies as an OFC signal with a chip offset delay to increase code diversity. A method for assigning a different OCF to each device includes using a matrix based on the number of OFCs needed and the number chips per code, populating each matrix cell with OFC chip, and assigning the codes from the matrix to the devices. The asynchronous passive multi-tag system includes plural surface acoustic wave devices each producing a different OFC signal having the same number of chips and including a chip offset time delay, an algorithm for assigning OFCs to each device, and a transceiver to transmit an interrogation signal and receive OFC signals in response with minimal code collisions during transmission.

Malocha, Donald↗

NASA NTRS2010

NASA Tech Briefs, September 2010

Topics covered include: Instrument for Measuring Thermal Conductivity of Materials at Low Temperatures; Multi-Axis Accelerometer Calibration System; Pupil Alignment Measuring Technique and Alignment Reference for Instruments or Optical Systems; Autonomous System for Monitoring the Integrity of Composite Fan Housings; A Safe, Self-Calibrating, Wireless System for Measuring Volume of Any Fuel at Non-Horizontal Orientation; Adaptation of the Camera Link Interface for Flight-Instrument Applications; High-Performance CCSDS Encapsulation Service Implementation in FPGA; High-Performance CCSDS AOS Protocol Implementation in FPGA; Advanced Flip Chips in Extreme Temperature Environments; Diffuse-Illumination Systems for Growing Plants; Microwave Plasma Hydrogen Recovery System; Producing Hydrogen by Plasma Pyrolysis of Methane; Self-Deployable Membrane Structures; Reactivation of a Tin-Oxide-Containing Catalys; Functionalization of Single-Wall Carbon Nanotubes by Photo-Oxidation; Miniature Piezoelectric Macro-Mass Balance; Acoustic Liner for Turbomachinery Applications; Metering Gas Strut for Separating Rocket Stages; Large-Flow-Area Flow-Selective Liquid/Gas Separator; Counterflowing Jet Subsystem Design; Water Tank with Capillary Air/Liquid Separation; True Shear Parallel Plate Viscometer; Focusing Diffraction Grating Element with Aberration Control; Universal Millimeter-Wave Radar Front End; Mode Selection for a Single-Frequency Fiber Laser; Qualification and Selection of Flight Diode Lasers for Space Applications; Plenoptic Imager for Automated Surface Navigation; Maglev Facility for Simulating Variable Gravity; Hybrid AlGaN-SiC Avalanche Photodiode for Deep-UV Photon Detection; High-Speed Operation of Interband Cascade Lasers; 3D GeoWall Analysis System for Shuttle External Tank Foreign Object Debris Events; Charge-Spot Model for Electrostatic Forces in Simulation of Fine Particulates; Hidden Statistics Approach to Quantum Simulations; Reconstituted Three-Dimensional Interactive Imaging; Determining Atmospheric-Density Profile of Titan; Digital Microfluidics Sample Analyzer; Radiation Protection Using Carbon Nanotube Derivatives; Process to Selectively Distinguish Viable from Non-Viable Bacterial Cells; and TEAMS Model Analyzer.

Source record↗

NASA NTRS2004

Modular, Adaptive, Reconfigurable Systems: Technology for Sustainable, Reliable, Effective, and Affordable Space Exploration

In order to execute the Vision for Space Exploration, we must find ways to reduce cost, system complexity, design, build, and test times, and at the same time increase flexibility to satisfy multiple functions. Modular, Adaptive, Reconfigurable System (MARS) technologies promise to set the stage for the delivery of system elements that form the building blocks of increasingly ambitious missions involving humans and robots. Today, space systems are largely specialized and built on a case-by-case basis. The notion of modularity however, is nothing new to NASA. The 1970's saw the development of the Multi-Mission Modular spacecraft (MMS). From 1980 to 1992 at least six satellites were built under this paradigm, and included such Goddard Space Flight Center missions as SSM, EUVE, UARS, and Landsat 4 and 5. Earlier versions consisted of standard subsystem "module" or "box" components that could be replaced within a structure based on predefined form factors. Although the primary motivation for MMS was faster/cheaper integration and test, standardization of interfaces, and ease of incorporating new subsystem technology, it lacked the technology maturity and programmatic "upgrade infrastructure" needed to satisfy varied mission requirements, and ultimately it lacked user buy-in. Consequently, it never evolved and was phased out. Such concepts as the Rapid Spacecraft Development Office (RSDO) with its regularly updated catalogue of prequalified busses became the preferred method for acquiring satellites. Notwithstanding, over the past 30 years since MMS inception, technology has advanced considerably and now modularity can be extended beyond the traditional MMS module or box to cover levels of integration, from the chip, card, box, subsystem, to the space system and to the system-of-systems. This paper will present the MARS architecture, cast within the historical context of MMS. Its application will be highlighted by comparing a state-of-the-art point design vs. a MARS-enabled lunar mission, as a representative robotic case design.

Esper, Jaime↗