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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Hard coated aluminum circuit boards demonstrate the feasibility of obtaining an electrical power circuit of high packaging density with very high thermal conductivity and mechanical strengths.
Interim report of Apollo 204 Review Board
Machine language to describe on board and ground station data handling and processing of satellite experiments
Performance, design, test, and qualification requirements of computer programs for support system for on-board checkout and data management system of Saturn/Apollo application program
Self-contained and vehicle integrated on-board checkout systems, considering controller-evaluator and sensors
Decontamination, cleaning, coating, and encapsulation procedures for electronic circuit boards of IMP spacecraft
Application of the microhm measuring circuit to measurement of plated-through hole resistances, when combined with appropriate probes, provides data that can be related to the quality of copper plating on printed wiring boards. Acceptance limits can be established and continuous inspection performed, with plating defects causing abnormal readings.
Printed circuit boards retaining as much copper as possible provide electromagnetic shielding between stages of the high frequency amplifiers and transmitters. Oscillation is prevented, spurious output signals are reduced, and multiple stages are kept isolated from each other, both thermally and electrically.
Sextant sighting measurements from on board Gemini 12 spacecraft
Integration of VHF/UHF dual channel receiver on board Mariner 5 spacecraft
Highly reliable soldered joints for printed circuit boards
Printed wiring board component mounting configurations to ensure successful solder terminations
Microstructure and void formation in solder connections of components on multilayer boards
Printed circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.
Ferric chloride in an aqueous medium etches copper from the surface of printed-circuit boards. Ferric ions are reduced to ferrous ions resulting in a reduced etching rate.
Materials compatibility study for improved multilayer printed circuit board
Conformal coatings for printed wiring boards and components for Saturn 5 launch vehicles
Electrical connection for printed circuits on common board, using bellows principle in rivet