Experiment with an Automated Visual Inspection System
Experiments were performed with an automated visual inspection system that detects potential flaws by comparing reference and comparison images.
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Experiments were performed with an automated visual inspection system that detects potential flaws by comparing reference and comparison images.
This paper presents a simple and robust kinematic control scheme for the JPL serpentine robot system. The proposed strategy is developed using the dampened-least-squares/configuration control methodology, and permits the considerable dexterity of the JPL serpentine robot to be effectively utilized for maneuvering in the congested and uncertain workspaces often encountered in inspection tasks. Computer simulation results are given for the 20 degree-of-freedom (DOF) manipulator system obtained by mounting the twelve DOF serpentine robot at the end-effector of an eight DOF Robotics Research arm/lathe-bed system. These simulations demonstrate that the proposed approach provides an effective method of controlling this complex system.
This paper presents on-going esearch in robotic ispeciton of space platforms. Three main area of investigation are discussed: machine-vision inspection techniques, an integrated sensor end-effector, and an orbital environment laboratory simulation.
Projected images of a printed circuit board and the engineering drawing are superimposed on a screen for visual comparison. This technique speeds inspection and reduces the incidence of error.
Film-positioning device uses magnets to hold X ray film for weld inspection in nonferrous structures, such as tanks, where access to interior points is difficult.
Portable ultrasonic recording scanner is used for nondestructive inspection of welds. It is adaptable to continuous operation in one direction while maintaining oscillatory motion at a right angle to this direction. The scanning speed and oscillation frequency are independently adjustable.
Hot cell complex inspection and testing to assure radiation shielding requirements
Two-stage chain sampling inspection plans with different sample sizes in stages
Two-stage chain sampling inspection plans
Americium 241 serves as a suitable radioisotope /gamma ray source/ and exposure probe for radiographic inspection of brazed aluminum joints in areas of limited accessibility. The powdered isotope is contained in a sealed capsule mounted at the end of a spring-loaded pushrod in the probe assembly.
Thin-walled neoprene containers prevent secondary radiation, scatter, and undercut during radiographic inspection. The containers are filled with a mixture of barium sulfate, red lead, and petroleum jelly that achieves the required absorption rate.
Report details the test and inspection procedures for the mass production of high reliability integrated circuits. It covers configuration control, basic fundamentals of quality control, control charts, wafer process evaluation, general process evaluation, evaluation score system, and diffusion evaluation.
Mechanized X ray equipment provides nondestructive inspection of structural weldments at various positions on very large tanks. It mechanizes the placement of the film, automates the identification process, adheres to safety requirements, and eliminates all the usual time-consuming manual operations in industrial radiography.
Human observations of curvature after-effects as function of magnitude of curvature of inspected material
Tests and inspection procedures for process control of integrated circuits
Electron multiplier, incorporated into the camera tube of an ultrasonic imaging system, improves resolution, effectively shields low level circuits, and provides a high level signal input to the television camera. It is effective for inspection of metallic materials for bonds, voids, and homogeneity.
Investigation of parallel gap soldering of electrical leads resulted in recommendation on material preparation, equipment, process control, and visual inspection criteria to ensure reliable solder joints. The recommendations will minimize problems in heat-dwell time, amount of solder, bridging conductors, and damage of circuitry.
External visual inspection criteria for semiconductor devices