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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17

All sources NASA NTRS DOE OSTI

NASA NTRS1975

Earth resources technology system standalone software package: Description and user's guide

A user's guide and program description for the ERTS-B Stand-Alone Software Package is presented. This package was developed to compute the Keplerian elements at the descending node, the Brouwer mean elements at the node, the averaged Brouwer Mean Elements, and other orbital parameters for the orbits of the Earth Resources Technology Satellite (ERTS). The typical input for the program is an ephemeris file which resulted from a definitive orbit generated over a two day arc using the Cowell option in the Definitive Orbit Determination System (DODS) or the Goddard Trajectory Determination System (GTDS).

Chu, W. W.↗

NASA NTRS1979

A parameter-estimation subroutine package

Estimation subroutine package comprises fast, efficient, and simple least-squares data-processing algorithms for use in orbit determination and related analyses. Very reliable and general algorithms have been documented. Package contains collection of streamlined subroutines that can be used to solve large variety of parameter-estimation and filtering problems. Special routines are included for problems with colored process noise and covariance (factor) mapping.

Bierman, G.↗

NASA NTRS1977

Standard high-reliability integrated circuit logic packaging

A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

Slaughter, D. W.↗

NASA NTRS1977

Microelectronics/electronic packaging potential

The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.

Sandeau, R. F.↗

NASA NTRS1977

Investigation of package sealing using organic adhesives

A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.

Perkins, K. L.↗

NASA NTRS1977

The LARSYS Educational Package: Instructor's Notes for Use with the Data 100

The LARSYS Educational Package is a set of instructional materials developed to train people to analyze remotely sensed multispectral data using LARSYS, a computer software system. The materials included in this volume have been designed to assist LARSYS instructors as they guide students through the LARSYS Educational Package. All of the materials have been updated from the previous version to reflect the use of a Data 100 Remote Terminal.

Lindenlaub, J. C.↗

NASA NTRS1979

DAM package version 7807: Software fixes and enhancements

The Detection and Mapping package is an integrated set of manual procedures, computer programs, and graphic devices designed for efficient production of precisely registered, formatted, and interpreted maps from digital LANDSAT multispectral scanner data. This report documents changes to the DAM package in support of its use by the Corps of Engineers for inventorying impounded surface water. Although these changes are presented in terms of their application to detecting and mapping surface water, they are equally relevant to other land surface materials.

Schlosser, E.↗

NASA NTRS1979

A subroutine package for discrete estimation problems

In this paper we describe a well documented, compactly coded, storage efficient, thoroughly tested, and easy to use set of FORTRAN IV subroutines for use in Kalman filter or least-squares applications. The package contains both the UDU covariance factorization and the square root information filter algorithms developed at the Jet Propulsion Laboratory. Numerical reliability of the algorithms is a key feature of the package.

Bierman, G. J.↗

NASA NTRS1981

Solar water heater design package

Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

Source record↗

NASA NTRS1980

Life and stability testing of packaged low-cost energy storage materials

Thermal cycling and performance tests, performed to verify the package integrity, life, and stability of the chub packaged materials system for storage coolness with application to residential air conditioning, are described. The moisture vapor retention characteristics of the laminate film for long term chub performance was determined. The stability, mechanical integrity, and thermal performance of chubs following mechanical shock, vibration, and temperature extremes is reported.

Frysinger, G. R.↗

NASA NTRS1983

Plastic-Sealed Hybrid Power Circuit Package

Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

Miller, W. N.↗

NASA NTRS1981

Weight estimates and packaging techniques for the microwave radiometer spacecraft

Estimates of total spacecraft weight and packaging options were made for three conceptual designs of a microwave radiometer spacecraft. Erectable structures were found to be slightly lighter than deployable structures but could be packaged in one-tenth the volume. The tension rim concept, an unconventional design approach, was found to be the lightest and transportable to orbit in the least number of shuttle flights.

Jensen, J. K.↗

NASA NTRS1983

Low-Cost Alternatives in Hybrid Microcircuit Packaging

Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.

Caruso, S. V.↗

NASA NTRS1983

Security Package for the VAX

Four programs deal with intruders and resource managment. Package available from COSMIC provides DEC VAX-11/780 with certain "deterent" security features. Although packages is not comprehensive security system, of interest for any VAX installation where security is concern.

Marks, V. J.↗

NASA NTRS1982

Technical support package: Large, easily deployable structures. NASA Tech Briefs, Fall 1982, volume 7, no. 1

Design and test data for packaging, deploying, and assembling structures for near term space platform systems, were provided by testing light type hardware in the Neutral Buoyancy Simulator. An optimum or near optimum structural configuration for varying degrees of deployment utilizing different levels of EVA and RMS was achieved. The design of joints and connectors and their lock/release mechanisms were refined to improve performance and operational convenience. The incorporation of utilities into structural modules to determine their effects on packaging and deployment was evaluated. By simulation tests, data was obtained for stowage, deployment, and assembly of the final structural system design to determine construction timelines, and evaluate system functioning and techniques.

Source record↗

NASA NTRS1983

STS-3/OSS-1 Plasma Diagnostics Package (PDP) measurements of the temperature pressure and plasma

Designed to withstand the thermal extremes of the STS-3 mission through the use of heaters and thermal blankets, the plasma diagnostics package sat on the release/engagement mechanism on the OSS-1 payload pallet without a coldplate and was attached to the RMS for two extended periods. Plots show temperature versus mission elapsed time for two temperature sensors. Pressure in the range of 10 to the -3 power torr and 10 to the -7 power torr, measured 3 inches from the skin of the package is plotted against GMT during the mission. The most distinctive feature of the pressure profile is the modulation at the obit period. It was found that pressure peaks when the atmospheric gas is rammed into the cargo bay. Electric and magnetic noise spectra and time variability due to orbiter systems, UHF and S-band transmitter field strengths, and measurements of the ion spectra obtained both in the cargo bay and during experiments are plotted.

Shawhan, S. D.↗

NASA NTRS1984

Canadian Attitude Sensing Experimental Package (CASEP)

The Canadian Attitude Sensing Experiment Package (CASEP) was designed to demonstrate and verify the operation of an attitude sensing subsystem prior to committing its use on an operational mission. Data telemetry/recording requirements, power and physical requirements, and mission requirements of the experiment package are defined.

Reynaud, A. H.↗

NASA NTRS1984

Monolithic microwave integrated circuits: Interconnections and packaging considerations

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Bhasin, K. B.↗