Packaging the LEM rendezvous radar and transponder.
Packaging technique for producing rendezvous radar and transponder noting structural design, reliability, cooling, outgassing, humidity, etc
SPACECRAFT INSTRUMENTATION↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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A study of electronic packages, environmental control systems and vehicle thermal systems integration Quarterly report, Aug. - Oct. 1966
Electronic package environmental control systems and vehicle thermal systems integration for space missions to 180 days duration
CONTROL SYSTEM↗
Industrial survey of electronic packaging
Electronic packaging, integrated circuits, circuit design, and microcircuit design - survey with bibliography
INTEGRATED CIRCUIT↗
Development of the fabrication and packaging techniques for the Echo II SATELLITE
Design, fabrication, packaging, and test methods used in Echo II satellite
SATELLITE DESIGN↗
Packaging flat-packs for spacecraft applications
Packaging methods for electronic components encased in flat pack geometries, and spacecraft applications of proposed methods
ELECTRONIC PACKAGING↗
Microelectronic packaging
Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
THIN FILM↗
A study of electronic packages environmental control systems and vehicle thermal systems integration. Appendix - Thermal analysis data, part I Final report
Thermal analysis data plots for heat loads of electronic packages, environmental control systems, and vehicle thermal systems
TEMPERATURE EFFECT↗
Packaging and preservation of space-vehicle hardware Final report, 9 Jun. 1966 - 8 Jun. 1967
Packaging and preservation of space vehicle hardware
PRESERVATION↗
A study of electronic packages environmental control systems and vehicle thermal systems integration. Appendix - Thermal analysis data, part II Final report
Electronic packages, environmental control systems, and spacecraft thermal systems integration - thermal analysis data
ELECTRONIC PACKAGING↗
Voyager capsule, preliminary design, phase B. Volume IV - Entry science package. Section II - Preliminary design for OSE FINAL report
Operational support equipment preliminary design for entry science package portion of Voyager flight capsule system
GROUND SUPPORT EQUIPMENT↗
Voyager capsule, preliminary design, phase B. Volume IV - Entry science package. Section V - Interfaces Final report
Hardware, software, and service interfaces between capsule bus, entry science package, and Voyager spacecraft
SPACE CAPSULE↗
Reliability through packaging design.
Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles
COOLING SYSTEM↗
Thermal considerations for electronics packaging of the Nimbus spacecraft control system.
Thermal design of electronic packaging of Nimbus satellite control system
THERMAL PROTECTION↗
Plasma-sprayed dielectric coatings for heat sinks in electronic packaging.
Plasma sprayed alumina and beryllia dielectric coatings for heat sinks in electronic packaging, emphasizing heat dissipation from heat/generating components
ELECTRONIC PACKAGING↗
Methods of measuring slough characteristics of clean packaging materials.
Slough characteristics measuring methods for clean packaging materials, considering Taber-Abraser, tumble-box and reciprocating-stylus method
PACKAGING↗
MEMS Packaging for Biomedical Applications
MEMS packaging for biomedical applications can be achieved in several ways.
MEMS Packaging Teflon Encapsulation↗
Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
COTS MEMS packaging interconnections reliability↗
Chip Scale Package Joint Integrity of CSP under Isothermal Aging
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Chip Scale Packages (CSPs) Microtype BGA SEM↗