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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

Cyclic Fatigue Durability of Uncoated and EBC Coated 3D SiC/SiC Composites Under Thermal Gradient Conditions at 2700F in Air

Ceramic matrix composites (CMCs) such as SiCSiC are currently being designed and implemented in high temperature sections of aerospace turbine engines. Such components will be subject to through-thickness thermal gradients, which may affect the durability. In this study, SiCSiC CMCs with a hybrid chemical vapor infiltrated (CVI) and polymer infiltration and pyrolysis (PIP) matrix were loaded in tension while one surface was heated with a laser and the opposite surface was cooled. The samples were each coated with an environmental barrier coating (EBC), which was produced by electron beam physical deposition (EBPVD). Results for CMCs tested with and without the EBC be discussed.

Ceramic matrix composite↗

Re-Tooling the Agency's Engineering Predictive Practices for Durability and Damage Tolerance

Over the past decade, the Agency has placed less emphasis on testing and has increasingly relied on computational methods to assess durability and damage tolerance (D&DT) behavior when evaluating design margins for fracture-critical components. With increased emphasis on computational D&DT methods as the standard practice, it is paramount that capabilities of these methods are understood, the methods are used within their technical limits, and validation by well-designed tests confirms understanding. The D&DT performance of a component is highly dependent on parameters in the neighborhood of the damage. This report discusses D&DT method vulnerabilities.

Piascik, Robert S.↗

Environmental Barrier Coating Fracture, Fatigue and High-Heat-Flux Durability Modeling and Stochastic Progressive Damage Simulation

Advanced environmental barrier coatings will play an increasingly important role in future gas turbine engines because of their ability to protect emerging light-weight SiC/SiC ceramic matrix composite (CMC) engine components, further raising engine operating temperatures and performance. Because the environmental barrier coating systems are critical to the performance, reliability and durability of these hot-section ceramic engine components, a prime-reliant coating system along with established life design methodology are required for the hot-section ceramic component insertion into engine service. In this paper, we have first summarized some observations of high temperature, high-heat-flux environmental degradation and failure mechanisms of environmental barrier coating systems in laboratory simulated engine environment tests. In particular, the coating surface cracking morphologies and associated subsequent delamination mechanisms under the engine level high-heat-flux, combustion steam, and mechanical creep and fatigue loading conditions will be discussed. The EBC compostion and archtechture improvements based on advanced high heat flux environmental testing, and the modeling advances based on the integrated Finite Element Analysis Micromechanics Analysis Code/Ceramics Analysis and Reliability Evaluation of Structures (FEAMAC/CARES) program will also be highlighted. The stochastic progressive damage simulation successfully predicts mud flat damage pattern in EBCs on coated 3-D specimens, and a 2-D model of through-the-thickness cross-section. A 2-parameter Weibull distribution was assumed in characterizing the coating layer stochastic strength response and the formation of damage was therefore modeled. The damage initiation and coalescence into progressively smaller mudflat crack cells was demonstrated. A coating life prediction framework may be realized by examining the surface crack initiation and delamination propagation in conjunction with environmental degradation under high-heat-flux and environment load test conditions.

Mechanical creep and fatigue loading condition↗

Performance and Durability of Advanced Environmental Barrier Coating Systems

This paper summarizes recent NASA environmental barrier coating (EBC) material advances for protecting the SiC/SiC Ceramic Matrix Composites (CMCs) for meeting next generation turbine engine performance requirements. We particularly present an advanced multicomponent rare earth silicate EBCs with HfO2-Si bond coat system, the temperature capability, environmental stability, and thermomechanical durability, advanced laboratory testing toward subelement demonstrations. Fundamental coating properties of the coating system will also be discussed, with the emphasis on the coating diffusion barrier performance and Calcium Magnesium Alumino-Silicate (CMAS) resistance.

Zhu, Dongming↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗

Durability of Polymers in the Space Environment

Spacecraft in low Earth orbit (LEO) are subjected to harsh environmental conditions, including radiation (cosmic rays, ultraviolet, x-ray, and charged particle radiation), micrometeoroids and orbital debris, temperature extremes, thermal cycling, and atomic oxygen (AO). These environmental exposures can result in erosion, embrittlement and optical property degradation, threatening spacecraft performance and durability. While all of these environmental exposures can cause degradation to spacecraft components, AO is a particularly serious structural, thermal, and optical threat, to exterior oxidizable spacecraft materials, such as polymers. To further our understanding of AO erosion and radiation embrittlement of spacecraft materials, NASA Glenn Research Center has developed and flown a series of experiments as part of the Materials International Space Station Experiment (MISSE) missions on the exterior of the International Space Station (ISS). In continuing these studies, three new Glenn experiments have accepted for flight on the new ISS MISSE-Flight Facility (MISSE-FF). The Polymers and Composites Experiment (PCE) is being flown as part of the MISSE-9 inaugural mission of MISSE-FF. The Polymers and Composites Experiment-2 (PCE-2) and Polymers and Composites-3 Experiment (PCE-3) are being flown as part of the MISSE-10 and MISSE-12 missions, respectively. This presentation provides an overview of the Glenn's three MISSE-FF flight experiments including the objectives and initial spaceflight results.

spaceflight↗

Durability Characterization of Mechanical Interfaces in Solar Sail Membrane Structures

The construction of a solar sail from commercially available metallized film presents several challenges. The solar sail membrane is made by seaming together strips of metallized polymer film. This requires seaming together a preselected width and thickness of a base material into the required geometry, and folding the assembled sail membranes into a small stowage volume prior to launch. The sail membranes must have additional features for connecting to rigid structural elements (e.g., sail booms) and must be electrically grounded to the spacecraft bus to prevent charge build up. Space durability of the material and mechanical interfaces of the sail membrane assemblies will be critical for the success of any solar sail mission. In this study, interfaces of polymer/metal joints in a representative solar sail membrane assembly were tested to ensure that the adhesive interfaces and the fastening grommets could withstand the temperature range and expected loads required for mission success. Various adhesion methods, such as surface treatment, commercial adhesives, and fastening systems, were experimentally evaluated and will be discussed.

Interface↗

Next Generation Durability and Damage Tolerance to Support Certification of Flight Hardware

Durability and Damage Tolerance (D&DT), as currently applied to flight hardware throughout the Agency, is based on continuum and similitude assumptions and does not consider local material properties, environments and responses. These limitations impact our ability to support certification of new component designs, material systems and manufacturing approaches. The primary concern in this Engineering R&A plan is related to the imminent proliferation of parts produced by additive manufacturing (AM). These parts are being advocated by NASA’s suppliers for use on a myriad of flight hardware because of their design flexibility and cost advantages. AM provides opportunities to reduce part counts through complex geometry and reduce manufacturing costs of low volume parts. However, AM materials have some notable metallurgical and microstructural differences compared to traditionally fabricated materials. One of the challenges for the acceptance of AM is the greater tendency for a deleterious defect state, most commonly in the form of porosity, to exist in AM parts. Though this defect state is typically reduced through a hot isostatic pressing (HIP) processing step, the structural performance risks associated with the remaining defects and HIP-healed features is not known. Potential fracture control issues that must be resolved stem from the real possibility that an unhealed defect or a closed defect with less than pristine strength remains at a fracture critical location after HIP. As a result, NASA and the entire aerospace community have been confronted with the need to develop a robust and relevant certification methodology to enable safe implementation of these components. The present work is an important step toward positioning NASA to credibly respond to vendors’ push to implement this new AM materials technology by improving our understanding of AM processing and performance and transitioning that research-based understanding to next-generation engineering capabilities.

Edward H Glaessgen↗

Progressing -190 °C to +500 °C Durable SiC JFET ICs From MSI to LSI

This invited paper describes prototype SiC JFET integrated circuit (IC) and packaging technology that has produced arguably the most harsh-environment durable electronics ever demonstrated. Prototype medium-scale integration (MSI) ICs fabricated by NASA Glenn Research Center have successfully operated for over 1 year in 500 °C air-ambient, over 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, from -190 °C to +812 °C, and radiation exposure through 7 MRad(Si) total ionizing dose and 86 MeV-cm2/mg heavy ion strikes. Recent on-going work focused on upscaling this “go anywhere” IC capability from MSI to large-scale integration (LSI) prototype via benchmark memory ICs is described.

Integrated Circuits↗

Integration of Fatigue R-Curve Effects into VCCT for Durability Predictions, Part 1: Buckled Composite Single-Stringer Stiffened Panels

Composite structures have become popular in modern aircraft because they help reduce weight and increase durability. In addition, hat-stiffened panels provide the stability that the airframe skin needs. However, they can be subject to delamination in the post-buckling regime. Progressive damage analysis (PDA) methods can help predict interlaminar and intralaminar failure events. Many aircraft structures are subject to cyclic loading in the post-buckling regime. Hence, fatigue life prediction becomes essential for design and sustainment purposes. Under the NASA Advanced Composites Project (ACP), composite panels stiffened with single hat-stringers were subject to a cyclic loading sequence from a pre-buckling state to a post-buckling state. This test campaign aimed to provide damage initiation and growth data for three initial damage scenarios: nominally pristine, initial Teflon inserts representing manufacturing defects, and impact-induced damage. This work uses the Abaqus FEA Virtual Crack Closure Technique (VCCT), capabilities enhanced through a novel empirical method integrating fatigue R-curve effects (different from R-ratio) into the Paris Law via user-defined subroutine to simulate the fatigue response of the panels with single hat-stringers. The analysis predictions were within 5% of the test results using this novel method.

single hat↗

Integration of Fatigue R-Curve Effects into VCCT for Durability Predictions, Part 2: Buckled Composite Multi-Stringer Stiffened Panels

Composite structures with hat-stiffened panels have gained traction in modern aircraft because they help reduce weight, increase durability, and provide stability to airframe skins. For weight reduction, skins should be designed to operate in the post-buckling regime. This causes possible interlaminar and intralaminar failure. However, composite panels stiffened with multiple hat-stringers are subject to cyclic loading even in the post-buckling regime. Under the NASA Advanced Composites Project (ACP), composite panels with multiple hatstringers were subject to a cyclic loading sequence from a pre-buckling state to a post-buckling state. This effort aimed to predict interlaminar failure for cyclic compression loading with pre-existent impact-induced damage. This work uses the Abaqus FEA Virtual Crack Closure Technique (VCCT), capabilities enhanced through an empirical method to integrate fatigue R-curve effects (different from R-ratio) into the Paris Law via user-defined subroutine to simulate the fatigue response o

ACP↗

Effects of Cooling Holes on SiC/SiC Strength and Durability

Ceramic Matrix Composites (CMCs) such as SiC/SiC are currently operating in select high temperature components of turbine engines. When these materials are implemented in components at higher operating temperatures, film cooling may be necessary. Film cooling requires holes to be fabricated at appropriate locations within these components. This study examines the effect of cooling holes on SiC/SiC composite strength and durability. Mechanical test data on specimens with multiple holes is reported for isothermal conditions at room and elevated temperatures. Tools such as Digital Image Correlation (DIC) and Acoustic Emission (AE) are used to monitor strain and cracking upon loading.

Ceramic matrix composite↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Metal Contact Processing Experiments Towards Realizing 500 °C Durable RF 4H-SiC BJTs

This paper presents results from metal contact processing experiments towards the implementationof durable 500 deg.C high-frequency 4H-SiC bipolar junction transistors (BJTs). Specifically, p-type ohmic contacts have been demonstrated on a 0.25 μm-thick p-type homoepitaxial layer of doping 8 x 1018± 4 x 1018cm-3. Finally, preliminary current-voltage characteristics of fabricated BJTs are presented.

RF SiC↗

Metal Contact Processing Experiments Towards Realizing 500 °C Durable RF 4H-SiC BJTs

This paper presents results from metal contact processing experiments towards the implementation of durable 500 °C high-frequency 4H-SiC bipolar junction transistors (BJTs) . Specifically, p -type ohmic contacts have been demonstrated on a 0.25 μm-thick p -type homoepitaxial layer of doping 8 x 10 18 ± 4 x 10 18 cm -3 . Preliminary current-voltage characteristics of fabricated BJTs are presented.

4H-SiC BJT↗