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1,183 records · Page 18

A Simplified Model of VIPER Thermal Management System. Part II: Integrated Vehicle

NASA’s Volatiles Investigating Polar Exploration Rover (VIPER) thermal management system (TMS) relies on four loop heat pipes (LHPs) to transport electronic waste heat to the vehicle cooling radiative surface and avoid overheating. The TMS has also ten constant conductance heat pipes (CCHPs) dedicated to balance the thermal load within the internal environment where the avionics boxes are mounted, also called warm electronic box (WEB), and to transport the heat from two of the science payload instruments. The TMS also uses two thermal straps to thermally link the batteries to the WEB. These thermal components, in addition to heaters, thermostat, multi-layer insulation (MLIs), and isolators forms the core of the VIPER TMS. The complex heat transport balance managed by the TMS is challenging to characterize and model. The more fidelity and granularity of a model, the more costly the computational resources needed and the longer the simulation and modeling time. When the priority is to provide quick but reliable assessments of the thermal performance or real time thermal feedback for training of console operators, simplified modeling tools are needed. To satisfy that need, this paper describes the effort to develop and correlate a model of VIPER TMS based on control volume approach. The correlation effort in particular focuses on hibernation, cold thermal balance, and hot thermal balance data from the integrated vehicle thermal vacuum (TVAC) test. Thus, the correlated model captures the heat leaks during hibernations and the performance at two extremes, bounding, operating scenarios.

Thermal Modeling

In-Space Laser Forming Simulated Under Thermal Vacuum (TVAC) Conditions

NASA Marshall Space Flight Center is investigating laser forming under thermal vacuum conditions representative of the space environment through a partnership with the DARPA NOM4D program. The thermal gradient mechanism (TGM) is used to bend a metal sheet towards the laser optics. Laser equipment and process parameters are being optimized for thermal vacuum conditions. Such conditions are representative of the extreme cold and hot temperatures and high vacuum that exist on orbit or on the lunar surface. in situ photogrammetry and thermography assess the bend/counterbend and elucidate the TGM in thermal vacuum. Structured light scanning and metallography after bending reveal the macroscopic and microscopic structure after TGM.

thermal vacuum

Direct Visualization of Defect‐Controlled Diffusion in van der Waals Gaps

Abstract Diffusion processes govern fundamental phenomena such as phase transformations, doping, and intercalation in van der Waals (vdW) bonded materials. Here, the diffusion dynamics of W atoms by visualizing the motion of individual atoms at three different vdW interfaces: hexagonal boron nitride (BN)/vacuum, BN/BN, and BN/WSe 2 , by recording scanning transmission electron microscopy movies is quantified. Supported by density functional theory (DFT) calculations, it is inferred that in all cases diffusion is governed by intermittent trapping at electron beam‐generated defect sites. This leads to diffusion properties that depend strongly on the number of defects. These results suggest that diffusion and intercalation processes in vdW materials are highly tunable and sensitive to crystal quality. The demonstration of imaging, with high spatial and temporal resolution, of layers and individual atoms inside vdW heterostructures offers possibilities for direct visualization of diffusion and atomic interactions, as well as for experiments exploring atomic structures, their in situ modification, and electrical property measurements of active devices combined with atomic resolution imaging.

Chemistry

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

xEMU

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

thermal analysis

Power and Propulsion Element Steerable High Gain Antenna Lunar Transit Thermal Analysis Tracking Methodology

The Power and Propulsion Element (PPE) is an ion thruster propulsion spacecraft developed as an element of Space Reactor (SR-1) Freedom to provide propulsion, communications and power for the spacecraft. PPE was originally being developed for the use with the lunar orbiting space station Gateway as one of the first two planned elements. PPE was to be launched with the Habitation and Logistics Outpost (HALO) element in a configuration called the Co-Manifested Vehicle (CMV) that would arrive at a Near-Rectilinear Halo Orbit (NRHO) around the Moon via a lunar transit spiral trajectory phase. The PPE communication system is equipped with two Steerable High Gain Antennas (SHGA) each steered by a two-axis gimbal (TAG) mechanism. A thermal analysis was conducted during the near-Earth spiral phase of the mission using Thermal Desktop (TD). This analysis utilized multiple axis Earth tracking articulators in combination with SINDA system internal environmental heating symbols to produce accurate Earth ground station tracking communication system temperatures. This presentation provides an overview of the communication system thermal model and the analysis methodology.

Thermal Analysis

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography

Synthesis of Ultra‐Incompressible and Recoverable Carbon Nitrides Featuring CN 4 Tetrahedra

Abstract Carbon nitrides featuring three‐dimensional frameworks of CN 4 tetrahedra are one of the great aspirations of materials science, expected to have a hardness greater than or comparable to diamond. After more than three decades of efforts to synthesize them, no unambiguous evidence of their existence has been delivered. Here, the high‐pressure high‐temperature synthesis of three carbon–nitrogen compounds,tI14‐C 3 N 4 ,hP126‐C 3 N 4 , andtI24‐CN 2 , in laser‐heated diamond anvil cells, is reported. Their structures are solved and refined using synchrotron single‐crystal X‐ray diffraction. Physical properties investigations show that these strongly covalently bonded materials, ultra‐incompressible and superhard, also possess high energy density, piezoelectric, and photoluminescence properties. The novel carbon nitrides are unique among high‐pressure materials, as being produced above 100 GPa they are recoverable in air at ambient conditions.

Chemistry

Method and apparatus for providing thermal wear leveling

Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

Roberts, David A.