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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

Improvements In Optically Stimulated Electron Emission

Optically stimulated electron emission (OSEE) used in inspection for contamination of critical bonding surfaces in solid rocket motors of Space Shuttle prior to formation of adhesive bonds on surfaces during manufacture and refurbishment. Fundamental OSEE inspection technique described in "Surface-Contamination Inspection Tool for Field Use" (MFS-25581) and "Detecting Contamination With Photoelectron Emission" (MFS-25619). OSEE measurement head easily portable, and measurement operation convenient and rapid, making it useful inspection technique in industrial environment. Reveals contamination in many situations in which other techniques do not work.

Yost, William T.↗
NASA NTRS2012

Progressive Damage Analysis of Bonded Composite Joints

The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented durable redundant joint. Both designs involve honeycomb sandwich structures with carbon/epoxy facesheets joined using adhesively bonded doublers.Progressive damage modeling allows for the prediction of the initiation and evolution of damage within a structure. For structures that include multiple material systems, such as the joint designs under consideration, the number of potential failure mechanisms that must be accounted for drastically increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, intraply matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The bonded joints were modeled using highly parametric, explicitly solved finite element models, with damage modeling implemented via custom user-written subroutines. Each ply was discretely meshed using three-dimensional solid elements. Layers of cohesive elements were included between each ply to account for the possibility of delaminations and were used to model the adhesive layers forming the joint. Good correlation with experimental results was achieved both in terms of load-displacement history and the predicted failure mechanism(s).

Leone, Frank A., Jr.↗
NASA NTRS1968

Etching of aluminum for bonding Patent

Etching aluminum alloys with aqueous solution containing sulfuric acid, hydrofluoric acid, and an alkali metal dischromate for adhesive bonding

Emde, W. D.↗
NASA NTRS2001

Thermal Characterization of Epoxy Adhesive by Hotfire Testing

This paper describes subscale solid-rocket motor hot-fire testing of epoxy adhesives in flame surface bondlines to evaluate heat-affected depth, char depth and ablation rate. Hot-fire testing is part of an adhesive down-selection program on the Space Shuttle Solid Rocket Motor Nozzle to provide additional confidence in the down-selected adhesives. The current nozzle structural adhesive bond system is being replaced due to obsolescence. Prior to hot-fire testing, adhesives were tested for chemical, physical and mechanical properties, which resulted in the selection of two potential replacement adhesives, Resin Technology Group's TIGA 321 and 3M's EC2615XLW. Hot-fire testing consisted of four forty-pound charge (FPC) motors fabricated in configurations that would allow side-by-side comparison testing of the candidate replacement adhesives with the current RSRM adhesives. Results of the FPC motor testing show that: 1) the phenolic char depths on radial bondlines is approximately the same and vary depending on the position in the blast tube regardless of which adhesive was used, 2) the replacement candidate adhesive char depths are equivalent to the char depths of the current adhesives, 3) the heat-affected depths of the candidate and current adhesives are equivalent, and 4) the ablation rates for both replacement adhesives were equivalent to the current adhesives.

Spomer, Ken A.↗
NASA NTRS2003

Fretting Fatigue of Gamma TiAl Studied

Gamma titanium-aluminum alloy (g-TiAl) is an attractive new material for aerospace applications because of its low density and high specific strength in comparison to currently used titanium and nickel-base alloys. Potential applications for this material are compressor and low-pressure turbine blades. These blades are fitted into either the compressor or turbine disks via a dovetail connection. The dovetail region experiences a complex stress state due to the alternating centrifugal force and the natural high-frequency vibration of the blade. Because of the dovetail configuration and the complex stress state, fretting is often a problem in this area. Furthermore, the local stress state becomes more complex when the influence of the metal-metal contact and the edge of the contact is evaluated. Titanium and titanium-based alloys in the clean state exhibit strong adhesive bonds when in contact with themselves and other materials (refs. 1 and 2). This adhesion causes heavy surface damage and high friction in practical cases. Although the wear produced by fretting may be mild, the reduction in fatigue life can be substantial. Thus, there is the potential for fretting problems with these TiAl applications. Since TiAl is an emerging material, there has been limited information about its fretting behavior.

Miyoshi, Kazuhisa↗
NASA NTRS2018

Robust Bonding Through Process Control

Process control has been proven to be the most reliable means of safeguarding the quality of adhesive bonds according to Federal Aviation Administration (FAA). A method for implementing process control for reduction in risk in a bonded joint fabrication process is demonstrated in this study using a selected bonding system. The stepwise method included risk analysis to identify defects with the highest impact and likelihood to occur, evaluation of various pre-bond surface analysis tools to monitor for the selected defects, and demonstration of the benefits of in-process monitoring utilizing threshold limits determined from bond performance tests. The bonded system selected for investigation was an aerospace carbon fiber epoxy composite substrate surface prepared with random orbital sanding using 180 grit aluminum oxide sand paper. A series of portable, pre-bond surface analysis tools were investigated for their ability to be used for in-line bond process control. Results and threshold limits are presented from roughness, ballistic water contact angle (WCA), color, gloss, and Fourier transform infrared spectroscopy (FTIR) surface analysis tools. Results demonstrated how in-process inspection methods can be used to ensure quality of a surface preparation for a selected bonding system. A framework is provided for implementation of bond process control for robust bonding.

Kutscha, Eileen O.↗
NASA NTRS1979

Fastening hardware to honeycomb panels

Adhesive bonding reduces likelihood of skin failure due to excessive forces or torques by utilizing an adhesive to honeycomb skin. Concept is useful in other applications of composites such as aircraft, automobiles, and home appliances.

Kenger, A.↗
NASA NTRS1992

Designing for time-dependent material response in spacecraft structures

To study the influence on overall deformations of the time-dependent constitutive properties of fiber-reinforced polymeric matrix composite materials being considered for use in orbiting precision segmented reflectors, simple sandwich beam models are developed. The beam models include layers representing the face sheets, the core, and the adhesive bonding of the face sheets to the core. A three-layer model lumps the adhesive layers with the face sheets or core, while a five-layer model considers the adhesive layers explicitly. The deformation response of the three-layer and five-layer sandwich beam models to a midspan point load is studied. This elementary loading leads to a simple analysis, and it is easy to create this loading in the laboratory. Using the correspondence principle of viscoelasticity, the models representing the elastic behavior of the two beams are transformed into time-dependent models. Representative cases of time-dependent material behavior for the facesheet material, the core material, and the adhesive are used to evaluate the influence of these constituents being time-dependent on the deformations of the beam. As an example of the results presented, if it assumed that, as a worst case, the polymer-dominated shear properties of the core behave as a Maxwell fluid such that under constant shear stress the shear strain increases by a factor of 10 in 20 years, then it is shown that the beam deflection increases by a factor of 1.4 during that time. In addition to quantitative conclusions, several assumptions are discussed which simplify the analyses for use with more complicated material models. Finally, it is shown that the simpler three-layer model suffices in many situations.

Hyer, M. W.↗
NASA NTRS2003

Surface Treatment

A simple surface treatment process is provided which offers a high performance surface for a variety of applications at low cost. This novel surface treatment, which is particularly useful for Ti-6Al-4V alloys, is achieved by forming oxides on the surface with a two-step chemical process and without mechanical abrasion. First, after solvent degreasing, sulfuric acid is used to generate a fresh titanium surface. Next, an alkaline perborate solution is used to form an oxide on the surface. This acid-followed-by-base treatment is cost effective and relatively safe to use in commercial applications. In addition, it is chromium-free, and has been successfully used with a sol-gel coating to afford a strong adhesive bond that exhibits excellent durability after the bonded specimens have been subjected to a harsh 72 hour water boil immersion. Phenylethynyl containing adhesives were used to evaluate this surface treatment with a novel coupling agent containing both trialkoxysilane and phenylethynyl groups. 8 Claims, 16 Drawing Sheets

Park, Cheol↗
NASA NTRS2015

Laser Surface Preparation of Epoxy Composites for Secondary Bonding: Optimization of Ablation Depth

Surface preparation has been identified as one of the most critical aspects of attaining predictable and reliable adhesive bonds. Energetic processes such as laser ablation or plasma treatment are amenable to automation and are easily monitored and adjusted for controlled surface preparation. A laser ablation process was developed to accurately remove a targeted depth of resin, approximately 0.1 to 20 micrometers, from a carbon fiber reinforced epoxy composite surface while simultaneously changing surface chemistry and creating micro-roughness. This work demonstrates the application of this process to prepare composite surfaces for bonding without exposing or damaging fibers on the surface. Composite panels were prepared in an autoclave and had a resin layer approximately 10 micrometers thick above the fiber reinforcement. These composite panels were laser surface treated using several conditions, fabricated into bonded panels and hygrothermally aged. Bond performance of aged, experimental specimens was compared with grit blast surface treated specimens using a modified double cantilever beam test that enabled accelerated saturation of the specimen with water. Comparison of bonded specimens will be used to determine how ablation depth may affect average fracture energies and failure modes.

Palmieri, Frank L.↗
NASA NTRS1984

The role of material properties in adhesion

When two solid surfaces are brought into contact strong adhesive bond forces can develop between the materials. The magnitude of the forces will depend upon the state of the surfaces, cleanliness and the fundamental properties of the two solids, both surface and bulk. Adhesion between solids is addressed from a theoretical consideration of the electronic nature of the surfaces and experimentally relating bond forces to the nature of the interface resulting from solid state contact. Surface properties correlated with adhesion include, atomic or molecular orientation, reconstruction and segregation as well as the chemistry of the surface specie. Where dissimilar solids are in contact the contribution of each is considered as is the role of their interactive chemistry on bond strength. Bulk properties examined include elastic and plastic behavior in the surficial regions, cohesive binding energies, crystal structure, crystallographic orientation and state. Materials examined with respect to interfacial adhesive interactions include metals, alloys, ceramics, polymers and diamond. They are reviewed both in single and polycrystalline form. The surfaces of the contacting solids are studied both in the atomic or molecularly clean state and in the presence of selected surface contaminants.

Buckley, D. H.↗
NASA NTRS2016

Fabricating with Crystalline Si to Improve Superconducting Detector Performance

We built and measured radio-frequency (RF) loss tangent, tan δ, evaluation structures using float-zone quality silicon-on-insulator (SOI) wafers with 5 μm thick device layers. Superconducting Nb components were fabricated on both sides of the SOI Si device layer. Our main goals were to develop a robust fabrication for using crystalline Si (c-Si) dielectric layers with superconducting Nb components in a wafer bonding process and to confirm that tan δ with c-Si dielectric layers was reduced at RF frequencies compared to devices fabricated with amorphous dielectrics, such as SiO2 and SixNy, where tan δ ~ 10(exp -3). Our primary test structure used a Nb coplanar waveguide (CPW) readout structure capacitively coupled to LC resonators, where the capacitors were defined as parallel-plate capacitors on both sides of a c-Si device layer using a wafer bonding process with benzocyclobutene (BCB) wafer bonding adhesive. Our control experiment, to determine the intrinsic tan δ in the SOI device layer without wafer bonding, also used Nb CPW readout coupled to LC resonators; however, the parallel-plate capacitors were fabricated on both sides of the Si device layer using a deep reactive ion etch (DRIE) to access the c-Si underside through the buried oxide and handle Si layers in the SOI wafers. We found that our wafer bonded devices demonstrated F· δ = (8 +/- 2) × 10(exp -5), where F is the filling fraction of two-level states (TLS). For the control experiment, F· δ = (2.0 +/- 0.6) × 10(exp -5), and we discuss what may be degrading the performance in the wafer bonded devices as compared to the control devices.

Beyer, A. D↗
NASA NTRS2016

Fabricating with Crystalline Si to Improve Superconducting Detector Performance

We built and measured radio-frequency (RF) loss tangent, tan d, evaluation structures using float-zone quality silicon-on-insulator (SOI) wafers with 5 µ m thick device layers. Superconducting Nb components were fabricated on both sides of the SOI Si device layer. Our main goals were to develop a robust fabrication for using crystalline Si (c-Si) dielectric layers with superconducting Nb components in a wafer bonding process and to confirm that tan d with c-Si dielectric layers was reduced at RF frequencies compared to devices fabricated with amorphous dielectrics, such as SiO2 and SixNy, where tan d ~ 10-3. Our primary test structure used a Nb coplanar waveguide (CPW) readout structure capacitively coupled to LC resonators, where the capacitors were defined as parallel-plate capacitors on both sides of a c-Si device layer using a wafer bonding process with benzocyclobutene (BCB) wafer bonding adhesive. Our control experiment, to determine the intrinsic tan d in the SOI device layer without wafer bonding, also used Nb CPW readout coupled to LC resonators; however, the parallel-plate capacitors were fabricated on both sides of the Si device layer using a deep reactive ion etch (DRIE) to access the c-Si underside through the buried oxide and handle Si layers in the SOI wafers. We found that our wafer bonded devices demonstrated F· d = (8 ± 2) × 10-5, where F is the filling fraction of two-level states (TLS). For the control experiment, F· d = (2.0 ± 0.6) × 10-5, and we discuss what may be degrading the performance in the wafer bonded devices as compared to the control devices.

Beyer, A D↗
NASA NTRS1985

Duplicating Curved Tile Surfaces for Pull Testing

Strength of adhesive bonds to fragile objects with complex shapes tested easily with vacuum chucks. In bond-strength test, contact surface of chuck pressed against matching surface of bonded tile. Vacuum line extending through fine bore in chuck creates vacuum at chuck-and-tile interface. Thus, when chuck pulled away, atmospheric pressure tends to push tile away with chuck. If adhesive resists predetermined pull exerted by chuck on tile, bond acceptable. Originally developed for vacuum chucks used on silica tiles attached to outer surface of Space Shuttle orbiter, used to custom-fabricate chuck for specific tile.

Sebenick, R. H.↗
NASA NTRS1999

Proceedings of the Second Annual Symposium for Nondestructive Evaluation of Bond Strength

Ultrasonics, microwaves, optically stimulated electron emission (OSEE), and computational chemistry approaches have shown relevance to bond strength determination. Nonlinear ultrasonic nondestructive evaluation methods, however, have shown the most effectiveness over other methods on adhesive bond analysis. Correlation to changes in higher order material properties due to microstructural changes using nonlinear ultrasonics has been shown related to bond strength. Nonlinear ultrasonic energy is an order of magnitude more sensitive than linear ultrasound to these material parameter changes and to acoustic velocity changes caused by the acoustoelastic effect when a bond is prestressed. Signal correlations between non-linear ultrasonic measurements and initialization of bond failures have been measured. This paper reviews bond strength research efforts presented by university and industry experts at the Second Annual Symposium for Nondestructive Evaluation of Bond Strength organized by the NDE Sciences Branch at NASA Langley in November 1998.

Roberts, Mark J.↗
NASA NTRS1980

Design, fabrication, test, and qualification and price analysis of third generation design solar cell modules

The Block 4 shingle type module makes it possible to apply a photovoltaic array to the sloping roof of a residential building by simply nailing the overlapping hexagon shaped shingles to the plywood roof sheathing. This third-generation shingle module design consists of nineteen series connected 100 mm diameter solar cells which are arranged in a closely packed hexagon configuration to provide in excess of 75 watts/sq m of exposed module area under standard operating conditions. The solar cells are individually bonded to the embossed underside of a 4.4 mm thick thermally tempered piece of glass. An experimental silicone pottant was used as the transparent bonding adhesive between the cells and glass. The semi-flexible portion of each shingle module is a composite laminate construction consisting of an outer layer of FLEXSEAL bonded to an inner core of closed cell polyethylene foam. Silaprene is used as the substrate laminating adhesive. The module design has satisfactorily survived qualification testing program which includes 50 thermal cycles between -40 and +90 C, a seven day temperature-humidity exposure test, and a wind resistance test.

Shepard, N. F.↗