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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Plasma etching of semiconductors is an essential process in the production of microchips which enable nearly every aspect of modern life. Two frequencies of applied voltage are often used to provide control of both the ion fluxes and energy distribution.
Electroless nickel resist is unaffected by caustic soda applied as a milling or etching agent on aluminum.
Electrolytic etching process prepares surfaces of a stainless steel shell for reliable, high strength adhesive bonding to dielectric materials. The process uses a 25 percent aqueous solution of phosphoric acid.
Four step photoresist process for etching thick aluminum layers for semiconductor device contacts produces uniform contact surfaces, eliminates bridging, minimizes undercutting, and may be used on various materials of any thickness.
Nucleate boiling heat transfer from mechanically polished, chemically etched stainless steel boiling plate
Etch-decoration technique of detecting vacancies in graphite has been used to determine the reaction rates of graphite with ozone in the directions parallel and perpendicular to the layer planes. It consists essentially of peeling single atom layers off graphite crystals without affecting the remainder of the crystal.
Cylindrical diodes with etched Re emitters, testing output power variation with voltage and efficiency variation over lifetime
Pool boiling data at atmospheric pressure for mechanically polished and chemically etched 304 stainless steel surfaces in contact with distilled water
Thermionic converter with fluorine vapor deposited tungsten emitter etched to expose crystal planes
Thin foil preparation technique for transmission electron microscopy and selected etch pitting technique for CoO single crystals
Germanium single crystals etching with water vapor and hydrogen sulfide in hydrogen flow system, studying concentration, pressure and temperature effects on surface reactions
Computer acquired performance map of etched-rhenium, niobium planar diode
Vibratory cavitation for metal and superalloy etching in distilled water
Etching aluminum alloys with aqueous solution containing sulfuric acid, hydrofluoric acid, and an alkali metal dischromate for adhesive bonding
Selective plating of etched circuits without removing previous plating
Computer processed performance data for thermionic converter with etched rhenium emitter and niobium collector
Metallographic specimens etching by cavitation damage, testing performance by ultrasonic vibration technique