Advanced Packaging
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X2000 Europa Orbiter Project Avionics Advanced Pac↗
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NASA's 3D Flight Computer for Space Applications
The New Millennium Program (NMP) Integrated Product Development Team (IPDT) for Microelectronics Systems was planning to validate a newly developed 3D Flight Computer system on its first deep-space flight, DS1, launched in October 1998. This computer, developed in the 1995-97 time frame, contains many new computer technologies previously never used in deep-space systems. They include: advanced 3D packaging architecture for future low-mass and low-volume avionics systems; high-density 3D packaged chip-stacks for both volatile and non-volatile mass memory: 400 Mbytes of local DRAM memory, and 128 Mbytes of Flash memory; high-bandwidth Peripheral Component Interface (Per) local-bus with a bridge to VME; high-bandwidth (20 Mbps) fiber-optic serial bus; and other attributes, such as standard support for Design for Testability (DFT). Even though this computer system did not complete on time for delivery to the DS1 project, it was an important development along a technology roadmap towards highly integrated and highly miniaturized avionics systems for deep-space applications. This continued technology development is now being performed by NASA's Deep Space System Development Program (also known as X2000) and within JPL's Center for Integrated Space Microsystems (CISM).
Alkalai, Leon↗
Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments
Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.
Ramesham, Rajeshuni↗
Preliminary design of the Shuttle-C avionics recovery system
The analysis done in developing a recovery system for the Shuttle-C cargo vehicle is presented. This recovery system is comprised of a reentry capsule which houses the vehicles avionics. The avionics are contained in a single package which is extracted from the capsule by the parachute recovery system. The Shuttle-C will be able to satisfy NASA's design and mission requirements. Included, is an analysis of the structural, thermal protection, and parachute recovery systems. A discussion of the merits of the proposed system is also included.
Brookfield, Morgan↗
Integrated Avionics System (IAS), integrating 3-D technology on a spacecraft panel
A novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes.
avionics 3-D technology↗
General-Purpose Ada Software Packages
Collection of subprograms brings to Ada many features from other programming languages. All generic packages designed to be easily instantiated for types declared in user's facility. Most packages have widespread applicability, although some oriented for avionics applications. All designed to facilitate writing new software in Ada. Written on IBM/AT personal computer running under PC DOS, v.3.1.
Klumpp, Allan R.↗
A Boundary Scan Test Vehicle for Direct Chip Attach Testing
To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.
Parsons, Heather A.↗
Advanced Packaging Technologies Used in NASA's 3D Space Flight Computer
During 1995-1997, NASA's New Millenium Program developed the 3D Space Flight Computer technology for validation on its first Deep-Space 1 mission launced in October 1998.
3D Packaging Technologies Flight Computer Avionics↗
Thermal energy management process experiment
The thermal energy management processes experiment (TEMP) will demonstrate that through the use of two-phase flow technology, thermal systems can be significantly enhanced by increasing heat transport capabilities at reduced power consumption while operating within narrow temperature limits. It has been noted that such phenomena as excess fluid puddling, priming, stratification, and surface tension effects all tend to mask the performance of two-phase flow systems in a 1-g field. The flight experiment approach would be to attack the experiment to an appropriate mounting surface with a 15 to 20 meter effective length and provide a heat input and output station in the form of heaters and a radiator. Using environmental data, the size, location, and orientation of the experiment can be optimized. The approach would be to provide a self-contained panel and mount it to the STEP through a frame. A small electronics package would be developed to interface with the STEP avionics for command and data handling. During the flight, heaters on the evaporator will be exercised to determine performance. Flight data will be evaluated against the ground tests to determine any anomalous behavior.
Ollendorf, S.↗
Digital avionics systems - Principles and practices (2nd revised and enlarged edition)
The state of the art in digital avionics systems is surveyed. The general topics addressed include: establishing avionics system requirements; avionics systems essentials in data bases, crew interfaces, and power; fault tolerance, maintainability, and reliability; architectures; packaging and fitting the system into the aircraft; hardware assessment and validation; software design, assessment, and validation; determining the costs of avionics.
Spitzer, Cary R.↗
Thermal cycling testing to failure of a ceramic column grid array package for space applications
Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.
Ramesham, Rajeshuni↗
Space-Shuttle Emulator Software
A package of software has been developed to execute a raw binary image of the space shuttle flight software for simulation of the computational effects of operation of space shuttle avionics. This software can be run on inexpensive computer workstations. Heretofore, it was necessary to use real flight computers to perform such tests and simulations. The package includes a program that emulates the space shuttle orbiter general- purpose computer [consisting of a central processing unit (CPU), input/output processor (IOP), master sequence controller, and buscontrol elements]; an emulator of the orbiter display electronics unit and models of the associated cathode-ray tubes, keyboards, and switch controls; computational models of the data-bus network; computational models of the multiplexer-demultiplexer components; an emulation of the pulse-code modulation master unit; an emulation of the payload data interleaver; a model of the master timing unit; a model of the mass memory unit; and a software component that ensures compatibility of telemetry and command services between the simulated space shuttle avionics and a mission control center. The software package is portable to several host platforms.
Arnold, Scott↗
Technology for future air transports
The requirements and opportunities for technological development in transport aircraft of the next generation are reviewed, focusing primarily on conventional, subsonic aircraft. Advances in computational aerodynamics and computer-aided design and manufacturing (in numerically controlled processes) are noted as well as improved wind tunnel testing and drag reduction techniques. Advances in aeroelasticity prediction have made it possible to use flexible, high-aspect-ratio wings without large weight penalties. Weight reduction may be achieved by the use of composite aircraft structures and superplastic forming combined with diffusion bonding, however composites require improvement in manufacturing techniques and mechanical properties in order to gain general acceptance. Propulsion systems can be improved in engine fuel efficiency, control, durability, environmental compatibility (exhaust and noise emissions), and fuel specifications. In avionics, due to the growth of low-cost, miniaturized packages, opportunities exist in the fields of digital controls, navigation, guidance and communication. Applications of new technologies to various aspects of flight safety are also outlined.
Klineberg, J. M.↗
A rubidium clock for SEEK-TALK
The development of a tactical rubidium frequency standard (TRFS) for the SEEK-TALK program is discussed. This effort, which is entering the prototype stage, is directed toward the establishment of a production capability for miniature rubidium clocks of medium stability capable of fast warmup and extreme ruggedness for military avionics applications. The overall unit consists of an ultraminiature physics package and four plug-in circuit boards inside a 2 1/2-inch square by 4-inch box. This size is achieved without the extensive use of hybrid microcircuitry, yet is believed to be the smallest atomic frequency standard yet developed.
Riley, W. J.↗
NAECON 87; Proceedings of the IEEE National Aerospace and Electronics Conference, Dayton, OH, May 18-22, 1987. Volumes 1, 2, 3, & 4
The present conference discusses topics in VLSI components and their packaging, signal processing, uses of cartographic data, data transmission, advanced avionics architectures, fiber-optics, information control and display, image processing, airborne radar and fire control, navigation, air data, Kalman filtering, power generation and control, spacecraft power structures, aircraft flying qualities, flight management, fault-tolerant computer architectures, actuation technologies, self-repairing flight control system technology, multivariable control, stability and control methods, and AFTI/F-16 flight test reports. Also discussed are the ADA/JOVIAL language and its applications, software acquisition and testing, advanced software concepts, software management, computer graphics and visual systems softwear, ADA in embedded avionics, 16- and 32-bit architectures, voice interaction applications, human/machine systems analysis, human factors and AI, mental workloads and displays, pilot acceleration protection research, communications system technology, space communications, reliability and maintainability, managerial techniques, engineering management, EM compatibility and nuclear hardening, expert systems, AI language/knowledge representation, expert system implementation, machine vision/optical processing, and advanced AI concepts and architectures.
Avionics↗
Pilot's manual for automated 4D guidance system
Operational procedures and modes of an experimental 4D guidance system are described from the pilot's point of view. The system consists of the experimental avionics equipment referred to as STOLAND and a specially developed software package for the STOLAND digital computer. A capture mode of the system provides arrival time control and automatic tracking of the 4D flight path from any feasible initial aircraft state to any waypoint. Precise arrival time at a waypoint is achieved by means of speed control or, if large delays are required, by path stretching. Continuous recomputation and display of the capture flight path prior to engaging the system permits the pilot to determine the exact moment for terminating a holding or path stretching maneuver in order to achieve a specified arrival time.
Erzberger, H.↗
Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel
As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.
Hunter, Don J.↗