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Recommendations on the Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions - Phase II

This assessment had two Phases. Phase I captured NASA Centers’ current practices for commercial-off-the-shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) parts 1 used in spaceflight systems and ground support equipment (available at https://ntrs.nasa.gov/citations/20205011579) [ref. 1]. The Phase II report provides guidance for selecting and using COTS parts in NASA missions. The approaches proposed in this report differ from current agency practices. This top-level executive summary touches on these new approaches for using COTS parts but does not provide the detailed information that is critical in understanding the rationale behind these new approaches. Readers will need to read the entire report to gain full understanding and effectively use the recommendations herein. NASA’s historical approach to selecting and applying parts has been to define certain parts, primarily specific classes of military specification (MIL-SPEC) parts, as “standard”, leaving all others, including COTS parts, as nonstandard. Standard parts typically are used without further testing (“use-as-is”). Nonstandard parts are subjected to initial screening and subsequent lot acceptance testing of representative samples from each procured lot per MIL-SPEC or similar requirements. Decades later, top-tier commercial part manufacturers have evolved significant manufacturing, statistical control, and technological improvements that can now provide parts as reliable or more reliable than MIL-SPEC parts, when used within their datasheet limits. Concurrently, the space science and exploration community’s needs demand technological advances unavailable with MIL-SPEC parts. This ongoing change necessitates using COTS parts for space missions. Properly selected COTS parts in appropriate applications can offer performance and supply availability advantages compared to MIL-SPEC parts. Their utility and demonstrated reliability result from large volumes and automated production and testing processes. However, careful review and a thorough understanding of their specifications (i.e., datasheet limitations) is needed, and verifying that manufacturer specifications and reliability meet space hardware application needs are necessary. This report recommends MIL-SPEC screening and non-radiation-related lot acceptance testing be reduced or eliminated in cases where evidence of sufficient quality and reliability exists for COTS parts. The extent of NASA's insight into COTS manufacturers and the amount and nature of the needed evidence will differ by mission and will likely be driven by a mission's resources and associated risk posture. To facilitate this goal, two new terminologies have been defined and described: “Industry Leading Parts Manufacturer (ILPM)” and “Established COTS parts.” An ILPM is a COTS manufacturer that produces high quality and reliable parts. Some parts produced by ILPMs, defined as Established COTS parts, do not need any additional MIL-SPEC or NASA screening and lot acceptance testing to be used in space applications. This report provides guidance for selecting, procuring, and applying COTS parts and for performing part-, board-, and system-level COTS parts verification. The recommendation to select Established COTS parts from ILPMs will assure those COTS parts will have comparable quality to corresponding MIL-SPEC parts. Selecting, applying, and verifying Established COTS parts from ILPMs requires a holistic team approach, engaging parts engineers, circuit designers, quality, reliability, and systems engineers, procurement specialists, radiation specialists, avionics leads, and program/project managers. A mission-specific approach tailored to a project’s Mission, Environment, Applications and Lifetime (MEAL) [ref. 2] requirements should be developed and approved by program/project managers. Any associated risks should be clearly identified, quantified, mitigated, and/or accepted. Different approaches are recommended according to program/project Risk Classes A, B, C, and D [ref. 3] and human-rated missions [ref. 4]: 1. Recommend Classes A and B and human-rated missions consider a “MIL-SPEC parts- based design” approach. ”MIL-SPEC parts-based design” approach is one in which most parts are MIL-SPEC parts and Established COTS parts from ILPMs are used only when an equivalent MIL-SPEC part does not meet functional or size, weight, and power (SWaP) or performance requirements, or is not available. 2. Recommend Classes D and Sub-D missions consider a “System of COTS” approach. “System of COTS” approach is one which most parts are Established COTS parts from ILPMs. 3. Recommend Class C missions determine which approach is the best for their projects; that is, use either a “MIL-SPEC parts-based design” approach, “System of COTS” approach, or a combined approach utilizing elements of both. This report intends to provide guidance in using COTS parts for NASA missions with risk classifications of A through D and human-rated missions; but it does not address the costs of using COTS parts. Costs of using COTS parts in different NASA mission classes can vary significantly even if the same parts are used in different risk postures, due to differing verification levels needed. The guidance does not distinguish between critical or non-critical systems, and a given project will need to apply the appropriate guidance based on their risk posture. The intended audience of this report are NASA personnel and commercial practitioners who support NASA’s spaceflight missions, including spaceflight program or project managers, parts engineers, parts manufacturers, radiation engineers, avionics engineers, system engineers, circuit design engineers, reliability engineers, safety and mission assurance (SMA) personnel, and parts procurement specialists. The NEPP Program will perform a pathfinder study to explore implementing the guidance in this NESC report. An ILPM verification process is not the same as conventional vendor qualification processes performed according to military standards and specifications. This NESC report intends to provide guidance in utilizing available parts data from ILPM manufacturers for parts assurance assessments needed for NASA missions. The report also captured the current practices from DoD and Federal Aviation Administration (FAA) in Section 10. Note each DoD and FAA report was provided by the corresponding agencies regarding their practices, which are independent from the NESC recommendations in the report.

Commercial-Off-The-Shelf

Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions

The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.

Commercial-Off-The-Shelf

Preliminary Radiation Analysis of the Total Ionizing Dose for the Resource Prospector Mission

NASA's Resource Prospector (RP) is a collaborative project between multiple centers and institutions to search for volatiles at the polar regions of the Moon as a potential resource for oxygen and propellant production. The mission is rated Class D and will be the first In-Situ Resource Utilization (ISRU) demonstration on the lunar surface and at the lunar poles. Given that this mission is rated Class D, the project is considering using commercial off the shelf (COTS) electronics parts to reduce cost. However, COTS parts can be more susceptible to space radiation than typical aerospace electronic parts and carry some additional risk. Thus, prior to parts selection, having a better understanding of the radiation environment can assist designers in the parts selection process. The focus of this paper is to provide a preliminary analysis of the radiation environment from launch, through landing on the surface, and some surface stay as an initial step in determining worst case mission doses to assist designers in screening out electronic parts that would not meet the potential dose levels experienced on this mission.

Rojdev, Kristina

Evaluation of Fast Switching Diode 1N4448 Over a Wide Temperature Range

Electronic parts used in the design of power systems geared for space applications are often exposed to extreme temperatures and thermal cycling. Limited data exist on the performance and reliability of commercial-off-the-shelf (COTS) electronic parts at temperatures beyond the manufacturers specified operating temperature range. This report summarizes preliminary results obtained on the evaluation of automotive-grade, fast switching diodes over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these diodes and to determine suitability for use outside their recommended temperature limits.

Thermal Cycling

Systems Engineering and Assurance Modeling (SEAM): A Web-Based Solution for Integrated Mission Assurance

We present an overview of the Systems Engineering and Assurance Modeling (SEAM) platform, a web-browser-based tool which is designed to help engineers evaluate the radiation vulnerabilities and develop an assurance approach for electronic parts in space systems. The SEAM framework consists of three interconnected modeling tools, a SysML compatible system description tool, a Goal Structuring Notation (GSN) visual argument tool, and Bayesian Net and Fault Tree extraction and export tools. The SysML and GSN sections also have a coverage check application that ensures that every radiation fault identified on the SysML side is also addressed in the assurance case in GSN. The SEAM platform works on space systems of any degree of radiation hardness but is especially helpful for assessing radiation performance in systems with commercial-off-the-shelf (COTS) electronic components.

SEAM

Cryogenically-Operable Electronics for Surviving the Lunar Night

Current solar-powered robotic lunar landers and rovers have not demonstrated survivability of the extreme cold temperatures seen during the 354-hour lunar night. To address this capability gap, we have been investigating the feasibility of a passive hibernation approach to enable low-cost solar- and battery-powered missions to operate over multiple lunar cycles. This strategy relies on isolating the batteries from the main bus during the lunar night and allowing cells to freeze as temperatures descend as low as 50K. The entire power architecture remains in a hibernation state with no electrical activity until lunar dawn. When the sun returns over the horizon, the now-illuminated solar arrays begin generating power. In order to manage the array power, architecture consisting of cryogenically-operable COTS electronics must be utilized. This architecture will distribute and control power to subsystems - importantly controlling heaters to bring the frozen lithium-ion battery cells to normal operating conditions. This alternative approach to lunar operations will enable low-cost commercial lunar landers and payloads to passively survive the night and continue to operate over multiple lunar cycles without a significant impact to cost or payload mass. Research last year focused on creating a power supply that was capable of operation at cryogenic temperatures. At the end of FY23, our team successfully designed and manufactured a Sequential Switching Shunt Regulator (S3R) that is operational in a cryogenic vacuum chamber. It is capable of full operation down to the coldest lunar night temperatures (~50K). Our presentation will provide an overview of the Lunar Hibernation strategy but will focus mainly on the technical details of this cryogenically-operable shunt regulator and test results.

Cryogenic

Low Temperature Reliability of Electronic Packages/Assemblies for Space Missions

A NASA-wide team, funded under the NASA Electronic Parts and Packaging Program (NEPP), was formed to collaborate and to establish reliability of various electronic parts/packaging and assemblies for operation under extreme cold temperatures. One of the primary objectives of the NEPP is to expedite the infusion of cutting edge technologies into the present and future NASA missions. Commercial-off-the-shelf (COTS) emerging electronic parts/packages due to their lower weight, increased functionality, and lower cost are excellent candidates for space missions if they are characterized to show that they will meet the stringent reliability and quality requirements. Characterizations, especially for the extreme cold temperatures, are required since very limited data are available by manufacturers or users. For severe military environments, the temperature conditions to -65 C are the lowest temperature for which these parts/packages and assemblies are qualified. New data beyond this relatively benign cold temperature are required for numerous NASA missions. Several parts/packages, based on the project recommendation for their immediate and future needs, were selected for detailed characterization to cold temperature regimes down to liquid nitrogen (-196 C), covering both Mars cold temperature (-125 C) and asteroid (- 180 C) lander environmental requirements. Numerous parts/packages and assemblies were characterized during extreme temperature environmental tests. Several electrical parameters were characterized at discrete temperatures to -185 C to determine if they remain within their specification ranges. Both packages and circuit boards were subjected to nondestructive testing including optical, X-ray, and acoustic microscopy to document their integrity prior to environment exposure. Package/board assemblies were also subjected to X-ray to characterize solder joint integrity including void levels. Both parts and assemblies were subjected to thermal cycling with a large temperature swing enveloping numerous NASA missions. Details of the performed tests and the results obtained are presented.

Patterson, Richard L.

NESC Assessment – Recommendations on Use of Commercial-Off-The-Shelf (COTS) Parts for NASA Missions

This is to present the NESC assessment "Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions" at the Microelectronics Reliability and Qualification Workshop hosted by Aerospace Corporation in February 8-10, 2022. The assessment has two Phases, Phase I on NASA Center current practices on use of COTS and Phase II on DoD and FAA current practices on use of COTS and NESC guidance on COTS selection, application and verification processes. Phase I report was published as NASA/TM−20205011579 and NESC-RP-19-01490 in December 2020. The presentation also includes the scope of the Phase II of the assessment, which is expected to be completed in March-April, 2022.

EEE parts

NASA PhonesSat Program Overview

A group of young engineers working at NASA have been trying to show that participating in real science and reaching space isnt as expensive or as difficult as commonly assumed. Our current mission: sending a phone into space.

3D printing

Evaluation of COTS SiGe, SOI, and Mixed Signal Electronic Parts for Extreme Temperature Use in NASA Missions

The NASA Electronic Parts and Packaging (NEPP) Program sponsors a task at the NASA Glenn Research Center titled "Reliability of SiGe, SOI, and Advanced Mixed Signal Devices for Cryogenic Space Missions." In this task COTS parts and flight-like are evaluated by determining their performance under extreme temperatures and thermal cycling. The results from the evaluations are published on the NEPP website and at professional conferences in order to disseminate information to mission planners and system designers. This presentation discusses the task and the 2010 highlights and technical results. Topics include extreme temperature operation of SiGe and SOI devices, all-silicon oscillators, a floating gate voltage reference, a MEMS oscillator, extreme temperature resistors and capacitors, and a high temperature silicon operational amplifier.

Patterson, Richard L.

Adaptation of the Camera Link Interface for Flight-Instrument Applications

COTS (commercial-off-the-shelf) hard ware using an industry-standard Camera Link interface is proposed to accomplish the task of designing, building, assembling, and testing electronics for an airborne spectrometer that would be low-cost, but sustain the required data speed and volume. The focal plane electronics were designed to support that hardware standard. Analysis was done to determine how these COTS electronics could be interfaced with space-qualified camera electronics. Interfaces available for spaceflight application do not support the industry standard Camera Link interface, but with careful design, COTS EGSE (electronics ground support equipment), including camera interfaces and camera simulators, can still be used.

Randall, David P.

Use of a Frequency Divider to Evaluate an SOI NAND Gate Device, Type CHT-7400, for Wide Temperature Applications

Frequency dividers constitute essential elements in designing phase-locked loop circuits and microwave systems. In addition, they are used in providing required clocking signals to microprocessors and can be utilized as digital counters. In some applications, particularly space missions, electronics are often exposed to extreme temperature conditions. Therefore, it is required that circuits designed for such applications incorporate electronic parts and devices that can tolerate and operate efficiently in harsh temperature environments. While present electronic circuits employ COTS (commercial-off- the-shelf) parts that necessitate and are supported with some form of thermal control systems to maintain adequate temperature for proper operation, it is highly desirable and beneficial if the thermal conditioning elements are eliminated. Amongst these benefits are: simpler system design, reduced weight and size, improved reliability, simpler maintenance, and reduced cost. Devices based on silicon-on-insulator (SOI) technology, which utilizes the addition of an insulation layer in the device structure to reduce leakage currents and to minimize parasitic junctions, are well suited for high temperatures due to reduced internal heating as compared to the conventional silicon devices, and less power consumption. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a divide-by-two frequency divider circuit built using COTS SOI logic gates was evaluated over a wide temperature range and thermal cycling to determine suitability for use in space exploration missions and terrestrial fields under extreme temperature conditions.

Patterson, Richard L.

To the Die Smartly: Heavy Ion Testing of PEMs on COTS Boards Through the Plastic

Seven commercial off the shelf (COTS) boards containing electronic devices (all in plastic packages, PEMS), under consideration for use in a spacecraft subsystem, were exposed to beams of very high energy ions at the National Superconducting Cyclotron Laboratory (MSU). The ion energies were high enough that an entire board could be exposed in air, and it could still penetrate through the plastic and reach the silicon die. A total of about 300 runs were made, and for each, the LET of the ion entering the silicon die had to be determined, based on the thickness of the plastic lid and the thickness of overlaying materials (e.g., aluminum degraders). Single event latchup (SEL) and functional interrupt (SEFI) were determined during each run, the SEFI by means of simple programs being continuously written to and read from the boards to monitor functionality, while each part was being exposed to the heavy ions.

Wert, J. L.

NASA’s Quiet Electric ENgines (QUEEN): Thermal Analysis and Testing of the Electronic Speed Controller (ESC)

An electric ducted fan system was tested at the NASA Glenn Research Center. Main components of the system include a commercial-off-the-Shelf (COTS) fan and motor, electronic speed controller, and cooling system. Motor speed, voltage, current, and temperatures were measured in this static ground test of the propulsor. The thermal performance of the Electronic Speed Controller (ESC) was also measured using two different methods to cool the ESC: air cooling and cold plate cooling. This propulsor prototype is one of NASA’s Quiet Electric ENgines (QUEENs) and is designated the ‘QUEEN V1.’ The Quiet Electric Engines are being developed for the 25% scale model of the Subsonic Single Aft Engine (SUSAN) Flight Research Vehicle and are intended to explore the potential of distributed electric propulsion for large regional single-aisle aircraft. Lessons learned will be used to guide development of future QUEEN prototypes and thermal management systems.

Firas G Asfoor

Different Approaches for Ensuring Performance/Reliability of Plastic Encapsulated Microcircuits (PEMs) in Space Applications

Engineers within the commercial and aerospace industries are using trade-off and risk analysis to aid in reducing spacecraft system cost while increasing performance and maintaining high reliability. In many cases, Commercial Off-The-Shelf (COTS) components, which include Plastic Encapsulated Microcircuits (PEMs), are candidate packaging technologies for spacecrafts due to their lower cost, lower weight and enhanced functionality. Establishing and implementing a parts program that effectively and reliably makes use of these potentially less reliable, but state-of-the-art devices, has become a significant portion of the job for the parts engineer. Assembling a reliable high performance electronic system, which includes COTS components, requires that the end user assume a risk. To minimize the risk involved, companies have developed methodologies by which they use accelerated stress testing to assess the product and reduce the risk involved to the total system. Currently, there are no industry standard procedures for accomplishing this risk mitigation. This paper will present the approaches for reducing the risk of using PEMs devices in space flight systems as developed by two independent Laboratories. The JPL procedure involves primarily a tailored screening with accelerated stress philosophy while the APL procedure is primarily, a lot qualification procedure. Both Laboratories successfully have reduced the risk of using the particular devices for their respective systems and mission requirements.

Gerke, R. David